Download

PDF Abstract Text:

EMIF4-100FC

EMI FIL TER / TVS ARRA Y

EMIF4-100FC
EMI FIL TER / TVS ARRA Y
PIN CONFIGURA TION
For Each Line I / On 100 Ohm I / On
27pF GND
05226.R2 9 / 05
www.protekdevices.com
EMIF4-100FC
DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT @ 3.3V ID µA 0.5 TYPICAL FORWARD VOLTAGE MINIMUM ATTENUATION CUT-OFF FREQUENCY (50 Ohms I / O ZERO BIAS) TYPICAL CAPACITANCE PER LINE (See Note 1) @2.5V, 1 MHz C Line pF 54
VWM VOLTS EMIF4-100FC
@ 1mA V(BR) VOLTS 6.0
@10mA VF VOLTS 0.8
@ 800-3000 MHz dB 30
fc MHz 60
FIGURE 1 RESISTANCE VS TEMPERATURE (Normalized to Resistance at 25°C)
Normalized Resistance
0.900 -40 -20 0 20 40 Temperature °C 60 80 100
05226.R2 9 / 05
www.protekdevices.com
EMIF4-100FC
GRAPHS
FIGURE 2 INSERTION LOSS
Gain (dB)
0 Volts
2.5 Volts
Frequency (MHz)
FIGURE 3 OVERSHOOT & CLAMPING VOLTAGE
5 Volts per Division
-5 ESD Test Pulse: +15 kilovolt, 1 / 30ns (waveform)
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE
1 Volts per Division
-4 ESD Test Pulse: -15 kilovolt, 1 / 30ns (waveform)
05226.R2 9 / 05
www.protekdevices.com
EMIF4-100FC
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - °C
Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat
t 25°C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
05226.R2 9 / 05
www.protekdevices.com
EMIF4-100FC
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS MILLIMETERS DIM MIN
INCHES MIN
SIDE VIEW
0.30 DIA. 63 / 67 Sn / Pb Solder Bumps
NOTE: 1. Controlling dimensions in millimeters.
Outline & Dimensions: Rev 1 - 8 / 05, 06060
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P t
E Top cover tape A0 K0 B0 F W
User Direction of Feed
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
05226.R2 9 / 05
www.protekdevices.com