Refer PCN00061 Date: 7/19/00 Intersil Agreement with ChipPAC

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Refer PCN00061 Date: 7/19/00 Intersil Agreement with ChipPAC

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PRODUCT CHANGE NOTICE
Refer PCN00061
Date: 7/19/00
Intersil Agreement with ChipPAC Intersil Completes Multi-year Supply Agreement With ChipPAC Sale Kuala Lumpur, Malaysia Based Semiconductor Assembly Test Operations ChipPAC
Post Office Melbourne, 32902-0883 Telephone 407-724-7000 www.intersil.com
July 2000
Subject:
Valued Intersil Customers Notice Intersil Agreement with ChipPAC Completion Multi-year Supply Agreement With ChipPAC Sale Intersil's Kuala Lumpur, Malaysia Based Semiconductor Assembly Test Operations ChipPAC
This letter will inform that Intersil entered into multi-year supply agreement assembly, test product distribution services with ChipPAC, Inc. Santa Clara, California. Under terms this agreement, Intersil sold Kuala Lumpur, Malaysia based semiconductor assembly test operations ChipPAC, will supply services subcontract basis. This agreement provides Intersil with opportunity increase concentration design, development, customer service. affords Intersil additional test capacity access packaging technologies. ChipPAC world's largest providers semiconductor packaging test services. company, which impressive customer list, offers wide array packaging, from basic 6-pin 2000-pin BGA/CSP leaded packages. ChipPAC's manufacturing facilities, located Ichon, Korea, Shanghai, China Kuala Lumpur, Malaysia ISO9000, QS9000 ISO14001 certified. Intersil plans qualify ChipPAC Shanghi Ichon facilities additional assembly sites selected products over next months. Kuala Lumpur, Malaysia facility will maintain systems compliant MIL-PRF-19500 MIL-PRF-38535. addition, they will maintain certification MIL-PRF-19500. Specifics site qualification dates plans being formulated applicable. Customers will issued formal change notice with more specific information, including part types projected dates site qualifications. targeted that thirty days after completion each site qualification, Intersil will have option implement processing site. Customers with specific qualification requirements, previously negotiated with accepted Intersil, contacted prior initiation qualification plans start qualifications discuss qualification requirements implementation plans. Customers sure that Intersil will take necessary actions conform customer requirements ensure continued high quality reliability Intersil products. anticipate smooth transition many current ChipPAC employees were previously trained have experience with Intersil's procedures customer requirements. Please contact your Regional Sales Office wish additional information this time. prefer, contact Intersil Line, 1-888-468-3774, United States 1-321-724-7143 outside United States.
Joan Sherman Intersil Corporation
PCN00061
Post Office Melbourne, 32902-0883 Telephone 407-724-7000 www.intersil.com

Refer PCN00061 Date: 7/19/00 Intersil Agreement with ChipPAC

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