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Triacs high commutation Glass passivated high commutation triacs


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Triacs high commutation
Glass passivated high commutation triacs full pack, plastic envelope intended motor control circuits with other highly inductive loads. These devices will commutate full rated current maximum rated junction temperature, without snubber.
BTA216X series
QUICK REFERENCE DATA
SYMBOL VDRM IT(RMS) ITSM PARAMETER BTA216XRepetitive peak off-state voltages on-state current Non-repetitive peak on-state current MAX. MAX. UNIT 600B 800B
PINNING SOT186A
DESCRIPTION main terminal
CONFIGURATION
case
SYMBOL
main terminal gate
case isolated
LIMITING VALUES
Limiting values accordance with Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages on-state current Non-repetitive peak on-state current fusing Repetitive rate rise on-state current after triggering Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature full sine wave; full sine wave; prior surge; with reapplied VDRM(max) 16.7 dIG/dt A/µs CONDITIONS MIN. -600 6001 MAX. -800 UNIT A/µs
dIT/dt PG(AV) Tstg
over period
Although recommended, off-state voltages 800V applied without damage, triac switch on-state. rate rise current should exceed A/µs. February 1996 1.100
Triacs high commutation
ISOLATION LIMITING VALUE CHARACTERISTIC
unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from three terminals external heatsink CONDITIONS 50-60 sinusoidal waveform; R.H. clean dustfree MIN.
BTA216X series
TYP.
MAX. 2500
UNIT
Cisol
Capacitance from external heatsink
THERMAL RESISTANCES
SYMBOL j-hs PARAMETER Thermal resistance junction heatsink Thermal resistance junction ambient CONDITIONS full half cycle with heatsink compound without heatsink compound free MIN. TYP. MAX. UNIT
STATIC CHARACTERISTICS
unless otherwise stated SYMBOL PARAMETER Gate trigger current
CONDITIONS GT2- GT2+ GT2-
MIN. 0.25
TYP.
MAX.
UNIT
Latching current
Holding current On-state voltage Gate trigger voltage Off-state leakage current
VDRM(max);
DYNAMIC CHARACTERISTICS
unless otherwise stated SYMBOL dVD/dt dIcom/dt PARAMETER Critical rate rise off-state voltage Critical rate change commutating current Gate controlled turn-on time CONDITIONS VDRM(max); exponential waveform; gate open circuit IT(RMS) without snubber; gate open circuit VDRM(max); dIG/dt A/µs MIN. 1000 TYP. 4000 MAX. UNIT V/µs A/ms
Device does trigger T2-, quadrant. February 1996 1.100
Triacs high commutation
BTA216X series
Ptot
BT139
Ths(max)
IT(RMS)
BT139X
IT(RMS)
Fig.1. Maximum on-state dissipation, Ptot, versus on-state current, IT(RMS), where conduction angle.
ITSM BTA216
Fig.4. Maximum permissible current IT(RMS) versus heatsink temperature Ths.
BT139
1000
IT(RMS)
limit
10us time
initial 100us 10ms 100ms
0.01
surge duration
Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width sinusoidal currents, 20ms.
ITSM BT139 ITSM time
Fig.5. Maximum permissible repetitive on-state current IT(RMS), versus surge duration, sinusoidal currents, 38°C.
VGT(Tj) VGT(25
BT136
initial
Number cycles 50Hz
1000
Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number cycles, sinusoidal currents,
Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25°C), versus junction temperature
February 1996
1.100
Triacs high commutation
BTA216X series
IGT(Tj) IGT(25
BTA216 GT2-
BT139
1.195 0.018 Ohms
Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25°C), versus junction temperature
IL(Tj) IL(25
Fig.10. Typical maximum on-state characteristic.
TRIAC
j-hs (K/W)
BT139
with heatsink compound without heatsink compound unidirectional bidirectional
0.01
0.001 10us 0.1ms 10ms 0.1s
Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus junction temperature
IH(Tj) IH(25C)
Fig.11. Transient thermal impedance j-mb, versus pulse width
TRIAC
1000
dIcom/dt (A/ms)
BTA216
Fig.9. Normalised holding current IH(Tj)/ IH(25°C), versus junction temperature
Fig.12. Typical, critical rate change commutating current dIcom/dt versus junction temperature.
February 1996
1.100
Triacs high commutation
MECHANICAL DATA
Dimensions Mass:
10.3
BTA216X series
Recesses (2x) max. depth
15.8 max. max. seating plane 15.8
max. tinned 13.5 min.
(2x) 2.54
5.08
Fig.13. SOT186A; seating plane electrically isolated from terminals.
Notes Accessories supplied request: refer mounting instructions F-pack envelopes. improved isolation rating applies only SOT186 version envelope.
February 1996
1.100
Triacs high commutation
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
BTA216X series
This data sheet contains target goal specifications product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data published later.
Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections this specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. Philips Electronics N.V. 1996 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent other industrial intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products designed life support appliances, devices systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
February 1996
1.100

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