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VCXO Clock Generator Features Description On-chip tunab
Top Searches for this datasheetFS6130 VCXO Clock Generator Features Description On-chip tunable voltage-controlled crystal oscillator circuitry (VCXO) allows precise system frequency tuning (pull range typically 300ppm) Uses inexpensive fundamental-mode crystals Integrated phase-locked loop (PLL) multiplies VCXO frequency higher system frequencies needed 3.3V supply voltage available Small circuit board footprint: (8-pin 0.150 SOIC) Custom frequency selections available contact your local Sales Representative more information FS6130 monolithic CMOS clock generator designed minimize cost component count digital video/audio systems. high-resolution phase-locked loop generates three output clocks through array post-dividers. frequencies ratiometrically derived from crystal oscillator frequency. locking output frequencies together eliminate unpredictable artifacts video systems reduce electromagnetic interference (EMI) frequency harmonic stacking. Table Font Information Figure Configuration XTUNE DEVICE FS6130-03 FXIN (MHz) 13.500 CLKA (MHz) 54.000 CLKB (MHz) 13.500 CLKC (MHz) 27.000 XOUT CLKC CLKB CLKA FS6130 NOTE: Contact custom versions 8-pin (0.150 SOIC Figure Block Diagram VCXO XOUT XTUNE Dividers CLKB CLKA CLKC FS6130 American Microsystems, Inc. reserves right change detail specifications required permit improvements design products. ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Table Descriptions Key: Analog Input; Analog Output; Digital Input; Input with Internal Pull-Up; Input with Internal Pull-Down; Digital Input/Output; DI-3 Three-Level Digital Input, Digital Output; Power/Ground; Active TYPE NAME XTUNE CLKA CLKB CLKC XOUT VCXO Crystal Feedback DESCRIPTION Power Supply (+3.3V +5V) Version Information VCXO Tune Ground Clock Output Clock Output Clock Output VCXO Crystal Drive Functional Block Description Phase-Locked Loop (PLL) on-chip standard frequency- phaselocked loop architecture. multiplies reference oscillator desired frequency ratio integers. frequency multiplication exact with zero synthesis error. oscillator circuit. actual amount that changing load capacitance alters oscillator frequency will dependent characteristics crystal well oscillator circuit itself. Specifically, motional capacitance crystal (usually referred crystal manufacturers C1), static capacitance crystal (C0), load capacitance (CL) oscillator determine "warping" "pulling" capability crystal oscillator circuit. simple formula obtain warping capability crystal oscillator Voltage-Controlled Crystal Oscillator (VCXO) ppm) VCXO provides tunable, low-jitter frequency reference rest FS6109 system components. Loading capacitance crystal internal FS6109. external components (other than crystal resonator itself) required operation VCXO. Continuous fine-tuning VCXO frequency accomplished varying voltage XTUNE pin. total change (from extreme other) effective loading capacitance t.b.d. nominal. oscillator operates crystal resonator parallel-resonant mode. Crystal warping, "pulling" crystal oscillation frequency, accomplished altering effective load capacitance presented crystal where extremes applied load capacitance. EXAMPLE: crystal with following parameters used. With 0.02pF, 5pF, 10pF, 22.66pF, tuning range 0.02 (22.66 22.66 ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Electrical Specifications Table Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. These conditions represent stress rating only, functional operation device these other conditions above operational limits noted this specification implied. Exposure maximum rating conditions extended conditions affect device performance, functionality, reliability. PARAMETER Supply Voltage (VSS ground) Input Voltage, Output Voltage, Input Clamp Current, VDD) Output Clamp Current, VDD) Storage Temperature Range (non-condensing) Ambient Temperature Range, Under Bias Junction Temperature Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) SYMBOL MIN. VSS-0.5 VSS-0.5 VSS-0.5 MAX. VDD+0.5 VDD+0.5 UNITS CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting loss functionality performance occur this device subjected high-energy electrostatic discharge. Table Operating Conditions PARAMETER Supply Voltage (3.3 volt system) Supply Voltage (5.0 volt system) Ambient Operating Temperature Range Crystal Resonator Frequency SYMBOL fXTAL CONDITIONS/DESCRIPTION NOTE NOTE NOTE Fundamental Mode MIN. TYP. MAX. UNITS NOTE These specifications represent generic FS6130 device capability. Device specifications particular version (i.e. FS6130-xx) guaranteed only with operating voltage reference frequency specified Version Information. ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Table Electrical Specifications (VDD 3.3V nominal) Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data typical. Negative currents indicate current flows device. PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs Crystal Oscillator Crystal Loading Capacitance Crystal Drive Level Crystal Oscillator Feedback (XIN) Threshold Bias Voltage High-Level Input Current Low-Level Input Current Crystal Oscillator Drive (XOUT) High-Level Output Source Current Low-Level Output Sink Current Clock Outputs (CLKx) High-Level Output Source Current Low-Level Output Sink Current Output Impedance Short Circuit Source Current Short Circuit Sink Current SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS fXTAL 27MHz; 10pF, 3.3V CL(xtal) seen crystal connected XOUT RXTAL=20; V(XIN) 3.3V, V(XIN) 3.3V -0.5 IOSH IOSL 2.0V 0.4V 0.1VDD; output driving high 0.1VDD; output driving shorted 30s, max. 3.3V; shorted 30s, max. ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Table Electrical Specifications (VDD nominal) Unless otherwise stated, 5.0V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data typical. Negative currents indicate current flows device. PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs Crystal Oscillator Crystal Loading Capacitance Crystal Drive Level Crystal Oscillator Feedback (XIN) Threshold Bias Voltage High-Level Input Current Low-Level Input Current Crystal Oscillator Drive (XOUT) High-Level Output Source Current Low-Level Output Sink Current Clock Outputs (CLKx) High-Level Output Source Current Low-Level Output Sink Current Output Impedance Short Circuit Source Current Short Circuit Sink Current SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS fXTAL 27MHz; 10pF, 5.0V CL(xtal) seen crystal connected XOUT RXTAL=20; V(XIN) V(XIN) IOSH IOSL 2.0V 0.4V 0.1VDD; output driving high 0.1VDD; output driving shorted 30s, max. shorted 30s, max. ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Table Timing Specifications (VDD 3.3V nominal) Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data typical. PARAMETER Overall Synthesis Error Clock Output (CLKx) Duty Cycle Jitter, Period (peak-peak) Jitter, Long Term Rise Time Fall Time SYMBOL CONDITIONS/DESCRIPTION CLOCK (MHz) MIN. TYP. MAX. UNITS (unless otherwise noted Frequency Table) Ratio high pulse width measured from rising edge next falling edge VDD/2) clock period tj(P) tj(LT) From rising edge next rising edge VDD/2, 10pF From 0-500µs VDD/2, 10pF compared ideal clock source 3.3V; 0.3V 3.0V; 10pF 3.3V; 3.0V 0.3V; 10pF Table Timing Specifications (VDD nominal) Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data typical. PARAMETER Overall Synthesis Error Clock Output (CLKx) Duty Cycle Jitter, Period (peak-peak) Jitter, Long Term Rise Time Fall Time SYMBOL CONDITIONS/DESCRIPTION CLOCK (MHz) MIN. TYP. MAX. UNITS (unless otherwise noted Frequency Table) Ratio high pulse width measured from rising edge next falling edge VDD/2) clock period tj(P) tj(LT) From rising edge next rising edge VDD/2, 10pF From 0-500µs VDD/2, 10pF compared ideal clock source 0.5V 4.5V; 10pF 4.5V 0.5V; 10pF ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Package Information Table 16-pin SOIC (0.150") Package Dimensions DIMENSIONS INCHES MIN. 0.061 0.004 0.055 0.013 0.0075 0.386 0.150 0.230 0.010 0.016 MAX. 0.068 0.0098 0.061 0.019 0.0098 0.393 0.157 0.244 0.016 0.035 MILLIMETERS MIN. 1.55 0.102 1.40 0.33 0.191 9.80 3.81 5.84 0.25 0.41 MAX. 1.73 0.249 1.55 0.49 0.249 9.98 3.99 6.20 0.41 0.89 RADII: 0.005" 0.01" typ. SEATING PLANE 0.050 1.27 BASE PLANE Table 16-pin SOIC (0.150") Package Characteristics PARAMETER Thermal Impedance, Junction Free-Air 16-pin 0.150" SOIC Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk SYMBOL CONDITIONS/DESCRIPTION flow Corner lead Center lead lead adjacent lead lead TYP. UNITS °C/W ISO9001 5.1.00 FS6130 VCXO Clock Generator Preliminary Ordering Information DEVICE NUMBER PACKAGE TYPE 8-pin (0.150") SOIC (Small Outline Package) 8-pin (0.150") SOIC (Small Outline Package) 8-pin (0.150") SOIC (Small Outline Package) 8-pin (0.150") SOIC (Small Outline Package) OPERATING TEMPERATURE RANGE (Commercial) (Commercial) (Commercial) (Commercial) SHIPPING CONFIGURATION Tape Reel Tubes Tape Reel Tubes ORDERING CODE t.b.d. t.b.d. t.b.d. t.b.d. FS6130-01 FS6130-01 FS6130-02 FS6130-02 Copyright 1999 American Microsystems, Inc. Devices sold covered warranty patent indemnification provisions appearing Terms Sale only. makes warranty, express, statutory implied description, regarding information forth herein regarding freedom described devices from patent infringement. makes warranty merchantability fitness purposes. reserves right discontinue production change specifications prices time without notice. AMI's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, 83201, (208) 233-4690, (208) 234-6796, Address: http://www.amis.com E-mail: tgp@amis.com ISO9001 5.1.00 Other recent searchesUH3B - UH3B UH3B Datasheet UH3C - UH3C UH3C Datasheet UH3D - UH3D UH3D Datasheet TPIC2101 - TPIC2101 TPIC2101 Datasheet TMP300 - TMP300 TMP300 Datasheet SHD124536 - SHD124536 SHD124536 Datasheet SHD124536P - SHD124536P SHD124536P Datasheet SHD124536N - SHD124536N SHD124536N Datasheet MPBG042 - MPBG042 MPBG042 Datasheet MBD127 - MBD127 MBD127 Datasheet GI3055S - GI3055S GI3055S Datasheet BH292 - BH292 BH292 Datasheet 2SC2189 - 2SC2189 2SC2189 Datasheet
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