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APM9966CO

Super High Dense Cell Design Reliable and Rugged Lead Free Available (RoHS Compliant) Top View of TSSOP - 8

APM9966CO
Dual N-Channel Enhancement Mode MOSFET
Features
Pin Description
Super High Dense Cell Design Reliable and Rugged Lead Free Available (RoHS Compliant) Top View of TSSOP - 8
(1) D1 (8) D2
Applications
(4) G1 (5) G2
Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems.
S1 S1 (2) (3) S2 S2 (6) (7)
N-Channel MOSFET
Ordering and Marking Information
APM 9966C Lead Free Code Handling Code Tem p. Range Package Code Package Code O : TSSO P-8 Operating Junction Tem p. Range C : -55 to 150°C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : O riginal Device XXXXX - Date Code
APM 9966C O :
APM 9966C XXXXX
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 1 www.anpec.com.tw
APM9966CO
Absolute Maximum Ratings
Symbol VDSS VGSS ID IDM IS TJ TSTG PD RJA
Note: Surface Mounted on 1in pad area, t 10sec.
Electrical Characteristics
Symbol Parameter
Test Condition
APM9966CO Min. Typ. Max.
Static Characteristics BVDSS Drain-Source Breakdown Voltage IDSS VGS(th) IGSS RDS(ON) VSD
Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage
Gate Charge Characteristics Qg Total Gate Charge Qgs Qgd Gate-Drain Charge
Gate-Source Charge
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Electrical Characteristics (Cont.)
Symbol Parameter
Test Condition
APM9966CO Min. Typ. Max.
Dynamic Characteristics b RG Ciss Coss Crss td(ON) Tr td(OFF) Tf
Notes:
Gate Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Typical Characteristics
Power Dissipation
Drain Current
ID - Drain Current (A)
Ptot - Power (W)
Tj - Junction Temperature (°C)
Safe Operation Area
Normalized Transient Thermal Resistance
Thermal Transient Impedance
ID - Drain Current (A)
300µs 1ms
100ms
Single Pulse
1E-3 1E-4
Mounted on 1in pad o RJA : 100 C / W
VDS - Drain - Source Voltage (V)
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Typical Characteristics (Cont.)
Output Characteristics
Drain-Source On Resistance
RDS(ON) - On - Resistance (m)
ID - Drain Current (A)
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
Gate Threshold Voltage
Normalized Threshold Voltage
ID - Drain Current (A)
VGS - Gate - Source Voltage (V)
Tj - Junction Temperature (°C)
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Typical Characteristics (Cont.)
Drain-Source On Resistance
Source-Drain Diode Forward
Normalized On Resistance
IS - Source Current (A)
Tj - Junction Temperature (°C)
VSD - Source - Drain Voltage (V)
Capacitance
Gate Charge
VGS - Gate - source Voltage (V)
C - Capacitance (pF)
400 Coss Crss 0
VDS - Drain - Source Voltage (V)
QG - Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Packaging Information
TSSOP-8
GAUGE PLANE
Millimeters Min. 0.00 0.80 0.19 2.9 0.65 BSC 6.40 BSC 4.30 0.45 1.0 REF 0.09 0.09 0.2 0° 12° REF 12° REF 0.004 0.004 0.008 0° 4.50 0.75 0.169 0.018 Max. 1.2 0.15 1.05 0.30 3.1 Min. 0.000 0.031 0.007 0.114
Inches Max. 0.047 0.006 0.041 0.012 0.122 0.026 BSC 0.252 BSC 0.177 0.030 0.039REF
8° 12° REF 12° REF
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Physical Specifications
Reflow Condition
(IR / Convection or VPR Reflow)
TP R am p-up
tp C ritical Zone T L to T P
T sm in R am p-down ts Preheat
t 25 °C to Peak
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak / Classificatioon Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C / second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3°C / second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds See table 2 20-40 seconds
6°C / second max. 6°C / second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005 8 www.anpec.com.tw
APM9966CO
Classification Reflow Profiles(Cont.)
Reliability Test Program
Carrier Tape & Reel Dimensions
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw
APM9966CO
Carrier Tape & Reel Dimensions(Cont.)
Application
B 62 +1.5 D 1.5 + 0.1
C 12.75+ 0.15 D1 1.5 + 0.1
TSSOP-8
Cover Tape Dimensions
Application TSSOP- 8 Carrier Width 12 Cover Tape Width 9.3 Devices Per Reel 2500
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. B.1 - Mar., 2005
www.anpec.com.tw