EMIF2MIC-68FCC Only Name Means ProT ek'Tion TER/TVS ARRA
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05212
EMIF2MIC-68FCC
Only Name Means ProT ek'Tion
TER/TVS ARRA
APPLICA TIONS Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) Audio Ports COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): 15kV, Contact 61000-4-4 (EFT): 5/50ns TURES Protection kilovolts Bidirectional Filtering/TVS Pass Filters Insertion Loss: -3db Roll-Off 72MHz Bidirectional Configuration Protects Two(2) Signal Lines RoHS Compliant Lead-Free Versions MECHANICAL CHARACTERISTICS Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available Tin-Lead Lead-Free Plating Solder Reflow Temperature: Tin-Lead Sn/Pb, 85/15: 240-245°C Lead-Free Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating 94V-0 Tape Reel Standard CONFIGURA TION BUMP
05212.R1 9/05
www.protekdevices.com
EMIF2MIC-68FCC
DEVICE CHARACTERISTICS MAXIMUM RATINGS 25°C Unless Otherwise Specified
PARAMETER Operating Temperature Storage Temperature Power Resistor Typical Resistance ±15% Tolerance) SYMBOL TSTG VALUE -40°C 85°C -55°C 150°C UNITS OHMS
ELECTRICAL CHARACTERISTICS LINE 25°C Unless Otherwise Specified
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM DIODE LEAKAGE CURRENT MINIMUM ATTENUATION CUT-OFF FREQUENCY Ohms ZERO BIAS) TYPICAL CAPACITANCE LINE (See Note @0V,
VOLTS EMIF2MIC-68FCC
Note ±20% tolerance.
V(BR) VOLTS
800-3000
05212.R1 9/05
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EMIF2MIC-68FCC
APPLICA TION INFORMA TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round Clean OSP(Entek Plus 106A) ±50µm ±20µm Seconds 270°C
REQUIREMENTS
Temperature: Lead-Free (SnAgCu): 260-270°C Tin-Lead: 240-245°C Preheat time temperature depends solder paste flux activation temperature, component size, weight, surface area plating.
RECOMMENDED NON-SOLDER MASK DEFINED ILLUSTRATION
Non-Solder Mask Defined 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
Ramp-up
Temperature
Ramp-down TSMAX 155° TSMIN 140° Preheat
25°C Peak 30-60 seconds
Ramp-up seconds
Solder Time 15-20 seconds
Ramp-down
05212.R1 9/05
www.protekdevices.com
EMIF2MIC-68FCC
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS MILLIMETERS
0.914 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330
INCHES
0.036 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013
SIDE VIEW
1.016 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457
0.040 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018
0.30 DIA. 63/67 Sn/Pb SOLDER BUMPS
NOTE: Controlling dimensions millimeters.
Outline Dimensions: 8/05, 06055
Tape Reel Specifications (Dimensions millimeters)
Reel Dia. 178mm (7") Tape Width
1.08 0.05 1.60 0.05 0.72 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
Pitches Cumulative Tolerance Tape.
cover tape
User Direction Feed
TAPE REEL ORDERING NOMENCLATURE Surface mount product taped reeled accordance with EIA-481. Plastic Tape: Suffix-T73-1 Inch Reel 3,000 pieces reel, i.e., EMIF2MIC-68FCC-T73-1. Suffix Lead-Free, i.e., EMIF2MIC-68FCC-LF-T73-1.
COPYRIGHT ProTek Devices 2005 SPECIFICATIONS: ProTek reserves right change electrical mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves right discontinue product lines without notice, that final judgement concerning selection specifications buyer's that furnishing engineering technical assistance, ProTek assumes responsibility with respect selection specifications such products.
ProTek Devices 2929 South Fair Lane, Tempe, 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Site: www.protekdevices.com
05212.R1 9/05
www.protekdevices.com
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