ESD4-LFC Only Name Means ProT ek'Tion CAPACIT ANCE FLIP CHIP

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ESD4-LFC Only Name Means ProT ek'Tion CAPACIT ANCE FLIP CHIP

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05210
ESD4-LFC
Only Name Means ProT ek'Tion
CAPACIT ANCE FLIP CHIP ARRA
APPLICA TIONS Cellular Phones Ports Notebooks Pocket Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Cards COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): 15kV, Contact 61000-4-4 (EFT): 5/50ns TURES Protection kilovolts Unidirectional Configuration Capacitance: 15pF Protects Four(4) Data Lines RoHS Compliant Lead-Free Versions MECHANICAL CHARACTERISTICS Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available Tin-Lead Lead-Free Plating Solder Reflow Temperature: Tin-Lead Sn/Pb, 85/15: 240-245°C Lead-Free Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating 94V-0 Tape Reel Standard CONFIGURA TION BUMP
05210.R2 8/05
www.protekdevices.com
ESD4-LFC
DEVICE CHARACTERISTICS MAXIMUM RATINGS 25°C Unless Otherwise Specified
PARAMETER Power Rating Operating Temperature Storage Temperature SYMBOL TSTG VALUE -40°C 85°C -55°C 150°C UNITS
ELECTRICAL CHARACTERISTICS LINE 25°C Unless Otherwise Specified
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL FORWARD VOLTAGE MAXIMUM CLAMPING VOLTAGE TYPICAL CAPACITANCE LINE (See Note @2.5V,
VOLTS ESD4-LFC
Note ±20% tolerance.
V(BR) VOLTS
@3.3V
@10mA VOLTS
10mA VOLTS
Capacitance (Normalized)
FIGURE CAPACITANCE REVERSE VOLTAGE (Normalized Capacitance 2.5V 25°C)
Reverse Voltage Volts
05210.R2 8/05
www.protekdevices.com
ESD4-LFC
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round Clean OSP(Entek Plus 106A) ±50µm ±20µm Seconds 270°C
REQUIREMENTS
Temperature: Lead-Free (SnAgCu): 260-270°C Tin-Lead: 240-245°C Preheat time temperature depends solder paste flux activation temperature, component size, weight, surface area plating.
RECOMMENDED NON-SOLDER MASK DEFINED ILLUSTRATION
Non-Solder Mask Defined 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
Ramp-up
Temperature
Ramp-down TSMAX 155° TSMIN 140° Preheat
25°C Peak 30-60 seconds
Ramp-up seconds
Solder Time 15-20 seconds
Ramp-down
05210.R2 8/05
www.protekdevices.com
ESD4-LFC
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS MILLIMETERS
0.914 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330
INCHES
0.036 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013
SIDE VIEW
1.016 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457
0.040 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018
0.30 DIA. 63/67 Sn/Pb SOLDER BUMPS
NOTE: Controlling dimensions millimeters.
Outline Dimensions: 8/05, 06055
Tape Reel Specifications (Dimensions millimeters)
Reel Dia. 178mm (7") Tape Width
1.08 0.05 1.60 0.05 0.72 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
Pitches Cumulative Tolerance Tape.
MARKING CODE DIAGRAM
cover tape
User Direction Feed
TAPE REEL ORDERING NOMENCLATURE Surface mount product taped reeled accordance with EIA-481. Plastic Tape: Suffix-T73-1 Inch Reel 3,000 pieces reel, i.e., ESD4-LFC-T73-1. Suffix Lead-Free, i.e., ESD4-LFC-LF-T73-1. Suffix Coated Version, i.e., ESD4-LFC-LF-T73C-1.
ProTek Devices 2929 South Fair Lane, Tempe, 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Site: www.protekdevices.com
COPYRIGHT ProTek Devices 2005 SPECIFICATIONS: ProTek reserves right change electrical mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves right discontinue product lines without notice, that final judgement concerning selection specifications buyer's that furnishing engineering technical assistance, ProTek assumes responsibility with respect selection specifications such products.
05210.R2 8/05
www.protekdevices.com

ESD4-LFC Only Name Means ProT ek'Tion CAPACIT ANCE FLIP CHIP

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