MC74AC374/74ACT374 high-speed, low-power octal D-type flip-flop featur
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MC74AC374, MC74ACT374 Octal D-Type Flip-Flop with 3-State Outputs
MC74AC374/74ACT374 high-speed, low-power octal D-type flip-flop featuring separate D-type inputs each flip-flop 3-state outputs bus-oriented applications. buffered Clock (CP) Output Enable (OE) common flip-flops.
Buffered Positive Edge-Triggered Clock 3-State Outputs Bus-Oriented Applications Outputs Source/Sink MC74AC273 Reset Version MC74AC377 Clock Enable Version MC74AC373 Transparent Latch Version MC74AC574 Broadside Pinout Version MC74AC564 Broadside Pinout Version with Inverted Outputs ACT374 Compatible Inputs Pb-Free Packages Available
PDIP-20 SUFFIX CASE
SOIC-20W SUFFIX CASE 751D
TSSOP-20 SUFFIX CASE 948E
SOEIAJ-20 SUFFIX CASE
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
Figure Pinout: Lead Packages Conductors
(Top View)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
ASSIGNMENT
D0-D7 O0-O7 FUNCTION Data Inputs Clock Pulse Input 3-State Output Enable Input 3-State Outputs
Figure Logic Symbol
Semiconductor Components Industries, LLC, 2006
November, 2006 Rev.
Publication Order Number: MC74AC374/D
MC74AC374, MC74ACT374
TRUTH TABLE
Inputs Outputs
HIGH Voltage Level Voltage Level Immaterial High Impedance LOW-to-HIGH Transition
FUNCTIONAL DESCRIPTION MC74AC374/74ACT374 consists eight edge- triggered flip-flops with individual D-type inputs 3-state true outputs. buffered clock buffered Output Enable common flip-flops. eight flip-flops will store state their individual inputs that meet setup hold time requirements LOW-to-HIGH Clock (CP) transition. With Output Enable (OE) LOW, contents eight flip-flops available outputs. When HIGH, outputs high impedance state. Operation input does affect state flip-flops.
NOTE:
That this diagram provided only understanding logic operations should used estimate propagation delays.
Figure Logic Diagram
MAXIMUM RATINGS
Symbol VOUT IOUT Tstg Parameter Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Sink/Source Current, Current Output Storage Temperature Value -0.5 +7.0 -0.5 +0.5 -0.5 +0.5 +150 Unit
Stresses exceeding Maximum Ratings damage device. Maximum Ratings stress ratings only. Functional operation above Recommended Operating Conditions implied. Extended exposure stresses above Recommended Operating Conditions affect device reliability.
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MC74AC374, MC74ACT374
RECOMMENDED OPERATING CONDITIONS
Symbol VIN, VOUT Supply Voltage Input Voltage, Output Voltage (Ref. GND) Input Rise Fall Time (Note Devices except Schmitt Inputs Input Rise Fall Time (Note Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current High Output Current Parameter ns/V ns/V Unit
from VCC; individual Data Sheets devices that differ from typical input rise fall times. from individual Data Sheets devices that differ from typical input rise fall times.
CHARACTERISTICS
74AC Symbol Parameter Maximum Level Output Voltage Maximum Input Leakage Current Maximum 3-State Current Minimum Dynamic Output Current +25°C Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage 2.25 2.75 2.25 2.75 2.99 4.49 5.49 0.002 0.001 0.001 3.15 3.85 1.35 1.65 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1 74AC -40°C +85°C Guaranteed Limits 3.15 3.85 1.35 1.65 2.46 3.76 4.76 0.44 0.44 0.44 ±1.0 VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85 Unit Conditions
±0.5
±5.0
IOLD IOHD
Maximum Quiescent Supply Current *All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time. NOTE: guaranteed less than equal respective limit VCC.
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MC74AC374, MC74ACT374
CHARACTERISTICS (For Figures Waveforms AND8277/D www.onsemi.com)
74AC Symbol Parameter VCC* fmax tPLH tPHL tPZH tPZL tPHZ tPLZ Maximum Clock Frequency Propagation Delay Propagation Delay Output Enable Time Output Enable Time Output Disable Time Output Disable Time +25°C 10.5 13.5 12.5 11.5 11.5 12.5 11.5 74AC -40°C +85°C 15.5 10.5 14.5 12.5 12.5 Unit Fig.
*Voltage Range ±0.3 Voltage Range ±0.5
OPERATING REQUIREMENTS
74AC Symbol Parameter VCC* Setup Time, HIGH Hold Time, HIGH -1.0 +25°C 74AC -40°C +85°C Unit Fig.
Guaranteed Minimum
Pulse Width HIGH *Voltage Range ±0.3 Voltage Range ±0.5
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MC74AC374, MC74ACT374
CHARACTERISTICS
74ACT Symbol Parameter +25°C Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage Maximum Level Output Voltage DICCT Maximum Input Leakage Current Additional Max. ICC/Input Maximum 3-State Current Minimum Dynamic Output Current Maximum Quiescent Supply Current 4.49 5.49 0.001 0.001 74ACT -40°C +85°C Unit Conditions
Guaranteed Limits 3.86 4.86 0.36 0.36 ±0.1 ±0.5 3.76 4.76 0.44 0.44 ±1.0 ±5.0 VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85
IOLD IOHD
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms AND8277/D www.onsemi.com)
74ACT Symbol Parameter VCC* fmax tPLH tPHL tPZH tPZL tPHZ tPLZ Maximum Clock Frequency Propagation Delay Propagation Delay Output Enable Time Output Enable Time Output Disable Time Output Disable Time +25°C 11.5 74ACT -40°C +85°C 11.5 10.5 10.5 12.5 Unit Fig.
*Voltage Range ±0.5
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MC74AC374, MC74ACT374
OPERATING REQUIREMENTS (For Figures Waveforms AND8277/D www.onsemi.com)
74ACT Symbol Parameter VCC* +25°C Setup Time, HIGH Hold Time, HIGH 74ACT -40°C +85°C Unit Fig.
Guaranteed Minimum
Pulse Width HIGH *Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
MARKING DIAGRAMS
PDIP-20
SOIC-20W
TSSOP-20
SOEIAJ-20
MC74AC374N AWLYYWWG AC374 AWLYYWWG
ALYWG
74AC374 AWLYWWG
MC74ACT374N AWLYYWWG ACT374 AWLYYWWG
ALYWG
74ACT374 AWLYWWG
Assembly Location Wafer Year Work Week Pb-Free Package (Note: Microdot either location)
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MC74AC374, MC74ACT374
ORDERING INFORMATION
Device MC74AC374N MC74AC374NG MC74ACT374N MC74ACT374NG MC74AC374DW MC74AC374DWG MC74AC374DWR2 MC74AC374DWR2G MC74ACT374DW MC74ACT374DWG MC74ACT374DWR2 MC74ACT374DWR2G MC74AC374DTR2 MC74AC374DTR2G MC74ACT374DTR2 MC74ACT374DTR2G MC74AC374MEL MC74AC374MELG MC74ACT374MEL MC74ACT374MELG Package PDIP-20 PDIP-20 (Pb-Free) PDIP-20 PDIP-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20* TSSOP-20* TSSOP-20* TSSOP-20* SOEIAJ-20 SOEIAJ-20 (Pb-Free) SOEIAJ-20 SOEIAJ-20 (Pb-Free) 2000 Tape Reel 2000 Tape Reel 2500 Tape Reel 2500 Tape Reel 1000 Tape Reel Units Rail 1000 Tape Reel Units Rail Units Rail Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *These packages inherently Pb-Free.
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MC74AC374, MC74ACT374
PACKAGE DIMENSIONS
PDIP-20 SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH.
SEATING PLANE
0.25 (0.010)
0.25 (0.010)
INCHES 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 0.050 0.070 0.100 0.008 0.015 0.110 0.140 0.300 0.020 0.040
MILLIMETERS 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 1.27 1.77 2.54 0.21 0.38 2.80 3.55 7.62 0.51 1.01
SOIC-20W SUFFIX CASE 751D-05 ISSUE
0.25
NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90
0.25
SEATING PLANE
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MC74AC374, MC74ACT374
PACKAGE DIMENSIONS
TSSOP-20 SUFFIX CASE 948E-02 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS INCHES 6.40 6.60 0.252 0.260 4.30 4.50 0.169 0.177 0.047 1.20 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 0.026 0.27 0.37 0.011 0.015 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 0.252
IDENT
0.15 (0.006)
DETAIL
0.100 (0.004) SEATING
PLANE
DETAIL
SOLDERING FOOTPRINT*
7.06
0.36
1.26
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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SECTION 0.25 (0.010)
0.15 (0.006)
0.10 (0.004)
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74AC374, MC74ACT374
PACKAGE DIMENSIONS
SOEIAJ-20 SUFFIX CASE 967-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.81 INCHES 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.032
0.13 (0.005)
0.10 (0.004)
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MC74AC374/D
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