Hall Effect Micro Switch Micro Power Operation Battery Applicatio
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APX9131
Hall Effect Micro Switch
Micro Power Operation Battery Applications Chopper Stabilized Amplifier Independent North South Pole Magnet, Easy Manufacture Small Size Package Lead Free Available (RoHS Compliant)
General Description
APX9131 integrated circuit ultra-sensitive, pole independent Hall-effect switch with latched digital output. volt volt operation unique clocking scheme reduce average operating power requirements. Either north south pole sufficient flux will turn output absence magnetic field, output off. polarity independence minimal power requirement allow this device easily replaced reed switch superior signal conditioning. Advanced CMOS processing used take antage low-voltage low-power requirements, SOT-23 TO-92 packages provide optimized package most applications.
Applications
Micro Switch Handheld Wireless Application Wake Switch Clamp Shell Type Application Switch Magnet Switch Duty Cycle Applications
Description
APX9131
VOUT TO-92M3 Front View
VOUT
Ordering Information
APX9131
Lead Free Code Handling Code Temp. Range Package Code APX9131 A/AT: X31X Date Code
SOT-23
Package Code SOT-23 SOT-23 Thin TO-92M3 Operating Ambient Temp. Range Handling Code Tape Reel Lead Free Code Lead Free Device Blank Original Device APL9131 9131 XXXXX XXXXX Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials 100% matte plate termination finish; which fully compliant with RoHS compatible with both SnPb lead-free soldiering operations. ANPEC lead-free products meet exceed lead-free requirements IPC/JEDEC STD-020C classification lead-free peak reflow temperature.
ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Sep., 2005 www.anpec.com.tw
APX9131
Function Descriptions
Name Function Power Input When magnetic field enters hall element exceeds operate point BOPS less than BOPN) output turns (output low). When magnetic field below release point BRPS above BRPN), output turns (output high). design with open drain configuration connecting pull resistor from VOUT necessary. cannot floating. Ground Connection
VOUT
Block Diagram
Awake Sleep Timing Logic VOUT Hall Plane Dynamic Offset Cancellation
Latch Circuit
Chopper Amplifier
Hysteresis Control
Typical Applications
VOUT
2.5V-3.5V 0.1uF
APX9131
SOT-23 (Top View)
Copyright ANPEC Electronics Corp. Rev. Sep., 2005 www.anpec.com.tw
APX9131
Absolute Maximum Ratings
Symbol VOUT TSTG Parameter Supply Voltage Output Voltage Junction Temperature Range Storage Temperature Range
25°C unless otherwise noted)
Rating +150 Unit
Electrical Characteristics
Symbol IOFF tawake tperiod d.c. Characteristic Supply Voltage Range Supply Current
25°C, VDD=3V unless otherwise noted)
APX9131 Min. Typ. Max.
Test Condition Operating Average Awake sleep VOUT 3.5V, BRPN<B<BRPS ISINK
Unit
Output Leakage Current Output Voltage Wake Time Period Duty Cycle Chopping Frequency
Magnetic Characteristics
25°C, VDD=3V unless otherwise noted)
Symbol BOPS BOPN BRPS BRPN Bhys
Characteristic
Test Condition
APX9131 Min. Typ. Max.
Unit
Operate Points Release Points Hysteresis
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
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APX9131
Typical Characteristics
Switching Points Ambient Temperature
BOPS
Switching Points Supply Voltage
TA=25°C
BOPS
Switching Points
BRPS
Switching Points
BRPS
BOPN BRPN
BOPN BRPN
Ambient Temperature (°C)
Supply Voltage
Average Supply Current Ambient Temperature
Average Supply Current vs.Supply Voltage
TA=25°C
Average Supply Current (uA)
Ambient Temperature (°C)
Average Supply Current (uA)
Supply Voltage
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
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APX9131
Typical Characteristics
Output Sink Current Output Voltage
VDD=5V
Output Switch Waveform
Output Sink Current (mA)
VDD=3V
Output Sink Voltage (0.5V/div)
VDD=4V
VDD=3V RL=5.1k CL=12pF
VOUT=0.5V/div
Output Voltage
Time (2us/div)
Output Switch Waveform
Output Sink Voltage (0.5V/div)
VDD=3V RL=5.1k CL=12pF
VOUT=0.5V/div
Time (50us/div)
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
APX9131
Function Description
Operation output APX9131 switches (turns when presence strong flux density facing marked side package exceeds operate point BOPS less than BOPN). After turn-on, output capable sinking output voltage (turns on). absence flux density below release point BRPS increased above BRPN), APX9131 output switches high (turns off). difference magnetic operated released point hysteresis (Bhys) device. This built-in hysteresis allows clean switching output even presence external mechanical bouncing vibration electrical noise. Pole-independent pole-independent sensing technique allows operation with either north south pole magnet orientation, enhancing manufacturability device. state-of-the-art technology provides same output polarity either pole presence. Awake Sleep Internal awake sleep timing block circuit activates sensor deactivates remainder period ms). short "awake" time allows stabilization prior sensor sampling data latching falling edge timing pulse. While sleep cycle output latched previous state. Chopper Stabilized Technique
BOPS
OUTPUT OUTPUT VOLTAGE BOPN
chopper stabilized technique cancels mismatching hall element, amplifier offset voltage temperature sensitive drift dynamic offset cancellation switched capacitor technique. This technique produces devices have extremely stable Hall output voltage, therefore magnetic switch points stable.
BRPN MAGNETIC FLUX BRPS OUTPUT
Application Information
strongly recommended that external bypass capacitor connected close Hall sensor) between supply ground device reduce both external noise noise generated chopper-stabilization technique. This especially true relatively high impedance battery supplies.The output open drain output, must connected pull-up resistor supply voltage which lower than connect resistor common use.
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
APX9131
Packaging Information
SOT-23
Millimeters Min. 1.00 0.00 0.35 0.10 2.70 1.40 1.90/2.1 BSC. 2.40 0.37 3.00 Max. 1.30 0.10 0.51 0.25 3.10 1.80 Min. 0.039 0.000 0.014 0.004 0.106 0.055
Inches Max. 0.051 0.004 0.020 0.010 0.122 0.071 0.075/0.083 BSC. 0.094 0.118 0.015
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
APX9131
Package Information
SOT-23 Thin
Millimeters Min. 0.70 0.00 0.70 0.35 0.10 2.80 2.60 1.50 0.95 1.90 0.37 0.60 0.10 0.004 0.015 Max. 0.90 0.10 0.80 0.51 0.25 3.00 3.00 1.70 Min. 0.028 0.000 0.028 0.014 0.004 0.110 0.102 0.059
Inches Max. 0.035 0.004 0.031 0.020 0.010 0.118 0.118 0.067 0.0374 0.0748 0.0236
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
APX9131
Package Information
TO-92M3
OVERLOOK FRONT OUTPUT RIGHT-SIDE LOOK
Millimeters Min. 1.40 0.35 2.80 1.24 3.90 2.34 4.04 0.35 2.51 0.63 Max. 1.60 0.41 3.20 1.30 4.30 2.64 4.24 0.41 2.57 0.81 Min. 0.055 0.394 0.551 0.014 0.110 0.049 0.154 0.092 0.159 0.014 0.099 0.025
Inches Max. 0.063 0.433 0.591 0.016 0.126 0.051 0.169 0.104 0.167 0.016 0.101 0.032
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
APX9131
Physical Specifications
Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material 90/10 63/37 SnPb), 100%Sn Meets Specification RSI86-91, ANSI/J-STD-002 Category 3000 devices reel
Reflow Condition
(IR/Convection Reflow)
Critical Zone
Ramp-up
Temperature
Tsmax
Tsmin Ramp-down Preheat
Peak
Time
Classificatin Reflow Profiles
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Time maintained above: Temperature Time (tL) Peak/Classificatioon Temperature (Tp) Time within actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds table 10-30 seconds Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds table 20-40 seconds
6°C/second max. 6°C/second max. minutes max. minutes max. Time 25°C Peak Temperature Note: temperatures refer topside package .Measured body surface.
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Copyright ANPEC Electronics Corp. Rev. Sep., 2005
APX9131
Classificatin Reflow Profiles(Cont.)
Table SnPb Entectic Process Package Peak Reflow Temperature Package Thickness Volume Volume <350 <2.5 +0/-5°C +0/-5°C +0/-5°C +0/-5°C
Table Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume Volume Volume <350 350-2000 >2000 <1.6 +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* *Tolerance: device manufacturer/supplier shall assure process compatibility including stated classification temperature (this means Peak reflow temperature +0°C. example 260°C+0°C) rated level.
Reliability test program
Test item SOLDERABILITY HOLT Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD Description 245°C 1000 Bias Hrs, 121°C -65°C 150°C, Cycles VHBM 2KV, 200V 10ms 100mA
Carrier Tape Reel Dimensions
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
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APX9131
Carrier Tape Reel Dimensions(Cont.)
Application
178±1
12.0 0.1MIN 12.0 1.1±0.1 76±1
0.15 0.15 4.0±0.1 30±1
0.05 0.05 90±1 F1=F2 2.5+0.2 -0.1 H5=H0+M 18.5±0.5
3.3±0.1 31±1 F1-F2 ±0.3 11.0
SOT-23
8.0+ 8.0+ 3.2±0.1 76±1 2.5±0.5 18.0±0.2
4.0±0.1 1.1±0.1 16±0.5 12.7±0.3 6.0±0.2
1.75 0.2±0.03 1.75±0.1 0.25±0.05 9±0.5 6.35±0.4
0.05 +0.1 Application 178±1 SOT-23 Thin 0.05 Application 3.18~12 TO-92 1.55+ 0.05 90±1 4.0±0.2
0.36~0.53
27.0 20.0
50.8±0.5 0.55 1.42 0.36~0.68
(mm)
Cover Tape Dimensions
Application SOT- SOT- Thin TO-92
Carrier Width 17.5~19
Cover Tape Width 5.0~7.0
Devices Reel 3000 3000 2000 (mm)
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
APX9131
Customer Service
Anpec Electronics Corp. Head Office No.6, Dusing Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. Sep., 2005
www.anpec.com.tw
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