The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

HLB1245 EPITAXIAL PLANAR TRANSISTOR Description HLB1245


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



Spec. HE200205 Issued Date 2001.04.01 Revised Date 2004.11.03 Page
HLB1245
EPITAXIAL PLANAR TRANSISTOR
Description
HLB1245 designed high voltage, high speed switching inductive circuits, amplifier applications.
TO-220
Internal Schematic Diagram
Features
High Speed Switching Saturation Voltage High Reliability
Absolute Maximum Ratings (TA=25°C)
Maximum Temperatures Storage Temperature +150 Junction Temperature +150 Maximum Power Dissipation Total Power Dissipation (TA=25°C) Total Power Dissipation (TC=25°C) Maximum Voltages Currents (TA=25°C) BVCBO Collector Base Voltage. BVCEO Collector Emitter Voltage. BVEBO Emitter Base Voltage. Collector Current (DC) Collector Current (Pulse). Base Current (DC). Base Current (Pulse).
Electrical Characteristics (TA=25°C)
Symbol BVCEO ICEO ICBO IEBO ICES VFEC *hFE1 *hFE2 *hFE3 *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2
HLB1245
Min.
Typ.
Max.
Unit IC=10mA VCE=400V VCB=700V VEB=9V VCE=700V IC=2A
Test Conditions
VCE=5V, IC=10mA VCE=5V, IC=500mA VCE=5V, IC=1A IC=500mA, IB=100mA IC=2A, IB=400mA IC=500mA, IB=100mA IC=2A, IB=400mA
*Pulse Test: Pulse Width 380us, Duty Cycle2% HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
Spec. HE200205 Issued Date 2001.04.01 Revised Date 2004.11.03 Page
Saturation Voltage Collector Current
10000 VCE(sat) IC=5IB
Saturation Voltage (mV)
1000
VCE=2V
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage Collector Current
10000 VBE(sat) IC=5IB 1000
Capacitance Reverse-Biased Voltage
Saturation Voltage (mV)
Capacitance (pF)
1000
1000 10000
Collector Current-IC (mA)
Reverse Biased Voltage
Safe Operating Area
PT=1mS
Collector Current-IC
PT=1S
PT=100mS
0.01 1000
Forward Biased Voltage
HLB1245
HSMC Product Specification
TO-220AB Dimension
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Spec. HE200205 Issued Date 2001.04.01 Revised Date 2004.11.03 Page
1245 Date Code Control Code
Note: Green label used pb-free packing Style: 1.Base 2.Collector 3.Emitter Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48
Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87
Typical, Unit:
3-Lead TO-220AB Plastic Package HSMC Package Code:
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HLB1245
HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HE200205 Issued Date 2001.04.01 Revised Date 2004.11.03 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature
Dipping time 5sec ±1sec 5sec ±1sec
+0/-5
HLB1245
HSMC Product Specification

Other recent searches


TMS320TCI6482 - TMS320TCI6482   TMS320TCI6482 Datasheet
TMS320TCI100 - TMS320TCI100   TMS320TCI100 Datasheet
TB318 - TB318   TB318 Datasheet
PS2761B-1 - PS2761B-1   PS2761B-1 Datasheet
MAX5180 - MAX5180   MAX5180 Datasheet
MAX5183 - MAX5183   MAX5183 Datasheet
MAX5180 - MAX5180   MAX5180 Datasheet
MAX5183 - MAX5183   MAX5183 Datasheet
MAX5186 - MAX5186   MAX5186 Datasheet
MAX5189 - MAX5189   MAX5189 Datasheet
LK402-12 - LK402-12   LK402-12 Datasheet
IDTQS32X245 - IDTQS32X245   IDTQS32X245 Datasheet
ICS95V860 - ICS95V860   ICS95V860 Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive