ULLC0408FC05C* Only Name Means ProT ek'Tion UNBUMPED CAPACIT

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ULLC0408FC05C* Only Name Means ProT ek'Tion UNBUMPED CAPACIT

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05221
ULLC0408FC05C*
Only Name Means ProT ek'Tion
UNBUMPED CAPACIT ANCE FLIP CHIP ARRA
APPLICA TIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): 15kV, Contact 61000-4-4 (EFT): 5/50ns TURES Protection kilovolts Available Volts Overshoot Voltage Bidirectional Configuration Monolithic Structure Protects Isolated Lines CAPACITANCE: LEAKAGE CURRENT RoHS Compliant upon Request MECHANICAL CHARACTERISTICS Standard Chip Size: 0402 Weight 0.73 milligrams (Approximate) Solder Reflow Temperature: Tin-Lead Sn/Pb: 240-245°C Lead-Free: 260-270°C Flammability Rating 94V-0 Plastic Paper Tape Reel Standard Device Marking Reel CONFIGURA TION
*U.S. Patent 6,867,436
05221.R0 4/05
www.protekdevices.com
ULLC0408FC05C*
DEVICE CHARACTERISTICS MAXIMUM RATINGS 25°C Unless Otherwise Specified
PARAMETER Operating Temperature Storage Temperature SYMBOL TSTG VALUE -55°C 150°C -55°C 150°C UNITS
ELECTRICAL CHARACTERISTICS LINE 25°C Unless Otherwise Specified
PART NUMBER (See Note RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE
VOLTS ULLC0408FC05C
Note This device bidirectional.
V(BR) VOLTS
@VWM
@0V,
FIGURE OVERSHOOT CLAMPING VOLTAGE
FIGURE CAPACITANCE REVERSE VOLTAGE
Volts Division
Capacitance
Test Pulse kilovolt, 1/30ns (waveshape)
Reverse Voltage Volts
*U.S. Patent 6,867,436
05221.R0 4/05
www.protekdevices.com
ULLC0408FC05C*
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER
Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round Clean OSP(Entek Plus 106A) ±50µm ±20µm Seconds 270°C
REQUIREMENTS
Temperature: Lead-Free (SnAgCu): 260-265°C Tin-Lead: 240-245°C Preheat time temperature depends solder paste flux activation temperature, component size, weight, surface area plating.
RECOMMENDED NON-SOLDER MASK DEFINED ILLUSTRATION
Non-Solder Mask Defined 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
Ramp-up
Temperature
Ramp-down TSMAX 155° TSMIN 140° Preheat
25°C Peak 30-60 seconds
Ramp-up seconds
Solder Time 15-20 seconds
Ramp-down
*U.S. Patent 6,867,436
05221.R0 4/05
www.protekdevices.com
ULLC0408FC05C*
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
MILLIMETERS 0.56 0.86 0.99 0.0254 0.15 0.0254 0.406 INCHES 0.022 0.034 0.039 0.001 0.006 0.079 0.001 0.016
SIDE
NOTES: Controlling dimensions inches. Decimal tolerances mounting outline: .xxx 0.05mm 0.002"). Metalized Contact
MOUNTING YOUT Option
SOLDER CONTACT
DIMENSIONS
MILLIMETERS 0.51 0.30 0.46 0.20 0.15 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 0.028 0.039 0.020
NOTE:
Preferred: Using 0.1mm (0.004") stencil.
SOLDER PADS SOLDER PRINT 0.010" 0.012" DIA. SOLDER MASK
Outline Dimensions: 2/04, 06026
*U.S. Patent 6,867,436
05221.R0 4/05
www.protekdevices.com
ULLC0408FC05C*
MOUNTING YOUT Option
PACKAGE DIMENSIONS
MILLIMETERS 0.51 0.15 0.71 0.99 0.51 INCHES 0.020 0.006 0.028 0.039 0.020
COPPER CONTACT 0.009" [0.23] DIA.
SOLDER CONTACT
NOTES: Controlling dimensions inches. Decimal tolerances mounting outline: .xxx 0.05mm 0.002"). Preferred: Using 0.1mm (0.004") stencil. Outline Dimensions: 2/04, 06026
TAPE REEL ORIENT TION
SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK
Quad 0408 NOTE: view tape. Solder bumps face down tape package. TAPE REEL ORDERING NOMENCLATURE Surface mount product taped reeled accordance with 481. Plastic Tape: Inch Reels 5,000 pieces reel. Ordering Suffix: -T75-1 (i.e., ULLC0408FC05C-T75-1). Paper Tape: Inch Reels -5,000 pieces reel. Ordering Suffix: -T75-2 (i.e., ULLC0408FC05C-T75-2).
COPYRIGHT ProTek Devices 2005 SPECIFICATIONS: ProTek reserves right change electrical mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves right discontinue product lines without notice, that final judgement concerning selection specifications buyer's that furnishing engineering technical assistance, ProTek assumes responsibility with respect selection specifications such products.
ProTek Devices 2929 South Fair Lane, Tempe, 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Site: www.protekdevices.com
*U.S. Patent 6,867,436
05221.R0 4/05
www.protekdevices.com

ULLC0408FC05C* Only Name Means ProT ek'Tion UNBUMPED CAPACIT

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