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IRIS-G6653 Oscillator provided monolithic control with adopting O
Top Searches for this datasheetData Sheet 96950A IRIS-G6653 Oscillator provided monolithic control with adopting On-ChipTrimming technology. Small temperature characteristics variation adopting comparator compensate temperature control part. start-up circuit current (100uA max) Built-in Active Low-Pass Filter stabilizing operation case light load Avalanche energy guaranteed MOSFET with high VDSS built-in power MOSFET simplifies surge absorption circuit since MOSFET guarantees avalanche energy. VDSS de-rating required. Built-in constant voltage drive circuit Built-in soft drive circuit Built-in frequency mode (20kHz) Various kinds protection functions Pulse-by-pulse Overcurrent Protection (OCP) Overvoltage Protection with latch mode (OVP) Thermal Shutdown with latch mode (TSD) Type IRIS-G6653 INTEGRATED SWITCHER Package Outline TO-220 Fullpack Lead) Specifications MOSFET VDSS(V) RDS(ON) input(V) 230±15% Pout(W) Note Descriptions Note1: Pout represents thermal rating Quasi-Resonant Operation, peak power output obtained approximately 140% above listed. When output voltage ON-duty narrow, Pout shall become lower than that above. IRIS-G6653 hybrid consists from power MOSFET controller designed Quasi-Resonant (including frequency PRC) fly-back converter type SMPS (Switching Mode Power Supply) applications. This realizes high efficiency, noise, downsizing standardizing power supply system reducing external components count simplifying circuit designs. (Note). abbreviation "Pulse Ratio Control" (On-width control with fixed OFF-time). Typical Connection Diagram IRIS-G6600 OCP/FB www.irf.com IRIS-G6653 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage device occur. voltage parameters absolute voltages referenced terminals stated, currents defined positive into lead. thermal resistance power dissipation ratings measured under board mounted still conditions. Symbol IDpeak IDMAX Definition Drain Current Maximum switching current Terminals Max. Ratings Units Note Single Pulse V2-3=0.78V Ta=-20~+125 Single Pulse VDD=99V, L=20mH peak=2.6A Tstg Single pulse avalanche energy Input voltage control part O.C.P/F.B voltage Power dissipation MOSFET Power dissipation control part (Control Internal frame temperature operation Operating ambient temperature Storage temperature Channel temperature +125 +125 +125 With infintite heatsink Without heatsink Specified Refer recommended operating temperature Refer A.S.O curve Tch-EAS curve Refer Ta-PD1 curve Refer TF-PD2 curve Control (See page Maximum switching current. Fig.1 V2-3 maximum switching current Drain current determined drive voltage threshold voltage (Vth) FET. Therefore, event that voltage drop occurs between patterning, maximum switching current decreases shown V2-3 Fig.1 Accordingly please this device within decrease value, referring derating curve maximum switching current. www.irf.com IRIS-G6653 Electrical Characteristics (for Control Electrical characteristics control part (Ta=25, Vin=18V,unless otherwise specified) Symbol Vin(ON) Vin(OFF) Iin(ON) Iin(OFF) TOFF(MAX) Tth(2) TOFF(MIN) Vth(1) Vth(2) IOCP/FB Vin(OVP) Iin(H) in(La.OFF) Tj(TSD) Definition Operation start voltage Operation stop voltage Circuit current operation Circuit current non-operation Maximum time Minimum time input quasi resonant signals Minimum time O.C.P/F.B threshold voltage O.C.P/F.B threshold voltage O.C.P/F.B extraction current O.V.P operation voltage Latch circuit sustaining current Latch circuit release voltage Thermal shutdown operating temperature 14.4 0.68 20.5 Ratings 0.73 1.45 1.35 22.5 17.6 0.78 24.5 Units µsec µsec µsec Test Conditions Vin=017.6V Vin=17.69V Vin=14V Vin=024.5V Vin=24.58.5V Vin=24.56.6V Recommended operating conditions Tth(2)1.0sec Time input quasi resonant signals quasi resonant signal inputted OCP/FB O.C.P/F.B time quasi resonant operation, signal shall Vth(2) wider than Tth(2). minimum time means TOFF width time when minimum quasi resonant signal inputted. latch circuit means circuit operated O.V.P T.S.D. Electrical Characteristics (for MOSFET) (Ta=25) unless otherwise specified Symbol VDSS IDSS Definition Drain-to-Source breakdown voltage Drain leakage current Ratings Units nsec Test Conditions ID=300µA =0V(short) =650V V3-2=0V(short) V3-2=10V ID=1.2A RDS(ON) On-resistance Switching time ch-F Thermal resistance Between channel internal frame www.irf.com IRIS-G6653 IRIS-G6653 A.S.O. temperature derating coefficient curve IRIS-G6653 MOSFET A.S.O. Curve Single Pulse A.S.O. temperature derating coefficient[%] Drain Current Drain current limit resistance 0.1ms temperature derating shall made obtaining Coefficient from left curve your use. 0.01 Drain-to-Source Voltage IRIS-G6653 Avalanche energy derating curve Internal frame temperature 1000 IRIS-G6653 Maximum Switching current derating curve 20+125 temperature derating coefficient[%] Maximum Switchng Current IDMAX[A] Channel temperature www.irf.com IRIS-G6653 IRIS-G6653 MOSFET Ta-PD1 Curve PD1=26[W] IRIS-G6653 TF-PD2 Curve PD2=0.8[W] Power dissipation PD1[W] With infinite heatsink Power dissipation PD2[W] PD1=1.5[W] Without heatsink Ambient temperature Ta[] Internal frame temperature TF[] IRIS-G6653 Transient thermal resistance curve Transient thermal resistance ch-c[/W] 0.01 0.001 100µ [sec] 100m www.irf.com IRIS-G6653 Block Diagram START REG. T.S.D O.V.P. LATCH DRIVE Vth(1) OCP/FB O.S.C Vth(2) Lead Assignments Symbol OCP/FB IRIS Description Drain Source Ground Power supply Overcurrent Feedback Function MOSFET drain MOSFET source Ground Input power supply control circuit Input overcurrent detection signal constant voltage control signal Other Functions O.V.P. Overvoltage Protection Circuit T.S.D. Thermal Shutdown Circuit OCP/FB www.irf.com IRIS-G6653 Case Outline ±0.2 ±0.2 ±0.2 ±0.2 ±0.2 16.9 ±0.3 IRIS ±0.1 ±0.5 2-(R1) ±0.5 0.94 ±0.15 0.85 -0.1 +0.2 R-end (4.6) 0.45 -0.1 +0.2 4xp1.7±0.1=(6.8) 5.08 ±0.6 ±0.2 aType Number G6653 bLot Number letterThe last digit year letterMonth Jan. Sept., Oct. Nov. Dec. letterDay Arabic Numerals letter Registration Symbol Weight Approx. 2.3g Dimensions DWG.No.TG3A-1128 Material Treatment plating solder Data specifications subject change without notice. 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