20V/6A, RDS(ON) =28m(typ.) =4.5V RDS(ON) =34m(typ.) =2.5V Descrip

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

20V/6A, RDS(ON) =28m(typ.) =4.5V RDS(ON) =34m(typ.) =2.5V Descrip

Datasheet Thumbnail

Top Searches for this datasheet

APM9922K
20V/6A, RDS(ON) =28m(typ.) =4.5V RDS(ON) =34m(typ.) =2.5V
Description
Super High Dense Cell Design Reliable Rugged Lead Free Available (RoHS Compliant) View
Applications
Power Management Notebook Computer, Portable Equipment Battery Powered Systems
N-Channel MOSFET
Ordering Marking Information
APM9922 Lead Free Code Handling Code Temp. Range Package Code Package Code SOP-8 Operating Junction Temp. Range Handling Code Tube Tape Reel Lead Free Code Lead Free Device Blank Original Device XXXXX Date Code
APM9922
APM9922 XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials 100% matte plate termination finish; which fully compliant with RoHS compatible with both SnPb lead-free soldiering operations. ANPEC lead-free products meet exceed lead-free requirements IPC/JEDEC STD-020C classification lead-free peak reflow temperature.
ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Jun., 2005 www.anpec.com.tw
APM9922K
Absolute Maximum Ratings
Symbol VDSS VGSS IDM* TSTG RJA*
Note: *Surface Mounted area, 10sec.
25°C unless otherwise noted)
Rating VGS=4.5V TA=25°C TA=100°C 62.5 °C/W Unit
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 300µs Pulsed Drain Current Diode Continuous Forward Current Maximum Junction Temperature Storage Temperature Range Maximum Power Dissipation Thermal Resistance-Junction Ambient
Electrical Characteristics
Symbol Parameter
25°C unless otherwise noted)
Test Condition
APM9922K Min. Typ. Max.
Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage IDSS VGS(th) IGSS Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current
VGS=0V, IDS=250µA VDS=16V, VGS=0V TJ=85°C VDS=VGS, IDS=250µA VGS=±10V, VDS=0V VGS=4.5V, IDS=6A VGS=2.5V, IDS=5.2A ISD=1.7A, VGS=0V
±100
RDS(ON) Drain-Source On-state Resistance VSDa Diode Forward Voltage
Gate Charge Characteristics Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS=10V, VGS=4.5V, IDS=6A
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Electrical Characteristics (Cont.)
Symbol Parameter
25°C unless otherwise noted)
APM9922K Min. Typ. Max.
Test Condition
Unit
Dynamic Characteristicsb Gate Resistance Ciss Coss Crss td(ON) td(OFF)
Notes:
VGS=0V,VDS=0V,F=1MHz VGS=0V, VDS=15V, Frequency=1.0MHz
Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time
VDD=10V, RL=10, IDS=1A, VGEN=4.5V, RG=6
Pulse test pulse width300µs, duty cycle2%. Guaranteed design, subject production testing.
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Typical Characteristics
Power Dissipation
Drain Current
Drain Current
Ptot Power
TA=25
TA=25 C,VG=4.5V
Junction Temperature (°C)
Junction Temperature (°C)
Safe Operation Area Normalized Transient Thermal Resistance
Thermal Transient Impedance
300µs 10ms
Duty
Drain Current
0.05 0.02 0.01
100ms
0.01
Single Pulse Mounted 62.5
0.01 0.01
TA=25
1E-3 1E-4
1E-3
0.01
Drain Source Voltage
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Typical Characteristics (Cont.)
Output Characteristics
VGS=
Drain-Source Resistance
RDS(ON) Resistance
VGS=10V VGS= 4.5V
Drain Current
0.5V
Drain-Source Voltage
Drain Current
Transfer Characteristics
Gate Threshold Voltage
=250µA
Tj=25 Tj=-55 Tj=125
Normalized Threshold Voltage
Drain Current
Gate Source Voltage
Junction Temperature (°C)
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Typical Characteristics (Cont.)
Drain-Source Resistance
VGS= 4.5V
Source-Drain Diode Forward
Normalized Resistance
Source Current
RON@Tj=25
Tj=150
Tj=25
Junction Temperature (°C)
Source Drain Voltage
Capacitance
Frequency=1MHz
Gate Charge
VDS=
Gate source Voltage
Capacitance (pF)
Ciss Coss Crss
Drain Source Voltage
Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Packaging Information
SOP-8 Reference JEDEC Registration MS-012)
0.004max.
Millimeters Min. 1.35 0.10 4.80 3.80 5.80 0.40 0.33 1.27BSC Max. 1.75 0.25 5.00 4.00 6.20 1.27 0.51 Min. 0.053 0.004 0.189 0.150 0.228 0.016 0.013
0.015X45
Inches Max. 0.069 0.010 0.197 0.157 0.244 0.050 0.020 0.50BSC
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material 90/10 63/37 SnPb), 100%Sn Meets Specification RSI86-91, ANSI/J-STD-002 Category
Reflow Condition
(IR/Convection Reflow)
Ramp-up
Critical Zone
Temperature
Tsmax
Tsmin Ramp-down Preheat
Peak
Time
Classification Reflow Profiles
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Time maintained above: Temperature Time (tL) Peak/Classificatioon Temperature (Tp) Time within actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds table 10-30 seconds Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds table 20-40 seconds
6°C/second max. 6°C/second max. minutes max. minutes max. Time 25°C Peak Temperature Notes: temperatures refer topside package .Measured body surface.
Copyright ANPEC Electronics Corp. Rev. Jun., 2005 www.anpec.com.tw
APM9922K
Classification Reflow Profiles(Cont.)
Table SnPb Entectic Process Package Peak Reflow Temperature Package Thickness Volume Volume <350 <2.5 +0/-5°C +0/-5°C +0/-5°C +0/-5°C
Table Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume Volume Volume <350 350-2000 >2000 <1.6 +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* *Tolerance: device manufacturer/supplier shall assure process compatibility including stated classification temperature (this means Peak reflow temperature +0°C. example 260°C+0°C) rated level.
Reliability Test Program
Test item SOLDERABILITY HOLT Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 1000 Bias 125°C Hrs, 100% 121°C -65°C 150°C, Cycles
Carrier Tape Reel Dimensions
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw
APM9922K
Carrier Tape Reel Dimensions(Cont.)
Application
330±1
12.75
12.4 +0.2
5.2±
1.75±
SOP-8
1.55±0.1 1.55+ 0.25
2.1± 0.3±0.013
Cover Tape Dimensions
Application SOP- Carrier Width Cover Tape Width
(mm)
Devices Reel 2500
Customer Service
Anpec Electronics Corp. Head Office Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. Jun., 2005
www.anpec.com.tw

20V/6A, RDS(ON) =28m(typ.) =4.5V RDS(ON) =34m(typ.) =2.5V Descrip

Top Searches for this datasheet

Other recent searches