MC74HC125A MC74HC126A identical pinout LS125 LS126. device inputs comp
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MC74HC125A, MC74HC126A Quad 3-State Noninverting Buffers
MC74HC125A MC74HC126A identical pinout LS125 LS126. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. HC125A HC126A noninverting buffers designed used with 3-state memory address drivers, clock drivers, other bus-oriented systems. devices have four separate output enables that active-low (HC125A) active-high (HC126A).
PDIP-14 SUFFIX CASE
MC74HC12xAN AWLYYWWG
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with JEDEC Standard Requirements Chip Complexity: FETs Equivalent Gates Pb-Free Packages Available
SOIC-14 SUFFIX CASE 751A HC12xAG AWLYWW
TSSOP-14 SUFFIX CASE 948G 12xA ALYWG
SOEIAJ-14 SUFFIX CASE Assembly Location Wafer Year Work Week Pb-Free Package Pb-Free Package (Note: Microdot either location) 74HC12xA ALYWG
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2006
October, 2006 Rev.
Publication Order Number: MC74HC125A/D
MC74HC125A, MC74HC126A
ASSIGNMENT
LOGIC DIAGRAM HC125A Active-Low Output Enables
HC126A Active-High Output Enables
FUNCTION TABLE
HC125A Inputs Output HC126A Inputs Output
MAXIMUM RATINGS
Symbol Vout Iout Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Input Current, Output Voltage (Referenced GND) Output Current, Supply Current, Pins Power Dissipation Still Plastic SOIC Package TSSOP Package Tstg Storage Temperature Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package)
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Input Rise Fall Time (Figure Vin, Vout Operating Temperature, Package Types 1000
Symbol
Parameter
Unit
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MC74HC125A, MC74HC126A
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Guaranteed Limit 85_C 3.15 1.35 Symbol Parameter Test Conditions 25_C 3.15 1.35 125_C 3.15 1.35 Unit Minimum High-Level Input Voltage Vout |Iout| Maximum Low-Level Input Voltage Vout |Iout| Minimum High-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 2.48 3.98 5.48 2.34 3.84 5.34 Maximum Low-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 0.26 0.26 0.26 0.33 0.33 0.33 Maximum Input Leakage Current Maximum Three-State Leakage Current Output High-Impedance State Vout Iout Maximum Quiescent Supply Current (per Package) NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
ELECTRICAL CHARACTERISTICS Input
Guaranteed Limit 85_C
Symbol tPLH, tPHL
Parameter
25_C
125_C
Unit
Maximum Propagation Delay, Input Output (Figures
tPLZ, tPHZ
Maximum Propagation Delay, Output Enable (Figures
tPZL, tPZH
Maximum Propagation Delay, Output Enable (Figures
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
Cout
Maximum 3-State Output Capacitance (Output High-Impedance State)
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C,
Power Dissipation Capacitance (Per Buffer)* Used determine no-load dynamic power consumption: load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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MC74HC125A, MC74HC126A
ORDERING INFORMATION
Device MC74HC125AN MC74HC125ANG MC74HC125AD MC74HC125ADG MC74HC125ADR2 MC74HC125ADR2G MC74HC125ADT MC74HC125ADTG MC74HC125ADTR2 MC74HC125ADTR2G MC74HC125AF MC74HC125AFG MC74HC125AFEL MC74HC125AFELG MC74HC126AN MC74HC126ANG MC74HC126AD MC74HC126ADG MC74HC126ADR2 MC74HC126ADR2G MC74HC126ADTR2 MC74HC126ADTR2G MC74HC126AFEL MC74HC126AFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14 SOEIAJ-14 (Pb-Free) PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2000 Tape Reel 2500 Tape Reel Units Rail Units Rail 2000 Tape Reel Units Rail 2500 Tape Reel Units Rail Units Rail Shipping
Units Rail
2500 Tape Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC125A, MC74HC126A
SWITCHING WAVEFORMS
(HC126A) tPZL OUTPUT tTHL tPZH OUTPUT tPHZ tPLZ HIGH IMPEDANCE HIGH IMPEDANCE
INPUT tPLH
tPHL tTLH
(HC125A)
OUTPUT
Figure
Figure
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST
TEST POINT OUTPUT CONNECT WHEN TESTING tPLZ tPZL. CONNECT WHEN TESTING tPHZ tPZH.
*Includes probe capacitance
*Includes probe capacitance
Figure Test Circuit
Figure Test Circuit
HC125A (1/4 DEVICE)
HC126A (1/4 DEVICE) http://onsemi.com
MC74HC125A, MC74HC126A
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 0.38 1.01
SEATING PLANE
0.13 (0.005)
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MC74HC125A, MC74HC126A
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE
0.25 (0.010)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7.04 0.58
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC125A, MC74HC126A
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 1.20 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74HC125A, MC74HC126A
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). 0.50 MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 1.42 INCHES 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.056
0.13 (0.005)
0.10 (0.004)
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MC74HC125A/D
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