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Silicon Epicap Diodes
Designed general frequency control tuning applications; providing solid-state reliability replacement mechnaical tuning methods. High with Guaranteed Minimum Values Frequencies Controlled Uniform Tuning Ratio Available Surface Mount Package
MBV109T1 MMBV109LT1 MV209*
Motorola Preferred Devices
26-32 VOLTAGE VARIABLE CAPACITANCE DIODES
Cathode Anode SC-70/SOT-323 Cathode SOT-23 Cathode Anode Anode
CASE 419-02, STYLE SC-70/SOT-323
TO-92
MAXIMUM RATINGS
Rating Reverse Voltage Forward Current Forward Power Dissipation 25°C Derate above 25°C Junction Temperature Storage Temperature Range Symbol Tstg +125 +150 mW/°C
MBV109T1
MMBV109LT1
MV209
Unit mAdc
CASE STYLE SOT- 236AB)
CASE 182-02, STYLE TO-92 (TO-226AC)
DEVICE MARKING
MBV109T1 J4A, MMBV109LT1 M4A, MV209 MV209
ELECTRICAL CHARACTERISTICS 25°C unless otherwise noted.)
Characteristic Reverse Breakdown Voltage µAdc) Reverse Voltage Leakage Current Vdc) Diode Capacitance Temperature Coefficient Vdc, MHz) Symbol V(BR)R Unit µAdc ppm/°C
Diode Capacitance Vdc, Device MBV109T1, MMBV109LT1, MV209
Figure Merit
Capacitance Ratio C3/C25 (Note
ratio measured divided measured Vdc. MMBV109LT1 also available bulk packaging. MMBV109L device title order this device bulk. Thermal Clad trademark Bergquist Company
Preferred devices Motorola recommended choices future best overall value.
(Replaces MMBV109LT1/D)
Motorola Small-Signal Transistors, FETs Diodes Device Data Motorola, Inc. 1996
MBV109T1 MMBV109LT1 MV209
FIGURE MERIT CAPACITANCE FREQUENCY (MHz) 1000 25°C 25°C 1000
REVERSE VOLTAGE (VOLTS)
Figure DIODE CAPACITANCE
Figure FIGURE MERIT
DIODE CAPACITANCE (NORMALIZED)
REVERSE CURRENT (nA) 0.06
1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0.96 +100 +125
0.02 0.01 0.006 +100 +120 +140
0.002 0.001
AMBIENT TEMPERATURE
AMBIENT TEMPERATURE
Figure LEAKAGE CURRENT
Figure DIODE CAPACITANCE
NOTES TESTING SPECIFICATIONS
ratio measured divided measured Vdc.
Motorola Small-Signal Transistors, FETs Diodes Device Data
MBV109T1 MMBV109LT1 MV209
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS
Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection interface between board package. With correct geometry, packages will self align when subjected solder reflow process.
0.037 0.95 0.037 0.95
0.025 0.025 0.65 0.65
0.075 0.035 0.028 inches
0.079 0.035 0.031
inches
SC-70/SOT-323
SOT-23
POWER DISSIPATION SURFACE MOUNT DEVICE
power dissipation surface mount device function size. These vary from minimum size soldering size given maximum power dissipation. Power dissipation surface mount device determined TJ(max), maximum rated junction temperature die, RJA, thermal resistance from device junction ambient; operating temperature, Using values provided data sheet, calculated follows. TJ(max) 556°C/W SOT-23 assumes recommended footprint glass epoxy printed circuit board achieve power dissipation milliwatts. There other alternatives achieving higher power dissipation from surface mount packages. increase area drain/collector pad. increasing area drain/collector pad, power dissipation increased. Although power dissipation almost doubled with this method, area taken printed circuit board which defeat purpose using surface mount technology. Another alternative would ceramic substrate aluminum core board such Thermal CladTM. Using board material such Thermal Clad, aluminum core board, power dissipation doubled using same footprint.
values equation found maximum ratings table data sheet. Substituting these values into equation ambient temperature 25°C, calculate power dissipation device. example, SOT-23 device, calculated follows. 150°C 25°C 556°C/W milliwatts
SOLDERING PRECAUTIONS
melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference should maximum 10°C.
soldering temperature time should exceed When shifting from preheating soldering, After soldering been completed, device should
allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling Soldering device without preheating cause excessive thermal shock stress which result damage device. maximum temperature gradient should less. 260°C more than seconds.
Motorola Small-Signal Transistors, FETs Diodes Device Data
MBV109T1 MMBV109LT1 MV209
SOLDER STENCIL GUIDELINES
Prior placing surface mount components onto printed circuit board, solder paste must applied pads. solder stencil required screen optimum amount solder paste onto footprint. stencil made brass stainless steel with typical thickness 0.008 inches. stencil opening size surface mounted package should same size printed circuit board, i.e., registration.
TYPICAL SOLDER HEATING PROFILE
given circuit board, there will group control settings that will give desired heat pattern. operator must temperatures several heating zones, figure belt speed. Taken together, these control settings make heating "profile" that particular circuit board. machines controlled computer, computer remembers these profiles from operating session next. Figure shows typical heating profile when soldering surface mount device printed circuit board. This profile will vary among soldering systems good starting point. Factors that affect profile include type soldering system use, density types components board, type solder used, type board substrate material being used. This profile shows temperature versus time. line graph shows actual temperature that might experienced surface test board near central solder joint. profiles based high density density board. Vitronics SMD310 convection/infrared reflow soldering system used generate this profile. type solder used 62/36/2 Lead Silver with melting point between -189°C. When this type furnace used solder reflow work, circuit boards solder joints tend heat first. components board then heated conduction. circuit board, because large surface area, absorbs thermal energy more efficiently, then distributes this energy components. Because this effect, main body component degrees cooler than adjacent solder joints.
STEP PREHEAT ZONE "RAMP" 200°C
STEP STEP VENT HEATING "SOAK" ZONES "RAMP"
STEP STEP HEATING HEATING ZONES ZONES "SPIKE" "SOAK" 170°C 160°C
STEP STEP VENT COOLING 205° 219°C PEAK SOLDER JOINT
DESIRED CURVE HIGH MASS ASSEMBLIES 150°C
150°C 140°C SOLDER LIQUID SECONDS (DEPENDING MASS ASSEMBLY)
100°C 100°C
DESIRED CURVE MASS ASSEMBLIES 50°C
TIME MINUTES TOTAL)
TMAX
Figure Typical Solder Heating Profile
PACKAGE DIMENSIONS
Motorola Small-Signal Transistors, FETs Diodes Device Data
MBV109T1 MMBV109LT1 MV209
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. STYLE BASE EMITTER COLLECTOR INCHES 0.071 0.087 0.045 0.053 0.035 0.049 0.012 0.016 0.047 0.055 0.000 0.004 0.004 0.010 0.017 0.026 0.028 0.031 0.039 0.079 0.087 0.012 0.016 MILLIMETERS 1.80 2.20 1.15 1.35 0.90 1.25 0.30 0.40 1.20 1.40 0.00 0.10 0.10 0.25 0.425 0.650 0.700 0.80 1.00 2.00 2.20 0.30 0.40
0.05 (0.002)
CASE 419-02 ISSUE SC-70/SOT-323
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. STYLE ANODE CONNECTION CATHODE INCHES 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236 MILLIMETERS 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60
CASE 318-08 ISSUE SOT-23 (TO-236AB)
SEATING PLANE
SECTION
STYLE ANODE CATHODE
CASE 182-02 (T0-226AC) ISSUE
Motorola Small-Signal Transistors, FETs Diodes Device Data
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. CONTOUR PACKAGE BEYOND ZONE UNCONTROLLED. DIMENSION APPLIES BETWEEN DIMENSIONS APPLY BETWEEN MINIMUM. LEAD DIMENSION UNCONTROLLED BEYOND MINIMUM. INCHES 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.022 0.016 0.019 0.050 0.100 0.014 0.016 0.500 0.250 0.080 0.105 0.050 0.115 0.135 MILLIMETERS 4.45 5.21 4.32 5.33 3.18 4.49 0.41 0.56 0.407 0.482 1.27 3.54 0.36 0.41 12.70 6.35 2.03 2.66 1.27 2.93 3.43
MBV109T1 MMBV109LT1 MV209
Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters which provided Motorola data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part. Motorola registered trademarks Motorola, Inc. Motorola, Inc. Equal Opportunity/Affirmative Action Employer. reach EUROPE Locations Listed: Motorola Literature Distribution; P.O. 20912; Phoenix, Arizona 85036. 1-800-441-2447 602-303-5454 MFAX: RMFAX0@email.sps.mot.com TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Ping Industrial Park, Ting Road, N.T., Hong Kong. 852-26629298
MBV109T1/D Motorola Small-Signal Transistors, FETs Diodes Device Data
*MBV109T1/D*

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