Image Rejection Mixer Chip Size: 1600 1300 (100 mils) Chip Size T

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Image Rejection Mixer Chip Size: 1600 1300 (100 mils) Chip Size T

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AMMC-6550
Image Rejection Mixer
Chip Size: 1600 1300 (100 mils) Chip Size Tolerance: 10mm (±0.4 mils) Chip Thickness: 10mm mils) Dimensions: mils)
Description
AMMC-6550 broadband mixer, which used image rejection mixer (IRM), mixer. AMMC-6550 utilizes distributed passive mixers Lange coupler realized Avago unique gate length Enhancement mode PHEMT (E-PHEMT) technology. Although AMMC-6550 works resistive mixer, mixer biased with positive voltage (+0.4V Typ.). AMMC-6550 monolithic E-PHEMT image-rejection mixer designed commercial digital radios wireless LANs. mixer requires off-chip 90-degree hybrid achieve signal image rejection +0.4V (Typ.) bias.
Features
Wide frequency range: conversion loss: (Typ.) Image Rejection: (Typ.) High Input IP3: +20dBm Positive polarity Gate Drain Bias
Applications
Microwave Radio systems Satellite VSAT, Up/Down Link LMDS Pt-Pt Long Haul Broadband Wireless Access (including 802.16 802.20 WiMax) MMDS loops Commercial grade military
Note: These devices sensitive. following precautions strongly recommended. Ensure that approved carrier used when units transported from destination another. Personal grounding worn times when handling these devices. manufacturer assumes responsibilities damage improper storage handling these devices.
AMMC-6550 Maximum Ratings
Symbol
Tstg Tmax
Parameters Conditions
Gate Supply Voltage Input Power Operating Channel Temperature Storage Case Temperature Max. Assembly Temp sec. max)
Units
Min.
-1.2
Max.
+1.2 +150
+150 +300
Note: Operation excess these conditions result permanent damage this device.
AMMC-6550 Specifications/Physical Properties
Symbol
Parameters Test Conditions
Gate Supply Operating Voltage Gate Supply Current (under power drive temperature)
Units
+0.4
Note: Ambient operational temperature Ta=25^C unless otherwise noted.
AMMC-6550 Typical performances (TA= 25°C, Vg=+0.4 frequency=1GHz, Zo=50
Symbol
RL_RF RL_LO RL_IF LO-RF Iso. LO-IF Iso. RF-IF Iso. IIP3
Parameters Test Conditions
Frequency Range Frequency Range Frequency Range port pumping power conversion gain Port Return Loss Port Return Loss Port Return Loss Image rejection ratio port Isolation port Isolation port Isolation Input IP3, Fdelta=100MHz, Prf=-10dBm, Plo=15dBm Input port power compression point, Plo=+15dBm Noise Figure
Units
Minimum
Typical
Notes: Small/Large signal data measured fully de-embedded test fixture from Ta=25^C. Specifications derived from measurements test environment.
AMMC-6550 Specifications (TA= 25°C, Vg=+0.4V, Plo=+10dBm, Zo=50
Symbol
Parameters Test Conditions
Conversion Gain Image Rejection Ratio
Units
Typical
Sigma
Notes: Performance verified 100% on-wafer testing. 100% on-wafer testing done frequency 42GHz: frequency=2GHz. external degree hybrid coupler from M/A-COM: 2032-6344-00. Frequency=1.0-2.0GHz
Typical distribution conversion gain.
Those figures were created based 6000 part samples over several production lots.
Conversion gain Lo=17GHz, RF=19GHz
Conversion Gain LO=28GHz, RF=30GHz
Conversion Gain LO=40GHz, RF=42GH
Biasing Operation
recommended bias condition optimum performance, reliability Vg=+0.4 volts. There approximately zero current consumption gate biasing because mixer designed passive operation. Figure simple block diagram, reference Figure Figure schematic image-rejection (SSB) mixer MMIC connected off-chip quadrature hybrid. Figures through Figure show typical measurement results under image rejection operation. Data presented AMMC-6550 obtained using circuit described here. Please note that image rejection isolation performance dependent selection frequency quadrature hybrid. performance specification frequency quadrature hybrid well phase balance VSWR interface AMMC-6550 will affect overall mixer performance. ground wired needed since ground connections made with plated through-holes backside device. This MMIC exposed bridges surface. Handle edges with custom collet pick with vacuum center). This MMIC also static sensitive handling precautions should taken. more detailed information, Avago Application Note "GaAs MMIC ESD, Attach Bonding Guide lines." Notes: Ablebond 84-1 silver epoxy recommended. Buckbee-Mears Corporation, Paul, 800-2623824
LO/RF Drain
Assembly Techniques
chip should attached directly ground plane using either flux less AuSn solder perform electrically conductive epoxy [1]. conductive epoxy, amount should just enough provide thin fillet around bottom perimeter die. ground plane should free residue that jeopardize electrical mechanical attachment. Caution should taken exceed Absolute Maximum Rating assembly temperature time. Thermo-sonic wedge bonding preferred method wire attachment bond pads. connections should kept short possible minimize inductance. Gold mesh double-bonding with 0.7mil gold wire recommended. Mesh attached using 2mil round tracking tool force approximately 22grams with ultrasonic power roughly 55dB duration 8mS. guided wedge ultrasonic power level 64dB used 0.7mil wire. recommended wire bonding stage temperature 2°C. chip thick should handled with care.
RF/LO Gate
Figure AMMC-6550 Schematic
RFDrain
Chip
Gate
Figure AMMC-6550 Assembly diagram mixer applications. termination required unwanted side-band termination
AMMC-6550 Typical performances 25°C, =+0.4
[dB] Frequency [GHz]
[dB]
Frequency [GHz]
Figure Typical conversion Gain, Plo=+10dBm, Fif=1GHz
Figure Typical conversion Gain, Plo=+10dBm, Fif=1GHz
Freq [GHz]
[dB], P-1[dBm]
CG[dB] @Plo=10dBm P-1[dBm] @Plo=10dBm CG[dB] @Plo=14dBm P-1[dBm] @Plo=14dBm
Noise Figure [dB]
Frequency [GHz] Figure Typical Noise Figure, Plo=10dBm, Fif=1GHz
Figure Typical port input power (@P-1), Plo=+10dBm, Fif=1GHz
IIP3 [dBm]
IIP3[10dBm] [GHz] IIP3[15dBm]
[dB]
[dBm]
Figure Typical IP3, Fif=1GHz, Plo=10dBm 15dBm
Figure Typical Conversion gain power, Prf=-20dBm, Flo=30GHz
Concersion Gain[dB]
Return Loss[dB]
Vgs[V]
USB(10dBm) LSB(10dBm) USB(13dBm) LSB(13dBm)
[GHz]
Figure Typical Conversion gain Gate voltage, Flo=30GHz, Plo=+10dBm +13dBm
Figure Typical port Return Loss Frequency, Plo=+10dBm
Return-Loss [dB]
Return Loss [dB]
[GHz]
Frequency [GHz]
Figure Typical port Return Loss frequency, Frf=35GHz, Plo=+10dBm
Figure Typical port return Loss Frequency, Plo=+10dBm, Fif=1GHz
Figure Bond location (um)
Figure Recommended assembly
Ordering Information:
AMMC-6550-W10 devices tray AMMC-6550-W50 devices tray
product information complete list distributors, please site:
www.avagotech.com
Avago, Avago Technologies, logo trademarks Avago Technologies, Limited United States other countries. Data subject change. Copyright 2006 Avago Technologies Pte. rights reserved. AV01-0394EN August 2006

Image Rejection Mixer Chip Size: 1600 1300 (100 mils) Chip Size T

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