ALIVH-B Layer structure Multilayer Printed Wiring Board adopts ba
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Series:ALIVH Type:
ALIVH-B
Layer structure Multilayer Printed Wiring Board adopts base material made high heat resistance nonwoven aramid interconnects between arbitrary layers filling small hole formed laser with copper paste. Industrial Property Patent
Properties
Base Material Thickness Board
Non-woven aramid fabric-epoxy resin
Features
High density pattern layer Via, High flatness, High reliability Conductor Thickness Hole Size Size Line/Space Dielectric Constant (1MHz) Density (DMA method)
Layers:0.90 Layers:0.70 Layers:0.40 Layers:0.15 min.150 min.250
Recommended Applications
MCM/CSP various usages substrate
min.50/50(Pad40/40) g/mL
Recognized Standards
Standard (File E36779) Base Type Flammability ANSI Grade min. Thickness (mm) min. Width (mm)
Coefficient Thermal Expansion
Conductor min. Edge Width (mm) max. Width (mm) Soldering Limits Rated Temp.
EBKN1 94V-0 0.305 0.051 0.102 19.8
These values designing.
ALIVH Bare chip mounting
Application
Suitable various methods
mounting
Wire Bonding. ACF. C-4. SBB. others.
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