High Sensitivity Hall Effect Sensor with Output On-chip Hall Sens
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APX9145
High Sensitivity Hall Effect Sensor with Output
On-chip Hall Sensor Build-in Output Zener Diodes Clamp Peak Output Voltage Build-in Frequency Generation Output High Output Sinking Capability 400mA High Sensitivilty Hall Effect Senser ±65G TO-92M Package Lead Free Available (RoHS Compliant)
General Description
APX9145 integrated Hall Effect Sensor frequenc generat elec commut ation brushless motor applications. X9145 available TO-92M4 package.
Outs
APX9145
Applications
Brushless
Front View
Ordering Marking Information
APX9145
Lead Free Code Handling Code Temp. Range Package Code
9145 XXXXX
Package Code 92M4 Operating Ambient Temp. Range Handling Code Plastic Tape Tape Reel Lead Free Code Lead Free Device Blank Original Device XXXXX Date Code
APX9145
ANPEC d-free prod ucts contain attach rmin atio nish full compl iant with compa tibl both SnPb ad-free sold ieri ad-free produ exceed -free uireme /JEDEC classi ficati d-fre temp ture.
ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. opyright ANPEC Electronics orp. Rev. Nov., 2005 www.anpec.com.tw
APX9145
Block Diagram
APX9145
Temperature Compensated Current Amplifier Zener Diodes
Voltage Regulator
Hall Element
Latch Circuit
Output Buffer Output Buffer Zener Diodes
Rotation Frequency Detection
Hysteresis Control Sensitivity Control
Description
Name Coil output Power input Coil output Power input ground Description Open collector rotation frequency detection
Absolute Maximum Ratings
Symbol VOFF IOUT TSTG Voltage Sink Current Output Current Maximum Power Dissipation Junction Temperature Range Storage Temperature Range Soldering Temperature Sec.) Parameter Supply Voltage (DO/DOB Voltage)
25°C unless otherwise noted)
Rating
Unit
Note Stresses beyond absolute maximum rating damage devic operating absolute maximum rating conditions affect device reliability. Note maximum allowable power dissipation (ambient temperature) calculated using: (max) 125°C. Exceeding maximum allowable power dissipation will result excessive temperature.
opyright ANPEC Electronics orp. Rev. Nov., 2005 www.anpec.com.tw
APX9145
Recommended Operating Conditions
Symbol VOFF Parameter Supply voltage (DO/DOB Voltage) Maximum Output Sink Current Maximum Sink Current Maximum Voltage Operating Ambient Temperature Junction Temperature Range
25°C)
Rating
Unit
Electrical Characteristics
Symbol VSAT IOFF Vclamp Parameter Output Saturation Voltage Supply Current Leakage Current Saturation Voltage Clamp Output Voltage Output Rise Time Output Fall Time Propagation Delay Time
25°C, VCC=12V unless otherwise noted)
Test Condition IOUT 400mA
APX9145 Min. Typ. Max.
Unit
200, 10pF 200, 10pF 200, 10pF
Magnetic Characteristics
Symbol Parameter Magnetic Operate Points Magnetic Release Points
25°C, VCC=12V unless otherwise noted)
Test Condition
APX9145 Min. Typ. Max.
Unit Gauss Gauss
opyright ANPEC Electronics orp. Rev. Nov., 2005
www.anpec.com.tw
APX9145
Test Circuit
IOFF
Note Measure VCC, when off. Note Measure VON, when Note Measure IOFF when off.
Application Circuit
Typical brushless applicat circuit
APX9145
opyright ANPEC Electronics orp. Rev. Nov., 2005
www.anpec.com.tw
APX9145
Typical Characteristics
25°C, VCC=12V unless otherwise noted)
Supply Current Supply Voltage
Supply Current Temperature
11.5
Supply Current (mA)
Supply Current (mA)
10.5
Supply Voltage
Temperature (°C)
Magnetic Switching Points Supply Voltage
Magnetic Switching Points Temperature
Magnetic Switching Points
Magnetic Switching Points
Supply Voltage
Temperature (°C)
opyright ANPEC Electronics orp. Rev. Nov., 2005
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APX9145
Typical Characteristics (Cont.)
Output Current Output Saturation Voltage
0.15 0.45 0.75
Sink Current Saturation Voltage
Sink Current (mA)
Output Current (mA)
0.15
0.25
Output Saturation Voltage
Saturation Voltage(V)
Power Dissipation Temperature
Power Dissipation (mW)
Temperature (°C)
opyright ANPEC Electronics orp. Rev. Nov., 2005
www.anpec.com.tw
APX9145
Package Information
TO-92M4
Marking Surface
1.35mm 1.75mm
chip
Sensitive Area 0.286mm2) Position Hall Sensor reference top-left package 1.35 0.1mm 1.75± 0.1mm
Millimeters Min. 3.60 0.35 0.351 5.17 3.78 1.24 1.50 4.04 14.0 1.342 0.45 Max. 3.70 0.41 0.411 5.27 3.84 1.30 1.60 4.34 15.0 1.542 0.55 Min. 0.141 0.014 0.014 0.203 0.148 0.049 0.059 0.158 0.549 0.053 0.018
Inches Max. 0.145 0.016 0.016 0.207 0.150 0.051 0.063 0.170 0.588 0.060 0.022
opyright ANPEC Electronics orp. Rev. Nov., 2005
www.anpec.com.tw
APX9145
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material 90/10 63/37 SnPb), 100%Sn Meets Specification RSI86-91, ANSI/J-STD-002 Category
(IR/Convection Reflow)
Reflow Condition
Critical Zone
Ramp-up
Temperature
Tsmax
Tsmin Ramp-down Preheat
Peak
Time
Classificatin Reflow Profiles
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate 3°C/second max. 3°C/second max. Preheat 100°C 150°C Temperature (Tsmin) 200°C Temperature (Tsmax) 60-120 seconds 60-180 seconds Time (min max) (ts) Time maintained above: 183°C 217°C Temperature (TL) 60-150 seconds 60-150 seconds Time Peak/Classificatioon Temperature (Tp) table table Time within actual 10-30 seconds 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6°C/second max. 6°C/second max. minutes max. minutes max. Time Peak Temperature Notes: temperatures refer topside package .Measured body surface.
opyright ANPEC Electronics orp. Rev. Nov., 2005 www.anpec.com.tw
APX9145
Classificatin Reflow Profiles (Cont.)
Table SnPb Entectic Process Package Peak Reflow Temperatures Package Thickness Volume Volume <350 <2.5 +0/-5 +0/- +0/-5 +0/-
Table Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume Volume Volume <350 -2000 >2000 <1.6 *Tolerance: device manufacturer/supplier shall assure process compatibility including stated classification temperature (this means Peak reflow temperature example rated level.
Reliability test program
Test item SOLDERABILITY HOLT Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD Description 245° 1000 Bias Hrs, -65° 150°C, Cycles VHBM 2KV, 200V 10ms 100mA
Carrier Tape Reel Dimensions
opyright ANPEC Electronics orp. Rev. Nov., 2005
www.anpec.com.tw
APX9145
Carrier Tape Reel Dimensions (Cont.)
Application
3.18~12
90±1 4.0±0.2
76±1 0.36~0.53
30±1
90±1 F1=F2 2.5+0.2 -0.1 H5=H0+M 18.5±0.5
31±1 F1-F2 ±0.3 11.0
76±1 2.5±0.5 18.0±0.2
16±0.5 12.7±0.3 6.0±0.2
9±0.5 6.35±0.4
TO-92
27.0 20.0
50.8±0.5 0.55 1.42 0.36~0.68
(mm)
Cover Tape Dimensions
Application TO-92 Carrier Width 17.5~19 Cover Tape Width 5.0~7.0 Devices Reel 2000 (mm)
Customer Service
Anpec Electronics Corp. Head Office No.6, Dusing Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369
opyright ANPEC Electronics orp. Rev. Nov., 2005
www.anpec.com.tw
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