BIPOLAR Telephone Quadrature Modulator (With Up-convert
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DS04-23509-1E
BIPOLAR
Telephone
Quadrature Modulator
(With Up-converter)
MB54609
DESCRIPTION
MB54609 intermediate-frequency (IF) quadrature modulator incorporating 1.0-GHz up-converter optimized digital mobile telecommunication systems such (Personal Digital Cellular). MB54609 incorporates quadrature modulator modulation, transmission up-convert mixer, type phase shifter well, capable handing broad band. addition, MB54609 operates power supply voltage power supply current (both typical values), contributing saving power consumption device.
FEATURES
Incorporating high-performance transmission mixer covering entire frequency band used services (Maximum output frequency GHz) Maximum output frequency: GHz, Output level: (typical) Externally connecting quadrature modulator with transmission mixer, allowing bandpass filter (BPF) inserted between quadrature modulator output drive load. Flip-flop phase shifter capable handling intermediate frequencies broad band (100 MHz) Operation voltage: current consumption During operating: 18.0 (typical) power save mode: (typical) Operating temperature range: +85°C
PACKAGE
20-pin Plastic SSOP
(FPT M03) (FPT-20P-M03)
MB54609
ASSIGNMENT
(TOP VIEW)
RFout
XQMOD
QMOD
XLO1
(FPT-20P-M03)
MB54609
DESCRIPTION
name RFout XLO1 QMOD XQMOD Up-converter output input mixer input complementary mixer input mixer input quadrature modulator input complementary quadrature modulator Power supply Power supply Baseband input Baseband input complementary Quadrature modulator output Quadrature modulator output complementary Baseband input complementary Baseband input Power save mode control Power supply voltage must applied both pins. Function
MB54609
BLOCK DIAGRAM
QMOD
RFout
shifter
XLO1
XQMOD
ABSOLUTE MAXIMUM RAGINGS (See WARNING)
Parameter Power supply voltage Output voltage Input voltage Open collector applied voltage Output current Storage temperature Symbol Tstg Rating -0.5 -0.5 -0.5 (-0.5 5.0) +125 Unit RFout leave this open. Remarks
WARNING: Exceeding above Absolute Maximum Ratings cause permanent damage LSI. normal operation, device should used under recommended operating conditions. Exceeding recommended conditions adversely affect reliability. Note: Although MB54609 contains antistatic element prevent electrostatic breakdown circuitry been improved electrostatic protection, observe following precautions when handling device: When storing carrying device, conductive case. Before handling device, check that jigs tools used have been uncharged (grounded) well yourself. conductive sheet working bench. Before fitting device into removing from socket, turn power supply off. When handling (such transporting) MB54609 mounted board, protect leads with conductive sheet.
MB54609
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage Input voltage Open collector applied voltage Operating temperature Symbol Value Min. Typ. Max. Unit RFout pin. leave this open. Remarks
ELECTRIC CHARACTERISTICS
(TCC +25°C) Parameter Power supply current Power supply current power save mode Shifter input Operating band Input level Operating band Baseband input Input amplitude Offset voltage Offset current Mixer input Mixer output RFout Operating band Input level Operating band Output level Amplitude deviation Modulation precision Phase deviation Vector error Symbol ICCPS fLO1 PLO1 fLO2 PLO2 AERR PERR VERR Value Min. Typ. 18.0 0.82 Max. 23.5 1100 1100 Unit fLO2 fLO1/2 deg. fLO1 (-15 dBm) value fLO2 value dBm) output QMOD/Mix direct value connection With external offset unadjusted External offset voltage value Input Imp. converted value Remarks current (Input with signal) current (Input with signal)
Carrier suppression
MB54609
EVALUATION BOARD (Reference Example)
Material: resin BT-HL870 (Dielectric constant MHz] 3.6) Thickness: layers, (Copper thickness: External layer Internal layer Plating: electroless gold plating Layer (front surface)
Layer
(Continued)
MB54609
(Continued)
Layer
Layer (rear surface)
MB54609
MEASUREMENT DATA (Reference Values)
Application-common characteristics characteristics (test circuit Input with signal
Power supply current (mA)
Power save mode power supply current ICCPS (mA)
ICCPS
Temperature (°C)
(Continued)
MB54609
(Continued)
Input impedance (Only test circuit Impedance from
195.75 -766.13 2.0774 100.000 dB/REF -.2709 dB/REF 28.039 -255.4 16.055 -145.7 12.668 -77.559
16.354 -61.639 3.2268 800.200 -2.2095 14.877 -50.018 13.725 -39.764 14.746 4.8403
100.000
-.3559 -.5822 -1.2776
800.200
-2.5448 -2.8953 -5.2236
START 100.000
STOP 100.000
START 100.000
STOP 100.000
Output impedance (Only test circuit Impedance from RFout
9.8633 -124.64 1.5961 800.000 9.8984 -106.21 11.055 -92.508 12.137 -50.846 -.4733
dB/REF
800.000
-2.0524 -.6207 -.8619
START 100.000
STOP 100.000
MB54609
800-MHz APPLICATION MEASUREMENT DATA (Reference Values)
Parameter Baseband input signal Shifter input signal Mixer input signal Mixer output signal RFout Symbol fLO1 PLO1 fLO2 PLO2 RLLO1 Return loss RLLO2 RLRF AERR Modulation precision Carrier suppression PERR VERR Measurement result -8.4 0.82 -34.5 Unit kbps deg. fLO2 fLO1/2 value fLO1 fLO2 Magnitude Error Phase Error Vector Error Condition /4DQPSK, Root-Nyquist filter 0.5) Single-end input Test circuit
External circuit constants (with mounted evaluation board)
RFout from from 1000 1000 XLO1 offset offset XQMOD MB54609 QMOD offset RFout Operation Power save mode offset
(Continued)
MB54609
(Continued)
Modulation precision output spectrum (test circuit Baseband signal: DQPSK, kbps, Vpp, Root-Nyquist filter Input signals: MHz, dBm; MHz, Output signal: RFout Modulation precision
Vector Peak Vector Magnitude Peak Magnitude Phase Peak Phase Carrier Freq Carrier Phase Carrier Leak Error Error Error Error Error Error Offset Offset 1.927% 4.234% 1.290% 3.364% 0.821 degs -2.240 degs 8.561e+03 157.455 degs -32.429
Output spectrum
Bias Vector Gravity Center
2.305, 0.634)% -4.635, 10.356)%
5.000e-01 V/Div Baseband Filter: RtNyq (0.5000) Rectangle 4.761905
CENTER SPAN dB/div.
Spectrum (test circuit Baseband signal: DQPSK, kbps, Vpp, 0000, Root-Nyquist filter Input signals: MHz, dBm; MHz, Output signal: RFout Span Span
Image (550 MHz) -26.9 (750 MHz) -27.1 (950 MHz) -10.1
-38.8
CENTER SPAN 26.2 dB/div.
-34.5
CENTER SPAN dB/div.
(Continued)
MB54609
(Continued)
output level dependent baseband amplitude (PRF: test circuit Modulation precision: test circuit Baseband signal test circuit DQPSK, kbps, Vpp, Root-Nyquist filter Input signals test circuits MHz, dBm; MHz, Output signal: RFout
output level (dBm)
VERR
Baseband amplitude (Vpp)
output level dependent input levels (PRF: test circuit Modulation precision: test circuit Baseband signal test circuit DQPSK, kbps, Vpp, Root-Nyquist filter Input signals test circuits MHz, dBm; MHz, Output signals test circuits RFout output level dependent input level output level dependent input level (@PLO2 dBm) (@PLO1 dBm)
Modulation precision Vector Error VERR output level (dBm) VERR Shifter output level PLO1 (dBm) output level (dBm) VERR Mixer input level PLO2 (dBm) Modulation precision Vector Error VERR
Modulation precision Vector Error VERR
(Continued)
MB54609
(Continued)
output level dependent temperature (PRF: test circuit Modulation precision: test circuit Baseband signal test circuit DQPSK, kbps, Vpp, Root-Nyquist filter Input signals test circuits MHz, dBm; MHz, Output signals test circuits RFout
output level (dBm) Modulation precision Vector Error VERR
VERR
Temperature (°C)
Carrier suppression dependent temperature (test circuit Baseband signal: DQPSK, kbps, Vpp, 0000, Root-Nyquist filter Input signals: MHz, dBm; MHz, Output signal: RFout
Carrier suppression (dBc)
Temperature (°C)
(Continued)
MB54609
(Continued)
Input impedance (with components mounted: test circuit Impedance including external components evaluation board
48.992 -2.7891 570.64 100.000 41.787 -4.8965 35.598 1.75 36.002 22.75 -30.473 dB/REF
6.7764 3.2986 699.98 750.000 7.6133 9.4209 10.451 22.735 27.307 58.09 -2.3584
dB/REF
100.000 -19.659 -15.42 -10.449
750.00 -2.5713 -3.0204 -3.8098
START 100.000
STOP 100.000
START 100.000
STOP 100.000
Output impedance (with components mounted: test circuit Impedance including external components evaluation board RFout
78.953 -16.762 9.9949 950.000 40.609 41.357 28.776 -28.809 12.979 -4.8784 -11.792
dB/REF
950.000 -7.4163 -7.4
-4.5661
START 100.000
STOP 100.000
MB54609
1.5-GHz APPLICATION MEASUREMENT DATA (Reference Values)
Measurement result Parameter Baseband input signal Shifter input signal Mixer input signal Mixer output signal RFout Symbol fLO1 PLO1 fLO2 PLO2 RLLO1 Return loss RLLO2 RLRF AERR Modulation precision Carrier suppression PERR VERR Measurement result 1619 1441 -13.4 0.90 -39.0 Unit kbps deg. fLO2 fLO1/2 value fLO1 fLO2 1619 1441 magnitude error phase error vector error Condition DQPSK, Root-Nyquist filter 0.5) Single-end input Test circuit
External circuit constants (with mounted evaluation board)
RFout from from 1000 1000 XLO1 offset offset XQMOD MB54609 QMOD offset RFout Operation Power save mode offset
(Continued)
MB54609
(Continued)
Modulation precision output spectrum (test circuit Baseband signal: DQPSK, kbps, Vpp, Root-Nyquist filter Input signals: MHz, dBm; 1619 MHz, Output signal: RFout 1441 Modulation precision Output spectrum
Vector Peak Vector Magnitude Peak Magnitude Phase Peak Phase Carrier Freq Carrier Phase Carrier Leak
Error Error Error Error Error Error Offset Offset
2.243% 4.552% 1.597% 3.756% 0.902 degs -1.977 degs -1.454e+03 7.417 degs -33.001
Bias Vector Gravity Center
1.839, 1.275)% (-1.295, 0.833)%
7.000e-02 V/Div Baseband Filter: RtNyq (0.500) Rectangle 4.761905
CENTER 1441 SPAN dB/div.
Spectrum (test circuit Baseband signal: DQPSK, kbps, Vpp, 0000, Root-Nyquist filter Input signals: MHz, dBm; 1619 MHz, Output signal: RFout 1441 Span 26.2 Span
(1619 MHz) -17.4 Image (1797 MHz) -20.6
-38.4
CENTER 1441 SPAN 26.2 dB/div.
-39.0
CENTER 1619 SPAN dB/div.
(1441 MHz) -15.6
(Continued)
MB54609
(Continued)
output level dependent baseband amplitude (PRF: test circuit Modulation precision: test circuit Baseband signal test circuit DQPSK, kbps, Vpp, Root-Nyquist filter Input signals test circuits MHz, dBm; 1619 MHz, Output signals test circuits RFout 1441
output level (dBm)
VERR
Base band amplitude (Vpp)
output level dependent input levels (PRF: test circuit Modulation precision: test circuit Baseband signal test circuit DQPSK, kbps, Vpp, Root-Nyquist filter Input signals test circuits MHz, dBm; 1619 MHz, Output signals test circuits RFout 1441 output level dependent input level (@PLO2 dBm)
Modulation precision Vector Error VERR output level (dBm)
output level dependent input level (@PLO1 dBm)
output level (dBm) VERR Mixer input level PLO2 (dBm) Modulation precision Vector Error VERR
VERR Shifter output level PLO1 (dBm)
Modulation precision Vector Error VERR
(Continued)
MB54609
(Continued)
Input impedance (with components mounted: test circuit Impedance including external components evaluation board
48.992 -2.7891 570.64 100.000 41.787 -4.8965 35.598 1.75 36.002 22.75 -30.473 dB/REF
36.615 -51.574 1.9287 600.000 15.662 38.445 60.707 87.941 174.97 -100.9 -5.5383
dB/REF
100.000 -19.659 -15.42 -10.449
600.000
-3.3828 -4.0604 -3.7229
START 100.000
STOP 100.000
START 100.000
STOP 100.000
Output impedance (with components mounted: test circuit Impedance including external components evaluation board RFout
74.918 -5.0469
21.884 441.000
22.76 56.336 58.35 5.0293 1.48 58.844 42.438 -13.853
dB/REF
441.000
-8.6101 -3.35 -20.927 1.48
START 100.000
STOP 100.000
MB54609
TEST CIRCUITS (Reference Examples)
Test circuit (for measurement)
VBB*cos D.U.T Synchronized VBB*sin RFout Spectrum analyzer
offset
offset
offset
offset
Test circuit (for modulation precision measurement)
Baseband signal generator D.U.T RFout Modulation precision analyzer
offset
offset
offset
offset
(Continued)
MB54609
(Continued)
Test circuit (for impedance measurement with components mounted)
Network analyzer
N.C.
D.U.T RFout Network analyzer
N.C.
offset
offset
offset
offset
Test circuit (for measurement impedance only
Network analyzer PORT-1 PORT-2
(applied PORT-2 internal bias tee) RFout XQMOD Power save mode XL01 Operation
MB54609
QMOD
MB54609
ORDERING INFORMATION
Part number MB54609PFV Package 20-pin Plastic SSOP (FPT-20P-M03) Remarks
MB54609
PACKAGE DIMENSION
20-pin Plastic SSOP (FPT-20P-M03) These dimensions include resin protrusion.
6.50±0.10(.256±.004)
1.25 -0.10 +.008 .049 -.004
+0.20
(Mounting height)
0.10(.004)
INDEX
*4.40±0.10 6.40±0.20
(.173±.004) (.252±.008)
5.40(.213)
0.65±0.12 (.0256±.0047)
0.22 -0.05 +.004 .009 -.002
+0.10
0.15 -0.02 +.002 .006 -.001
+0.05
Details part 0.10±0.10(.004±.004) (STAND OFF)
5.85(.230)REF
0.50±0.20 (.020±.008)
1994 FUJITSU LIMITED F20012S-2C-4
Dimensions (inches)
FUJITSU LIMITED
further information please contact:
Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-88, Japan Tel: (044) 754-3763 Fax: (044) 754-3329 North South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street Jose, 95134-1804, U.S.A. Tel: (408) 922-9000 Fax: (408) 432-9044/9045 Europe FUJITSU MIKROELEKTRONIK GmbH Siebenstein 6-10 63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122 Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LIMITED #05-08, Lorong Chuan Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220
Rights Reserved. contents this document subject change without notice. Customers advised consult with FUJITSU sales representatives before ordering. information circuit diagrams this document presented examples semiconductor device applications, intended incorporated devices actual use. Also, FUJITSU unable assume responsibility infringement patent rights other rights third parties arising from this information circuit diagrams. FUJITSU semiconductor devices intended standard applications (computers, office automation other office equipment, industrial, communications, measurement equipment, personal household devices, etc.). CAUTION: Customers considering products special applications where failure abnormal operation directly affect human lives cause physical injury property damage, where extremely high levels reliability demanded (such aerospace systems, atomic energy controls, floor repeaters, vehicle operating controls, medical devices life support, etc.) requested consult with FUJITSU sales representatives before such use. company will responsible damages arising from such without prior approval. semiconductor devices have inherently certain rate failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. products described this document represent goods technologies subject certain restrictions export under Foreign Exchange Foreign Trade Control Japan, prior authorization Japanese government should required export those products from Japan.
F9703 FUJITSU LIMITED Printed Japan
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