MC74AC4040 consists master-slave flip-flops. output each flip-flop fee
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MC74AC4040 12-Stage Binary Ripple Counter
MC74AC4040 consists master-slave flip-flops. output each flip-flop feeds next frequency each output half that preceding one. state counter advances negative-going edge Clock input. Reset asynchronous active-high. State changes outputs occur simultaneously because internal ripple delays. Therefore, decoded output signals subject decoding spikes have gated with Clock MC74AC4040 some designs.
PDIP-16 SUFFIX CASE
Typ. Clock Outputs Source/Sink Operating Voltage Range: High Noise Immunity Pb-Free Packages Available
RESET
SOIC-16 SUFFIX CASE 751B
SOEIAJ-16 SUFFIX CASE
ORDERING INFORMATION
Device MC74AC4040N MC74AC4040D MC74AC4040DG MC74AC4040DR2 Output State Change Advance next state Outputs MC74AC4040M MC74AC4040DR2G MC74AC4040NG Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOIC-16 Shipping Units/Rail Units/Rail Units/Rail Units/Rail 2500 Tape Reel
Figure Pinout: 16-Lead Packages Conductors (Top View) FUNCTION TABLE
Clock Reset
SOIC-16 2500 Tape Reel (Pb-Free) SOEIAJ-16 Units/Rail
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
Semiconductor Components Industries, LLC, 2006
November, 2006 Rev.
Publication Order Number: MC74AC4040/D
MC74AC4040
CLOCK RESET
Figure Logic Diagram
MAXIMUM RATINGS
Symbol VOUT IOUT Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Current, Current Output Power Dissipation Still Plastic{ SOIC Package{ Storage Temperature Lead Temperature, from Case seconds (Plastic SOIC Package) Parameter Value -0.5 +7.0 -0.5 +0.5 -0.5 +0.5 +150 Unit
Tstg
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability. Derating: Plastic DIP: 10mW/°C from 65°C 125°C SOIC Package: -7.0 mW/°C from 65°C 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol VIN/VOUT tr/tf Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise/Fall Time (Figure Parameter Unit ns/V
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MC74AC4040
CHARACTERISTICS (unless otherwise specified)
Symbol Parameter Maximum Quiescent Supply Voltage Value Unit Worst Case 25°C
Maximum Quiescent Supply Current
CHARACTERISTICS
74AC Symbol Parameter Minimum High Level Input Voltage Maximum Level Output Voltage IOLD IOHD Maximum Input Leakage Current Minimum Dynamic Output Current{ +25°C 2.99 4.49 5.49 0.002 0.001 0.001 74AC -40°C +85°C Guaranteed Limits 3.15 3.85 1.35 1.65 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1 3.15 3.85 1.35 1.65 2.46 3.76 4.76 0.44 0.44 0.44 ±1.0 Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, VOLD 1.65 VOHD 3.85
Maximum Level Input Voltage
Minimum High Level Output Voltage
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
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MC74AC4040
CHARACTERISTICS (For Figures Waveforms Section Semiconductor FACT Data Book, DL138/D)
74AC +25°C VCC* Symbol fmax trec Parameter Maximum Clock Frequency Propagation Delay Propagation Delay Propagation Delay Recovery Time Minimum Pulse Width Clock Minimum Pulse Width Master Reset -2.5 -1.5 74AC -40°C +85°C Unit Fig.
*Voltage Range ±0.3 *Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
MARKING DIAGRAMS
PDIP-16 MC74AC4040N AWLYYWWG SOIC-16 AC4040G AWLYWW SOEIAJ-16
74AC4040 ALYW
Assembly Location Wafer Year Work Week Pb-Free Package
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MC74AC4040
PACKAGE DIMENSIONS
PDIP-16 CASE 648-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL.
SEATING PLANE
0.25 (0.010)
INCHES 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 0.050 0.008 0.015 0.110 0.130 0.295 0.305 0.020 0.040
MILLIMETERS 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 1.27 0.21 0.38 2.80 3.30 7.50 7.74 0.51 1.01
STYLE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE
STYLE COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN COMMON DRAIN GATE SOURCE GATE SOURCE GATE SOURCE GATE SOURCE
SOIC CASE 751B-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
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MC74AC4040
PACKAGE DIMENSIONS
SOEIAJ-16 CASE 966-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018).
0.13 (0.005)
0.10 (0.004)
MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.78
INCHES 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.031
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MC74AC4040/D
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