TDA8742; TDA8742H Satellite sound circuit with noise reduction Pr
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TDA8742; TDA8742H Satellite sound circuit with noise reduction
Product specification Supersedes data November 1992 File under Integrated Circuits, IC02 October 1994
Philips Semiconductors
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
FEATURES Demodulation main audio signal using wide band (lock range selectable) input selection: two-out-of-eight secondary audio signals selected Demodulation secondary audio signals using wide band Noise reduction secondary audio signals Output selection: stereo, language language main audio external Mute control Line outputs (SCART level). QUICK REFERENCE DATA SYMBOL Supply VIN3(rms) supply voltage PARAMETER APPLICATIONS Satellite receivers sets Video recorders.
TDA8742; TDA8742H
GENERAL DESCRIPTION TDA8742; TDA8742H multi-function sound satellite receivers, television sets video recorders. numbers given parenthesis throughout this document refer QFP44 package.
CONDITIONS
MIN.
TYP.
MAX.
UNIT
S/N(A) 10.0 A-weighted
13.2
Main channel input sensitivity (14) (RMS value) lock range demodulator either S/N(A) output voltage (19) signal-to-noise ratio 11.5
Secondary channels VIN1,IN2(rms) input sensitivity pins (RMS value) fOS1,2 VOR,OL S/N(A) Crosstalk crosstalk from secondary main channel crosstalk from main secondary channel crosstalk between secondary channels lock range demodulators output voltage pins signal-to-noise ratio A-weighted S/N(A) 10.0 11.5
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8742 TDA8742H Note SDIP42 QFP44(1) DESCRIPTION
TDA8742; TDA8742H
VERSION SOT270-1 SOT307-2
plastic shrink dual in-line package; leads (600 mil) plastic quad flat package; leads (lead length mm); body 1.75
When using reflow soldering recommended that Drypack instructions "Quality Reference Handbook" (order number 9398 63011) followed. BLOCK DIAGRAM
numbers parenthesis refer QFP44 package.
Fig.1 Block diagram.
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
PINNING SYMBOL n.c. IN-1A Isel IN-1B Isel IN-1C IN-1D HFGND IN-2A IN-2B MUTE IN-2C Osel IN-2D Osel IN-3 VREF EXT/INT EXTR EXTL CATT/REC RECTR AFGND RECTL CATT/REC October 1994 SDIP42 QFP44 connected intercarrier input Channel (left) input select switch intercarrier input Channel (left) input select switch intercarrier input Channel (left)
TDA8742; TDA8742H
DESCRIPTION
main channel lock-in range select/disable intercarrier input Channel (left) ground section intercarrier input Channel (right) secondary channels PLLs disable intercarrier input Channel (right) mute switch intercarrier input Channel (right) output select switch (left) intercarrier input Channel (right) output select switch (right) intercarrier input main channel decoupling capacitor reference voltage de-emphasis capacitor main channel audio pass-through capacitor input main channel positive supply voltage main channel output right channel output left channel output output switch (external/internal) external audio input (right) external audio input (left) attack/recovery capacitor (right) rectifier decoupling (right) noise reduction de-emphasis capacitor (right) fixed de-emphasis capacitor (right) audio pass-through capacitor input right channel ground section audio pass-through capacitor input left channel fixed de-emphasis capacitor (left) noise reduction de-emphasis capacitor (left) rectifier decoupling (left) attack/recovery capacitor (left)
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
SYMBOL n.c. n.c.
SDIP42
QFP44
DESCRIPTION decoupling capacitor (left) decoupling capacitor (main) decoupling capacitor (right) connected connected
Fig.2 configuration (SDIP42).
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
Fig.3 configuration (QFP44).
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
FUNCTIONAL DESCRIPTION Satellite sound baseband signal coming from satellite tuner contains demodulated video signal plus number sound carriers facilitate reception PAL/NTSC/SECAM satellite signal. Nearest video signal main sound carrier which carries single channel sound related video. This modulated carrier with fixed pre-emphasis. carrier frequency range MHz. Additionally, number optional secondary sound carriers present which used stereo multi-language sound related video, unrelated radio sound. These carriers also modulated, better sound quality (improved signal-to-noise performance) broadcast satellites (e.g. `ASTRA') noise reduction system (adaptive pre-emphasis circuit, combined with fixed pre-emphasis). These secondary carrier frequencies range 6.30 8.28 MHz. TDA8742; contains circuitry processing main channel secondary channels, from baseband signal line (SCART) output drivers. desired frequencies routed device bandpass filters. Main channel (see Fig.1) lock-in range main channel switched between MHz, 10.0 11.5 using signal [when logic being voltage from lock-in range MHz; when logic being voltage from until lock-in range 10.0 11.5 MHz; when voltage position, being voltage from main channel switched off]. voltage then determined resistor divider this between ground. only fixed carrier frequency main channel demodulated (e.g. MHz), lock-in range should switched MHz. baseband signal applied main channel input, (14) ceramic bandpass filter. Alternatively, there requirement demodulate different main channel frequencies, these frequencies transferred fixed intermediate frequency (e.g. 10.7 MHz) using external mixer oscillator-frequency synthesizer. this event lock-in range should switched 10.0 11.5 MHz. signal applied main
TDA8742; TDA8742H
channel input, (14) 10.7 ceramic bandpass filter. filtered signal AC-coupled limiter/amplifier then demodulator. demodulator ensures that demodulator alignment-free. High gain error signals from PLL, which superimposed demodulator output, require decoupling. buffer amplifier used amplify signal same level secondary channels decouples using electrolytic capacitor connected (37). demodulator output signal (16) internal resistor. output signal de-emphasized means this resistor external capacitor connected ground. Capacitor value de-emphasis time constant per1500 (for nF). From here signal output selectors. signal amplified (RMS) (i.e. dBV) output amplifiers. Secondary channels eight secondary channels available pins 42). External ceramic bandpass filters, tuned required secondary sound carrier frequencies, route these signals inputs. This enables demodulation eight different channel; frequencies, which derived from baseband, using external mixer oscillator frequency synthesizer. stereo applications TDA8742; TDA8742H contains identical secondary sound processing channels. each channel possible select from four inputs (IN-A, IN-B, IN-C IN-D) using input selector (see Table With input switch several stereo signals languages selected demodulation. should noted that inputs identical freely interchanged Secondary Channel will also referred `LEFT' `LANGUAGE secondary Channel will also referred `RIGHT' `LANGUAGE From input selector switch signals coupled limiter/amplifiers then demodulators. Processing similar main channel. demodulator output signal amplified buffer amplifier decoupled using electrolytic capacitors connected pins (36) (left) (38) (right). output level with resistor connected series with capacitor.
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
High frequency components amplified output signal filtered audio block (4th order Butterworth low-pass filter) prevent unwanted influence noise reduction. NOISE REDUCTION (NR) noise reduction regarded input level-dependent low-pass filter (adaptive de-emphasis system) followed fixed de-emphasis. With maximum input level frequency response first part (i.e. without fixed de-emphasis) virtually flat. input level lowered x-dB, higher output frequencies will reduced extra x-dB with respect lower frequencies expansion). output signal (32) (left) (28) (right) internal resistor. Fixed de-emphasis achieved these resistors external capacitors connected ground. signals decoupled pins 36/35 (32/31) 32/33 (28/29) then routed output selectors. OUTPUT SELECTION With output selector (see Table outputs pins switched different channels. Both outputs switched both secondary channels, main channel external inputs chaining purposes. (19) separate output which delivers main channel only, thereby creating possibility having three different output channels simultaneously e.g. hi-fi VCRs. outputs pins muted setting MUTE signal logic (switch positions output 23(19) muted setting MUTE signal EXT/INT signal (22) both logic (switch position outputs pins (19, line drivers with SCART level capability short-circuit protected output resistors. Output level channels typical when frequency deviation signal maximum frequency deviation (i.e. 0.54 main channel 0.54 secondary channels) modulation frequency (reference level). ABBREVIATIONS
TDA8742; TDA8742H
fMOD modulating frequency. frequency deviation main Channel. frequency deviation secondary Channel (left). frequency deviation secondary Channel (right). carrier frequency main Channel. fOS1 carrier frequency secondary Channel fOS2 carrier frequency secondary Channel Low-Pass Filter. Noise Reduction. Phase-Locked-Loop.
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL supply voltage PARAMETER CONDITIONS note
TDA8742; TDA8742H
MIN.
MAX. 13.2
UNIT
voltage level pins note voltage pins note
Tstg Tamb Notes
voltage pins note storage temperature operating ambient temperature
+150
voltages referenced ground pins 30). voltages referenced ground pins 30). These voltages must exceed maximum value time. THERMAL CHARACTERISTICS SYMBOL SDIP42 QFP44 PARAMETER thermal resistance from junction ambient free VALUE UNIT
CHARACTERISTICS voltages referenced ground pins 30). Measured test circuit Fig.4; Tamb modulation); MHz; fOS1 10.52 MHz; fOS2 10.7 MHz; level (14): (RMS); level selected secondary inputs: (RMS); logic (V2) logic [V11 (V6) unless otherwise specified. SYMBOL Ptot VREF VCDCL,CDCR VCDCM IIN3 supply voltage supply current total power dissipation voltage pins (16, input reference voltage (15) voltage pins voltage pins voltage (37) input current (14) PARAMETER MIN. TYP. MAX. 13.2 UNIT
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
CHARACTERISTICS voltages referenced ground pins 30). Measured test circuit Fig.4; Tamb fMOD kHz; MHz; kHz; (reference levels); fOS1 10.52 MHz; fOS2 10.7 MHz; level (14): (RMS); level selected secondary inputs: (RMS); logic (V2) logic [V11 (V6) unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. logic RCDM VCDM VCDM RCCM lock range output resistance de-emphasis (16) output voltage (16) spread output voltage over lock range (16) input resistance output amplifier (17) note logic note 10.0 1.24 TYP. MAX. UNIT
Main channel input (14) limiter VIN3(rms) VIN3(rms) RIN3 fCCO input sensitivity (RMS value) input signal level (RMS value) input resistance S/N(A) 11.5
Main channel demodulator decoupling amplifier free-running frequency 10.7
-18.5 -16.0 -14.5
Main channel overall performance (output selector position VOM,OR,OL S/N(A) ROM,OR,OL MUTEatt SVRR output voltage pins (19, unbalance voltage outputs pins total harmonic distortion signal-to-noise ratio frequency response with respect (19) output resistance pins (19, crosstalk attenuation from secondary channels main mute attenuation supply voltage ripple rejection note output selector position PLLs locked output selector position PLLs locked A-weighted; PLLs locked de-emphasis connected -0.5 -0.5 +0.5 +0.5
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Secondary channels inputs pins limiters VIN1,IN2(rms) Vi(rms) fCCO1 fCCO2 fOS1/2 RS1, input sensitivity (RMS value) input signal level (RMS value) input resistance S/N(A) note 11.5
Secondary channels demodulators (input selector position free running frequency PLL1 free running frequency PLL2 lock range PLLs series resistance optimum frequency response adjustment 10.7 0.68 10.52
VCDCL,CDCR(rms) VCDCL,CDCR
output voltage pins pins left open-circuit (RMS value) spread output voltage over lock range output resistance de-emphasis pins input resistance output amplifiers pins output voltage level pins unbalance voltage outputs pins total harmonic distortion signal-to-noise ratio output resistance pins mute attenuation crosstalk attenuation between secondary channels note note note A-weighted; note note output selector position note note
Secondary channels overall performance (output selectors position
VOL,OR S/N(A) MUTEatt Voffset(DC)
crosstalk attenuation from main note channel secondary offset voltage attack/recovery capacitors pins (25, supply voltage ripple rejection PLLs locked;
SVRR
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Secondary channels low-pass filter pins RECTL, RECTR RECTL, RECTR frequency response with respect note
Secondary channels noise reduction pins 20); note VOL, output voltage noise reduction input level frequency response with respect noise reduction input level output voltage noise reduction input level kHz; fixed de-emphasis connected kHz; fixed de-emphasis connected kHz; fixed de-emphasis connected
VOL,OR
frequency response kHz; with respect fixed de-emphasis connected noise reduction input level
-11.5
External inputs (24) (left) (23) (right) overall performance (output selector position VEXTR,EXTL VOL,OR S/N(A) L/R,R/L input signal level input resistance output level total harmonic distortion signal-to-noise ratio crosstalk VEXTR, EXTL VEXTR, EXTL dBV; A-weighted; VEXTR, EXTL -6.5 -6.0 -5.5
Input selector control circuit pins (see also Table secondary channels PLLs disable [SCD (6)]; (6); pins left open-circuit logic HIGH level input voltage HIGH level input voltage input resistance connected
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Output selector control circuit (see also Table main channel lock-in select [MCS (2)]; pins (10, inputs should left open-circuit VIMF Notes (16) demodulated signal should present with typical level (RMS) (-16 dBV), maximum 0.5%; Tamb Modulation main channel OFF; modulation secondary channels electrolytic capacitors pins removed 1500 capacitors between (36) ground between (38) ground connected. pins demodulated signals should present with typical levels (RMS) maximum 0.5%; Tamb PLLs locked; 0.68 Modulation secondary channel being measured main channel OFF; modulation other secondary channel Modulation main channel modulation secondary channels OFF. Measured pins (34) (left) (26) (right) electrolytic capacitors connected these pins. level input voltage limits level input voltage limits only level input voltage floating HIGH level input voltage limits input resistance ground high input resistance level input current (not pin) HIGH level input current (not pin) must 13.2
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
Table Truth table input selection STATE pins IN-A (pins pins IN-B (pins pins IN-C (pins pins IN-D (pins
TDA8742; TDA8742H
SWITCH POSITION Table
(41)
(43)
Truth table output selection (note (10) STATE OUTSEL stereo left right main external mute secondary mute OUTSEL EXT/INT MUTE (13) (22)
SWITCH POSITION Note don't care.
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
October 1994
numbers parenthesis refer QFP44 package.
Fig.4 Test circuit.
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
APPLICATION INFORMATION General This application mainly intended have more than inputs secondary channel available. this event choice between same frequency sets e.g. 10.7 10.52 with different bandwidths possible. narrow bandwidth chosen event weak signal, however this produces slightly more distortion. normal signal will processed using filters thus resulting signal with normal distortion. main channel either baseband synthesized signal selected. circuit illustrated Fig.5.
TDA8742; TDA8742H
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
October 1994
numbers parenthesis refer QFP44 package.
Fig.5 Application diagram.
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
PACKAGE OUTLINES
TDA8742; TDA8742H
handbook, full pagewidth
seating plane
39.0 38.4 4.57 5.08
15.80 15.24
0.51 1.73 1.778 (40x) 0.53 0.18 0.32 15.24 17.15 15.90
MSA268
14.1 13.7
Dimensions
Fig.6 Plastic shrink dual in-line package; leads (600 mil); SDIP42; SOT270-1.
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
TDA8742; TDA8742H
handbook, full pagewidth
seating plane
12.9 12.3 (4x)
index
0.40 0.20 10.1
0.40 0.20
0.15
(4x)
0.15
10.1
12.9 12.3
0.85 0.75 1.85 1.65 0.25 0.05 0.25 0.14 2.10 1.70
MBB944
detail
0.95 0.55
Dimensions
Fig.7 Plastic quad flat package; leads (lead length mm); body 1.75 (QFP44; SOT307-2). October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
SOLDERING Plastic dual in-line packages WAVE maximum permissible temperature solder this temperature must contact with joint more than total contact time successive solder waves must exceed device mounted seating plane, temperature plastic body must exceed specified storage maximum. printed-circuit board been pre-heated, forced cooling necessary immediately after soldering keep temperature within permissible limit. REPAIRING SOLDERED JOINTS Apply soldering iron below seating plane more than above it). temperature below must contact more than between more than Plastic quad flat packages WAVE During placement before soldering, component must fixed with droplet adhesive. After curing adhesive, component soldered. adhesive applied screen printing, transfer syringe dispensing. Maximum permissible solder temperature maximum duration package immersion solder bath allowed cool less than within Typical dwell time modified wave soldering technique recommended using solder waves (dual-wave), which turbulent wave with high upward pressure followed smooth laminar wave. Using mildly-activated flux eliminates need removal corrosive residues most applications.
TDA8742; TDA8742H
SOLDER PASTE REFLOW Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied substrate screen printing, stencilling pressure-syringe dispensing before device placement. Several techniques exist reflowing; example, thermal conduction heated belt, infrared, vapour-phase reflow. Dwell times vary between according method. Typical reflow temperatures range from Preheating necessary paste evaporate binding agent. Preheating duration: REPAIRING SOLDERED JOINTS HAND-HELD SOLDERING IRON PULSE-HEATED SOLDER TOOL) component first soldering two, diagonally opposite, pins. Apply heating tool flat part only. Contact time must limited When using proper tools, other pins soldered operation within between (Pulse-heated soldering recommended packages.) pulse-heated solder tool (resistance) soldering packages, solder applied substrate dipping extra thick tin/lead plating before package placement.
October 1994
Philips Semiconductors
Product specification
Satellite sound circuit with noise reduction
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8742; TDA8742H
This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications.
Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
October 1994
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