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Synchronous Buck Linear Controller with 0.8V Reference Voltage Re
Top Searches for this datasheetAPW7068 Synchronous Buck Linear Controller with 0.8V Reference Voltage Regulated Voltages REF_OUT Synchronous Buck Converter Linear Regulator REF_OUT 0.8V±1% with source current General Description APW7068 integrates synchronous buck PWM, linear controller, 0.8V Reference Voltage, well monitoring protection functions into single package. fixed 300KHz switching frequency synchronous controller drives dual N-channel MOSFETs, which provides controlled power output with over-voltage over-current protections. Linear controller drives external N-channel MOSFET with under-voltage protection. APW7068 provides excellent regulation output load variation. internal 0.8V temperaturecompensated reference voltage designed meet requirement output voltage applications. APW7068 with excellent protection functions: POR, OCP, UVP. Power-On Reset (POR) circuit monitor VCC12 supply voltage exceeds threshold voltage while controller running, built-in digital soft-start provides both outputs with controlled rising voltage. Over-Current Protection (OCP) monitors output current using voltage drop across lower MOSFET' RDS(ON), comparing with voltage OCSET pin. When output current reaches trip point, controller will Single Power Supply Required Excellent Both Output Voltage Regulation 0.8V Internal Reference Over Line Voltage Temperature Integrated Soft-Start Linear Outputs 300KHz Fixed Switching Frequency Voltage Mode Control Design 89%(Typ.) Duty Cycle Under-Voltage Protection Monitoring Linear Output Over-Voltage Protection Monitoring Output Over-Current Protection Output Sense Low-side MOSFET' RDS(ON) SOP-14, QSOP-16 QFN-16 packages Lead Free Available (RoHS Compliant) Applications Graphic Cards shutdown directly, latch converter' output. Under-Voltage Protection (UVP) monitors voltage short-circuit protection. When VFBL less than VREF, controller will shutdown directly. Over-Voltage Protection (OVP) monitors voltage When over 135% REF, controller will make Lowside gate signal fully turn until fault events removed. ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Pinouts FS_DIS UGATE PHASE Metal (Bottom) AGND DGND VCC12 VCC12 BOOT BOOT FS_DIS COMP DRIVE UGATE PHASE PGND LGATE OCSET REF_OUT VCC12 BOOT FS_DIS COMP DRIVE SOP-14 VIEW UGATE PHASE PGND LGATE OCSET REF_OUT VCC12 VCC12 DRIVE COMP PGND LGATE OCSET REF_OUT QSOP-16 VIEW QFN-16 VIEW Ordering Marking Information APW7068 Lead Free Code Handling Code Temp. Range Package Code APW7068 APW7068 APW7068 XXXXX APW7068 XXXXX APW7068 XXXXX Package Code QSOP Temp. Range Handling Code Tube Tape Reel Tray (for only) Lead Free Code Lead Free Device Blank Original Device XXXXX Date Code XXXXX Date Code APW7068 XXXXX Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials 100% matte plate termination finish; which fully compliant with RoHS compatible with both SnPb lead-free soldering operations. ANPEC lead-free products meet exceed lead-free requirements IPC/JEDEC STD-020C classification lead-free peak reflow temperature. Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Block Diagram VCC12 OCSET IOCSET 40uA REF_OUT Reference Buffer Regulator Power-On Reset BOOT VREF (0.8V) 135%VREF X1.35 Soft Start Fault Logic O.C.P Comparator UGATE O.V.P Comparator PHASE Sense Side Gate Control LGATE Error PGND Comparator U.V.P Comparator 50%VREF VREF Oscillator Sawtooth Wave (300KHz) VREF Error DRIVE COMP FS_DIS Absolute Maximum Ratings Symbol VCC12 BOOT UGATE LGATE PHASE DRIVE VCC12 BOOT PHASE UGATE PHASE LGATE PGND PHASE DRIVE <400ns pulse width >400ns pulse width <400ns pulse width >400ns pulse width <400ns pulse width >400ns pulse width Parameter Rating -0.3 -0.3 BOOT+5 -0.3 BOOT+0.3 VCC12+5 -0.3 VCC12+0.3 -0.3 -0.3 Unit www.anpec.com.tw FBL, COMP, FBL, COMP, FS_DIS FS_DIS Copyright ANPEC Electronics Corp. Rev. Jun., 2006 APW7068 Absolute Maximum Ratings (Cont.) Symbol PGND TSTG TSDR VESD PGND Junction Temperature Range Storage Temperature Soldering Temperature Seconds) Minimum Rating Parameter Rating -0.3 +0.3 +150 Unit NOTE1: Absolute Maximum Ratings those values beyond which life device impaired. Exposure absolute maximum rating conditions extended periods affect device reliability. NOTE2: device sensitive. Handling precautions recommended. Recommended Operating Conditions Symbol VCC12 VIN1 VOUT1 IOUT1 IOUT2 Supply Voltage Converter Input Voltage Converter Output Voltage Converter Output Current Linear Output Current Ambient Temperature Range Junction Temperature Range Parameter Rating 10.8 13.2 13.2 Unit Electrical Characteristics Unless otherwise specified, these specifications apply over VCC12=12V, =-20~70°C. Typical values TA=25°C. Symbol Parameter Test Conditions APW7068 Unit INPUT SUPPLY CURRENT VCC12 Supply Current (Shutdown mode) VCC12 Supply Current POWER-ON RESET Rising VCC12 Threshold Falling VCC12 Threshold OSCILLATOR Accuracy FOSC VOSC Duty Oscillator Frequency Ramp Amplitude Maximum Duty Cycle ICC12 UGATE, LGATE DRIVE open; FS_DIS=GND UGATE, LGATE DRIVE open (nominal 1.2V 2.7V) (NOTE3) Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Electrical Characteristics (Cont.) Unless otherwise specified, these specifications apply over VCC12=12V, =-20~70°C. Typical values TA=25°C. Symbol REFERENCE VREF Parameter Test Conditions APW7068 Unit Reference Voltage Reference Voltage Tolerance Load Regulation Linear Load Regulation Error Amp1 Amp2 IOUT1=0 IOUT2=0 RL=10k, CL=10pF (NOTE3) RL=10k, CL=10pF (NOTE3) RL=10k, CL=10pF (NOTE3) VFB=0.8V 0.792 0.80 0.808 V/us V/us ERROR AMPLIFIER Gain GBWP VCOMP VCOMP ICOMP ICOMP Open Loop Gain Open Loop Bandwidth Slew Rate Input Current COMP High Voltage COMP Voltage COMP Source Current COMP Sink Current COMP=2V COMP=2V BOOT=12V, UGATE-PHASE VCC12=12V, LGATE=2V 2.25 3.375 1.05 2.25 3.375 GATE DRIVERS IUGATE Upper Gate Source Current IUGATE ILGATE ILGATE RUGATE RUGATE RLGATE RLGATE Gain GBWP VDRIVE VDRIVE IDRIVE IDRIVE Upper Gate Sink Current Lower Gate Source Current Lower Gate Sink Current Upper Gate Sink Impedance Lower Gate Sink Impedance Dead Time Open Loop Gain Open Loop Bandwidth Slew Rate Input Current DRIVE High Voltage DRIVE Voltage DRIVE Source Current DRIVE Sink Current Upper Gate Source Impedance BOOT=12V, IUGATE=0.1A BOOT=12V, IUGATE=0.1A VCC12=12V, ILGATE=0.1A Lower Gate Source Impedance VCC12=12V, ILGATE=0.1A LINEAR REGULATOR RL=10k, CL=10pF (NOTE3) RL=10k, CL=10pF (NOTE3) RL=10k, CL=10pF (NOTE3) VFBL=0.8V DRIVE=5V DRIVE=5V Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Electrical Characteristics (Cont.) Unless otherwise specified, these specifications apply over VCC12=12V, =-20~70°C. Typical values TA=25°C. Symbol PROTECTION Parameter Test Conditions APW7068 0.792 0.800 0.808 0.25 Unit VFB-OV Over Voltage Protection Trip Point IOCSET OCSET Current Source Internal Soft-Start Interval (NOTE3) Percent VREF VFBL-UV Under Voltage Protection Trip Point Percent VREF SOFT START FOSC=300kHz REF_OUT VREF_OUT Output Voltage Offset Voltage IREF_OUT Source Current Sink Current Output Capacitance NOTE3: Guaranteed design. Typical Application Circuit 2.2nF 3.9K 2N7002 ON/OFF APM2509 CIN1 470uFx2 VIN1 0.01uF 0.1uF 1.5K VOUT1 1.2V VOUT1 22nF BOOT FS_DIS COMP DRIVE UGATE PHASE 2.2nF VIN2 3.3V RGND1 COUT1 470uFx2 PGND LGATE OCSET REF_OUT VCC12 APM2506 CIN2 470uF APM3055 VOUT2 2.5V 2.5K APW7068 RGND2 1.17K COUT2 470uF specific application Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Function Descriptions VCC12 Power supply input pin. Connect nominal power supply this pin. power-on reset function monitors input voltage this pin. recommended that decoupling capacitor 10µF) connected noise decoupling. BOOT This provides bootstrap voltage upper gate driver driving N-channel MOSFET. external capacitor from PHASE BOOT, internal diode, power supply valtage VCC12, generates bootstrap voltage upper gate diver (UGATE). PHASE This return path upper gate driver. Connect this upper MOSFET source, connect capacitor BOOT bootstrap voltage. This also used monitor voltage drop across lower MOSFET over-current protection. This signal ground pin. Connect good ground plane. PGND This power ground lower gate driver. should tied board. COMP This output error amplifier. used compensation components. This inverting input error amplifier. used output voltage compensation components. This also monitored over-voltage protection. When voltage over 135% reference voltage, controller will make Low-side gate signal fully turn until fault events removed. UGATE This gate driver upper MOSFET output. Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw LGATE This gate driver lower MOSFET output. DRIVE This drives gate external N-channel MOSFET linear regulator. also used compensation some specific applications,for example, with values output capacitance ESR. This inverting input linear regulator error amplifier. used output voltage. This also monitored under-voltage protection. When voltage under reference voltage (0.4V), both outputs will shutdown immediately. OCSET Connect resistor (Rocset) from this GND, internal 40uA current source will flow through this resistor create voltage drop. When VCC12 reaches rising threshold voltage, voltage drop Rocset will memoried compared with voltage across lower MOSFET. threshold over current limit therefore given ILIMIT IOCSET ROCSET RDS(ON)(LOW Side) REF_OUT This provides buffed voltage, which from internal reference voltage. recommended that capacitor connected ground stability. FS_DIS This provides shutdown function. open drain logic signal pull this disable both outputs, leave open enable both outputs. APW7068 Typical Characteristics Power VCC12=12V, Vin1=12V,Vin2=3.3V Vo1=1.2V,Vo2=2.5V, L=1uH Power VCC12=12V, Vin1=12V,Vin2=3.3V Vo1=1.2V,Vo2=2.5V, L=1uH CH1: VCC12 (10V/div) CH2: (1V/div) CH3: (2V/div) Time: 10ms/div CH1: VCC12 (10V/div) CH2: (1V/div) CH3: (2V/div) Time: 10ms/div VCC12=12V, Vin1=12V,Vin2=3.3V Vo1=1.2V,Vo2=2.5V,L=1uH Shutdown(FS_DIS=GND) VCC12=12V, Vin1=12V,Vin2=3.3V Vo1=1.2V,Vo2=2.5V,L=1uH CH1: FS_DIS (1V/div) CH2: Drive (5V/div) CH3: (1V/div) CH4: (2V/div) Time: 10ms/div CH1: FS_DIS (1V/div) CH2: Drive (5V/div) CH3: (1V/div) CH4: (2V/div) Time: 10ms/div Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Typical Characteristics (Cont.) UGATE Rising Vcc12=12V, Vin1=12V, Vo1=1.2V UGATE Falling Vcc12=12V, Vin1=12V, Vo1=1.2V CH1: (20V/div) CH2: Phase (10V/div) CH3: (10V/div) Time: 50ns/div CH1: (20V/div) CH2: Phase (10V/div) CH3: (10V/div) Time: 50ns/div OVP_PWM Controller 135% VREF) Vcc12=12V, Vin1=12V Vo1=1.2V, Vo2=2.5V,L=1uH UVP_Linear Regulator (FBL< VREF) VCC12=12V, Vin2=3.3V Vo2=2.5V, Io2=3A CH1: (20V/div) CH2: (10V/div) CH3: (500mV/div) CH4: (2V/div) Time: 10ms/div CH1: (1V/div) CH2: Drive (5V/div) CH3: (2V/div) Time: 100us/div Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Typical Characteristics (Cont.) Load Transient Response(PWM Controller) VCC12=12V, Vin1=12V, Vo1=2V, Fosc=300KHz slew rate= A/us CH1: (100mV/div,AC) CH2: (20V/div) CH3: Io1(10A/div) Time: 20us/div CH1: (100mV/div,AC) CH2: (20V/div) CH3: Io1(10A/div) Time: 50us/div CH1: (100mV/div,AC) CH2: (20V/div) CH3: Io1(10A/div) Time: 20us/div Load Transient Response(Linear Regulator) VCC12=12V, Vin2=3.3V, Vo2=2.5V slew rate= 3A/us CH1: (100mV/div,AC) CH2: Io2(2A/div) Time: 1us/div CH1: (100mV/div,AC) CH2: Io2(2A/div) Time: 10us/div CH1: (100mV/div,AC) CH2: Io2(2A/div) Time: 1us/div Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Typical Characteristics (Cont.) Over Current Protection VCC12=12V, Vin1=12V, Vo1=1.2V,Vin2=3.3V, Vo2=2.5V, L=1uH, COUT=470uFx2 Rocset=1K Rds(on)=4m Short Test after Power Ready VCC12=12V, Vin1=12V, Vo1=1.2V,Vin2=3.3V, Vo2=2.5V, L=1uH, COUT=470uFx2 Rocset=1K Rds(on)=4m CH1: (1V/div) CH2: Drive (5V/div) CH3: (20V/div) CH4: (10A/div) Time: 50us/div CH1: (1V/div) CH2: Drive (5V/div) CH3: (20V/div) CH4: (10A/div) Time: 50us/div Short Test before Power VCC12=12V, Vin1=12V,Vin2=3.3V Vo1=1.2V,Vo2=2.5V,L=1uH 0.804 VREF Junction Temperature COUT=470uFx2 0.8035 Reference Voltage(V) 0.803 0.8025 0.802 VREF 0.8015 0.801 0.8005 CH1: VCC12 (10V/div) CH2: (1V/div) CH3: (20V/div) CH4: (10A/div) Time: 2ms/div Copyright ANPEC Electronics Corp. Rev. Jun., 2006 Junction Temperature www.anpec.com.tw APW7068 Typical Characteristics (Cont.) UGATE Source Current UGATE Voltage UGATE Sink Current UGATE Voltage UGATE Source Current VBOOT=12V VBOOT=12V UGATE Sink Current PHASE=0V PHASE=0V UGATE Voltage UGATE Voltage LGATE Source Current LGATE Voltage LGATE Sink Current LGATE Voltage LGATE Source Current VCC=12V VCC=12V LGATE Sink Current LGATE Voltage LGATE Voltage Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Function Descriptions Power Reset (POR) Power-On Reset (POR) function APW7068 continually monitors input supply voltage (VCC12), ensures supply voltage exceed rising threshold voltage. function initiates soft-start interval operation while VCC12 voltages exceed their threshold inhibits operation under disabled status. Soft-Start Figure shows soft-start interval. When VCC12 reaches rising threshold voltage, internal reference voltage controlled follow voltage proportional soft-start voltage. soft-start interval variable oscillator frequency. formulation given Voltage(V) Time VOUT1 VOUT2 VCC12 Voltage(V) Figure Soft-Start Interval 20mV 32/Fosc Figure shows more detail voltage ramps. voltage soft-start ramps formed with many small steps voltage. voltage step about 20mV FBL, period step about 64/FOSC. This method provides controlled voltage rise prevents large peak current charge output capacitor. voltage compares voltage shift earlier time establishment Figure2. voltage estabilishment time difference variable oscillator. formulation given Over-Current Protection 32/Fosc 20mV Time Figure Controlled Stepped Voltage during Soft-Start Connect resistor (Rocset) from this GND, internal 40uA current source will flow through this resistor create voltage drop, which will compared with voltage across lower MOSFET. FOSC When voltage across lower MOSFET exceeds voltage drop across ROCSET, over-current condition detected controller will shutdown directly, converter's output latched. Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Function Descriptions Over-Current Protection (Cont.) threshold over current limit therefore given voltage over 135% reference voltage, controller will make Low-Side gate signal fully turn until fault events removed. ILIMIT IOCSET ROCSET RDS(ON)(LOW Side) Under Voltage Protection monitored during converter operation Under Voltage(UV) comparator. voltage drop below reference voltage (50% 0.8V 0.4V), fault signal internally generated, device turns both highside low-side MOSFET converter' outs latched floating. controller will shutdown directly. Shutdown Enable Pulling FS_DIS voltage open drain transistor, shown typical application circuit, shutdown APW7068 controller. shutdown mode, UGATE LGATE turn pull PHASE respectively. over-current never occurred normal operating load range; variation parameters above equation should determined. MOSFET' RDS(ON) varied temperature gate source voltage, user should determine maximum RDS(ON) manufacturer' datasheet. minimum IOCSET (36uA) minimum ROCSET should used above equation. Note that ILIMIT current flow through lower MOSFET; ILIMIT must greater than maximum output current half inductor ripple current. Over Voltage Protection monitored during converter operation Over Voltage(OV) comparator. Application Information Output Voltage Selection output voltage converter programmed with resistive divider. better resistors resistive divider recommended. inverter input error amplifier, reference voltage 0.8V. output voltage determined linear regulator output voltage VOUT2 also means external resistor divider. inverter input error amplifier, reference voltage 0.8V. output voltage determined VOUT1 GND1 Where resistor connected from VOUT1 RGND1 resistor connected from GND. Copyright ANPEC Electronics Corp. Rev. Jun., 2006 VOUT2 GND2 Where resistor connected from VOUT2 RGND2 resistor connected from GND. www.anpec.com.tw APW7068 Application Information (Cont.) Linear Regulator Input/Output Capacitor Selection input capacitor chosen based voltage rating. Under load transient condition, input capacitor will momentarily supply required transient current. output capacitor linear regulator chosen minimize droop during load transient condition. addition, capacitor chosen based voltage rating. Linear Regulator Input/Output MOSFET Selection maximum DRIVE voltage about when VCC12 equal 12V. Since this drives external N-channel MOSFET, therefore maximum output voltage linear regulator dependent upon VGS. OUT2MAX Another criterion efficiency heat removal. power dissipated MOSFET given PHASE OUTPUT1 loop. compensation network among COMP, VOUT1 should added. compensation network shown Fig. output filter consists output inductor output capacitors. transfer function filter given GAINLC COUT1 COUT1 COUT1 poles zero this transfer functions are: OUT1 FESR OUT1 double poles filter, FESR zero introduced output capacitor. IOUT2 (VIN OUT2 Where IOUT2 maximum load current, VOUT2 nominal output voltage. some applications, heatsink might required help maintain junction temperature MOSFET below maximum rating. Linear Regulator Compensation Selection linear regulator stable over loads current. However, transient response further enhanced DRIVE pin. Depending output capacitance load current application, value this network then varied. Compensation output filter step down converter introduces double pole, which contributes with -40dB/decade gain slope degrees phase shift control Copyright ANPEC Electronics Corp. Rev. Jun., 2006 Frequency(Hz) GAIN (dB) -40dB/dec COUT1 Figure Output Filter connecting network between FESR -20dB/dec Figure Filter GAIN Frequency www.anpec.com.tw APW7068 Application Information (Cont.) Compensation (Cont.) modulator shown Figure input output error amplifier output PHASE node. transfer function modulator given OUT1 COMP GAINPWM VIN1 VOSC Driver Figure Compensation Network closed loop gain converter written GAINLC GAINPWM GAINAMP PHASE VOSC Comparator Output Error Amplifier Driver Figure shows asymptotic plot closed loop converter gain, following guidelines will help design compensation network. Using below guidelines should give compensation similar curve plotted. stable closed loop -20dB/ decade slope phase margin greater than degree. 1.Choose value usually between 2.Select desired zero crossover frequency (1/5 1/10) >FO>FESR following equation calculate VOSC Figure Modulator compensation network shown Figure provides close loop transfer function with highest zero crossover frequency sufficient phase margin. transfer function error amplifier given VCOMP VOUT1 R1// GAINAMP 3.Place first zero before output filter double pole frequency FLC. 0.75 Calculate equation: 0.75 poles zeros transfer function are: 4.Set pole zero frequency FESR: FESR Calculate equation: FESR www.anpec.com.tw Copyright ANPEC Electronics Corp. Rev. Jun., 2006 APW7068 Application Information (Cont.) Compensation (Cont.) 5.Set second pole half switching frequency also second zero output filter double pole FLC. compensation gain should exceed error amplifier open loop gain, check compensation gain with capabilities error amplifier. Combine equations will following component calculations: ripple voltage approximated IRIPPLE VIN1 VOUT1 VOUT1 VIN1 VOUT1 IRIPPLE where switching frequency regulator. Although increase inductor value frequency reduces ripple current voltage, tradeoff will exist between inductor' ripple current regulator load transient response time. smaller inductor will give regulator faster load transient response expense higher ripple current. Increasing switching frequency (FS) also reduces ripple current voltage, will increase switching loss MOSFET power dissipation converter. maximum ripple current occurs maximum input voltage. good starting point choose ripple current approximately maximum output current. Once inductance value been chosen, select inductor that capable carrying required peak current without going into saturation. some types inductors, especially core that made ferrite, ripple current will increase abruptly when saturates. This will result larger output ripple voltage. GAIN (dB) 20log (R2/R1) 20log (VIN Compensation Gain Filter Gain Frequency(Hz) Converter Gain Output Capacitor Selection Higher capacitor value lower reduce output ripple load transient drop. Therefore, selecting high performance capacitors intended switching regulator applications. some applications, multiple capacitors have parallel achieve desired value. small decoupling capacitor parallel bypassing noise also recommended, voltage rating output capacitors also must considered. tantalum capacitors used, make sure they surge tested www.anpec.com.tw Figure Converter Gain Frequency Output Inductor Selection inductor value determines inductor ripple current affects load transient response. Higher inductor value reduces inductor' ripple current induces lower output ripple voltage. ripple current Copyright ANPEC Electronics Corp. Rev. Jun., 2006 APW7068 Application Information (Cont.) Output Capacitor Selection (Cont.) manufactures. doubt, consult capacitors manufacturer. Input Capacitor Selection input capacitor chosen based voltage rating current rating. reliable operation, select capacitor voltage rating least times higher than maximum input voltage. maximum current rating requirement approximately IOUT1/2, where IOUT1 load current. During power input capacitors have handle large amount surge current. tantalum capacitors used, make sure they surge tested manufactures. doubt, consult capacitors manufacturer. high frequency decoupling, ceramic capacitor connected between drain upper MOSFET source lower MOSFET. applications, multiple capacitors have parallel achieve desired value. small decoupling capacitor parallel bypassing noise also recommended, voltage rating output capacitors also must considered. tantalum capacitors used, make sure they surge tested manufactures. doubt, consult capacitors manufacturer. Input Capacitor Selection input capacitor chosen based voltage rating current rating. reliable operation, select capacitor voltage rating least times higher than maximum input voltage. maximum current rating requirement approximately IOUT1/2, where IOUT1 load current. During power input capacitors have handle large amount surge current. tantalum capacitors used, make sure they surge tested manufactures. doubt, consult capacitors manufacturer. high frequency decoupling, ceramic Copyright ANPEC Electronics Corp. Rev. Jun., 2006 capacitor connected between drain upper MOSFET source lower MOSFET. MOSFET Selection selection N-channel power MOSFETs determined RDS(ON), reverse transfer capacitance (CRSS) maximum output current requirement. There components loss MOSFETs: conduction loss transition loss. upper lower MOSFET, losses approximately given following: PUPPER IOUT1 TC)(RDS(ON))D (0.5)( IOUT1)(VIN1)( tSW)FS PLOWER IOUT1 TC)(RDS(ON))(1-D) Where IOUT1 load current temperature dependency RDS(ON) switching frequency switching interval duty cycle Note that both MOSFETs have conduction loss while upper MOSFET include additional transition loss. switching internal, function reverse transfer capacitance RSS. (1+TC) term factor temperature dependency RDS(ON) extracted from "RDS(ON) Temperature" curve power MOSFET. Layout Considerations high switching frequency converter, correct layout important ensure proper operation regulator. With power devices switching 300KHz above, resulting current transient will cause voltage spike across interconnecting impedance parasitic circuit elements. example, consider turn-off transition MOSFET. Before turn-off, MOSFET carrying full load current. During turn-off, current stops flowing MOSFET free-wheeling lower MOSFET parasitic diode. parasitic inductance circuit genwww.anpec.com.tw APW7068 Application Information (Cont.) Layout Considerations (Cont.) erates large voltage spike during switching interval. general, using short, wide printed circuit traces should minimize interconnecting impedances magnitude voltage spike. signal power grounds kept separate till combined using ground plane construction single point grounding. Figure illustrates layout, with bold lines indicating high current paths; these traces must short wide. Components along bold lines should placed lose together. Below checklist your layout: metal plate bottom packages (QFN-16) must soldered connected plane backside through several thermal vias. Keep switching nodes (UGATE, LGATE PHASE) away from sensitive small signal nodes since these nodes fast moving signals. Therefore, keep traces these nodes short possible. traces from gate drivers MOSFETs (UG, DRIVE) should short wide. Place source high-side MOSFET drain low-side MOSFET close possible. Minimizing impedance with wide layout plane between pads reduces voltage bounce node. Decoupling capacitor, compensation component, resistor dividers, boot capacitors, REF_OUT capacitors should close their pins. (For example, place decoupling ceramic capacitor near drain high-side MOSFET close possible. bulk capacitors also placed near drain). input capacitor should near drain Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw upper MOSFET; output capacitor should near loads. input capacitor should close output capacitor lower MOSFET GND. drain MOSFETs (VIN1 PHASE nodes) should large plane heat sinking. APW7068 VIN1 VCC12 VIN2 BOOT DRIVE VOUT2 UGATE PHASE LGATE REF_OUT VOUT1 Figure Layout Guidelines APW7068 Package Information (150mil) 0.015 GAUGE PLANE SEATING PLANE 0.010 Millimeters Min. 1.477 0.102 0.331 0.191 8.558 3.82 1.274 5.808 0.382 6.215 1.274 0.228 0.015 Max. 1.732 0.255 0.509 0.2496 8.762 3.999 Min. 0.058 0.004 0.013 0.0075 0.336 0.150 Inches Max. 0.068 0.010 0.020 0.0098 0.344 0.157 0.050 0.244 0.050 Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Package Information QSOP-16 GAUGE PLANE Millimeters Min. 1.35 0.10 0.20 4.80 5.79 3.81 0.635 TYP. 0.41 1.27 0.016 Max. 1.75 0.25 0.30 5.00 6.20 3.99 Min. 0.053 0.004 0.008 0.189 0.228 0.150 Inches Max. 0.069 0.010 0.012 0.197 0.244 0.157 0.025 TYP. 0.050 Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Packaging Information QFN-16 Copyright ANPEC Electronics Corp. Rev. Jun., 2006 Millimeters Min. 0.76 0.00 0.57 0.20 REF. 3.90 3.90 0.25 2.05 2.05 0.650 0.50 0.60 0.002 4.10 4.10 0.35 2.15 2.15 0.154 0.154 0.010 0.081 0.081 0.0257BSC 0.024 Max. 0.84 0.04 0.63 Min. 0.030 0.00 0.022 0.008 REF. 0.161 0.161 0.014 0.085 0.085 Inches Max. 0.033 0.0015 0.025 www.anpec.com.tw APW7068 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material 90/10 63/37 SnPb), 100%Sn Meets Specification RSI86-91, ANSI/J-STD-002 Category Reflow Condition (IR/Convection Reflow) Critical Zone Ramp-up Temperature Tsmax Tsmin Ramp-down Preheat Peak Classification Reflow Profiles Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Time maintained above: Temperature (TL) Time (tL) Peak/Classificatioon Temperature (Tp) Time within actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds table 10-30 seconds Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds table 20-40 seconds 6°C/second max. 6°C/second max. minutes max. minutes max. Time 25°C Peak Temperature Notes: temperatures refer topside package. Measured body surface. Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Classification Reflow Profiles(Cont.) Table SnPb Entectic Process Package Peak Reflow Temperatures Package Thickness Volum Volume <350 <2.5 +0/-5°C +0/-5°C +0/-5°C +0/-5°C Table Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume Volume Volume <350 350-2000 >2000 <1.6 +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* *Tolerance: device manufacturer/supplier shall assure process compatibility including stated classification temperature (this means Peak reflow temperature +0°C. example 260°C+0°C) rated level. Reliability Test Program Test item SOLDERABILITY HOLT Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD Description 245°C, 1000 Bias @125°C Hrs, 100%RH, 121°C -65°C~150°C, Cycles VHBM 2KV, 200V 10ms, 100mA Carrier Tape Reel Dimensions Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Carrier Tape Reel Dimensions(Cont.) Application SOP-14 (150mil) Application 330REF 100REF 13.0 16.5REF 12.4 0.3±0.05 1.75 16.0 2.10 5.2± 0.50 1.50 (MIN) +1.5 1.55 +0.1 1.75±0.1 12.75+ 0.15 QSOP- 5.5± 1.55+ 0.25 2.1± 0.3±0.013 (mm) Shipping Tray Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw APW7068 Shipping Tray (Cont.) Cover Tape Dimensions Application SOP- QSOP- Carrier Width Cover Tape Width 21.3 Devices Reel 2500 2500 Customer Service Anpec Electronics Corp. Head Office No.6, Dusing Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. Jun., 2006 www.anpec.com.tw Other recent searchesVND7N04 - VND7N04 VND7N04 Datasheet VND7N04-1 - VND7N04-1 VND7N04-1 Datasheet VNK7N04FM - VNK7N04FM VNK7N04FM Datasheet MC56F8013 - MC56F8013 MC56F8013 Datasheet KST13 - KST13 KST13 Datasheet FJX4007R - FJX4007R FJX4007R Datasheet FJX3007R - FJX3007R FJX3007R Datasheet D90LV048AT3V - D90LV048AT3V D90LV048AT3V Datasheet BFG520 - BFG520 BFG520 Datasheet BFG520 - BFG520 BFG520 Datasheet BFG520 - BFG520 BFG520 Datasheet AT6000 - AT6000 AT6000 Datasheet 2SC6133 - 2SC6133 2SC6133 Datasheet
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