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PROs Ai329 inch Image Sensor CCIR Camera Description


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PROs
PROs
Ai329
inch Image Sensor CCIR Camera
Description
Ai329DB 290K pixels area sensor CCIR 1/3inch video cameras. Buried photodiode micro lens adopted noise, smear high sensitivity. This chip also features strong anti-blooming electronic shutter with variable charge-storage time.
Configuration
VSUB
Feature
Micro Lens high sensitivity Image-lag negligible excellent blooming suppression performed. level(5V) operation HCCD electrodes. plastic-DIP. Variable electronic shutter 1/50 1/100,000 sec. High sensitivity smear.
VOUT
Plastic View
Structure
Architecture Optical size inch format Chip size 6.0(H) 5.2(V) Number effective pixels about 290K pixels Number total pixels about 320K pixels Pixel size Optical black area Horizontal direction Front pixels Rear pixels Vertical direction Front pixels Rear pixels Number dummy bits Horizontal Vertical Even field only
Optical black position( View
Unit Pixels
Pin9
Ai329
Block Diagram
VOUT
VCCD
HCCD
VSUB
Description
Symbol
VOUT
Description
Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Ground Output amplifier gate bias Output amplifier source bias Output signal
Symbol
VSUB
Description
Output amplifier drain bias Ground Substrate(Overflow drain)bias Protection bias Reset gate clock connection Horizontal register transfer clock Horizontal register transfer clock
Absolute Maximum Ratings
Parameter
Substrate voltage Supply voltage Vertical clock input voltage Horizontal clock input voltage Between vertical clock input pins Between horizontal clock vertical clock input pins Output voltage Protective circuit voltage Storage temperature Operation temperature
Symbol
VSUB VDD, VOUT, VDD, VOUT, VSUB VSUB
Value
-0.3 -0.3 -0.3
Unit
VSUB VSUB TSTG TOPR
Ai329
Bias Condition
Parameter
Output amplifier drain voltage Output amplifier gate voltage Output amplifier source voltage Substrate voltage adjustment range Fluctuation range after substrate voltage adjustment Reset gate clock voltage adjustment range
Symbol Min.
Vsub Vrgl 14.5
Typ.
15.0
Max.
15.5
Unit Remark
Ground through Resistor,
Fluctuation range after reset gate voltage adjustment Protection bias
level vertical transfer clock
Characteristics
Parameter
Output amplifier drain current Symbol Min. Typ. Max. Unit
Driving Condition
Parameter
Vertical clock high voltage Vertical clock middle voltage Vertical clock voltage Horizontal clock high voltage Horizontal clock voltage clock voltage difference Substrate clock voltage
Symbol
Min.
14.5 -0.2 -9.0 -0.5
Typ.
15.0 -8.5
Max.
15.5 -8.0
Unit
RGHL
Ai329
Electro-optical Performance
Item
Sensitivity Saturation signal Smear Blooming Video signal shading Dark signal level Dark signal shading
Symbol
SENS VSAT OSNU VDARK DSNU
Min.
Typ.
Max.
Unit
/Lux
Measurement Method
Remark
0.015
Ai329
Measurement Method Sensitivity
SILC Standard Illumination Conditions* Measure average value signal output Vout Calculate efficiency Vout light intensity
Vsat
Adjust light intensity times SILC Measure average value signal output
Smear
Adjust light intensity times SILC readout clock Measure signal output horizontal optical black Vhopb Measure signal output vertical blanking dummy Vvbd Smear Vvbd Vhopb Vsat
Blooming
Adjust light intensity times SILC readout clock Measure signal output horizontal optical black Vhopb Measure signal output blooming dummy area Blooming Vhopb Vsat
OSNU
SILC Measure average value signal output Vout Measure maximum value minimum value signal output OSNU Vmax Vmin Vout
Vdark
Measure average value signal output dark condition
DSNU
Measure voltage difference between minimum maximum dark signal
Standard Illumination Conditions
Measure average value output linear region this time, measure light intensity illumination face plate Define SILC with above Light source: Tungsten lamp(3100K) standard test lens
Ai329
Notes Handling
Static charge prevention image sensors easily damaged static discharge. Before handling sure take following protective measures. Either handle bare handed non-chargeable gloves, clothes material. Also conductive shoes. When handling directly earth band. Install conductive floor working table prevent generation static electricity. Ionized recommended discharge when handling image sensor. shipment mounted substrates, boxes treated prevention static charges.
Soldering Make sure package temperature does exceed Solder dipping mounting furnace causes damage glass other defects. ground soldering iron solder each less than seconds. repairs remount, cool sufficiently. dismount image sensor, solder suction equipment. When using electric desoldering tool, thermal controller zero cross On/Off type connect ground.
Dust Dirt protection Perform assembly operations clean room (class 1000 less). either touch glass plates hand have object come contact with glass surfaces. Should dirt stick glass surface, blow with blower. (For dirt stuck through static electricity ionized recommended.) Clean with cotton ethyl alcohol grease stained. careful scratch glass. Keep case protect from dust dirt. prevent condensation, preheat precool when moving room with great temperature differences.
Others expose strong light (sun rays) long periods. Exposure high temperature humidity will affect characteristics. Accordingly avoid storage usage such conditions.
Ai329
+15V C2223 output 3.9K
180K
VSUB
KDS226
3.3K
0.VOUT
10/6.3V
V-DRIVER
Ai1001S
VSUB
Ai329
Application Circuit
Ai329
Package Dimension Plastic-DIP)
UNIT
1.The center effective image area relative (6.1, .15mm.
rotation angle effective image area relative GLASS
1.57
0.64 0.25
R0.3
0.25

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