Silicon epitaxial planar type (Tr) Silicon epitaxial planar type (SBD)

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Silicon epitaxial planar type (Tr) Silicon epitaxial planar type (SBD)

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XP0NG8A
Silicon epitaxial planar type (Tr) Silicon epitaxial planar type (SBD)
digital circuits Features
elements incorporated into package SBD) Costs reduced through downsizing equipment reduction number parts SMini type package allowing easy automatic insertion through tape packing magazine packing
Unit:
0.12+0.05 -0.02
0.2±0.05
1.25±0.10 2.1±0.1
1.3±0.1 2.0±0.1
(0.65) (0.65)
Basic Part Number
UNR211L MA152WK
0.9±0.1
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector current Forward current Peak forward current Non-repetitive peak forward surge current Reverse voltage Maximum peak reverse voltage Total power dissipation Overall Junction temperature Storage temperature
Note)
Symbol VCBO VCEO IFSM Tstg
Rating -100 +150
Unit
Emitter (Tr) Base (Tr) Cathode (Di) EIAJ: SC-88
Absolute Maximum Ratings 25°C
Marking Symbol: Internal Connection
(4.7
0.9+0.2 -0.1
Anode (Di) Anode (Di) Collector (Tr) SMini6-G1 Package
(4.7
0.2±0.1
Publication date: December 2004
SJJ00310AED
XP0NG8A
Electrical Characteristics 25°C±3°C
Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio Collector-emitter saturation voltage Output voltage high-level Output voltage low-level Input resistance Resistance ratio Transition frequency Symbol VCBO VCEO ICBO ICEO IEBO VCE(sat) Conditions -2.5 -30% -4.9 +30% 0.25 -2.0 Unit
Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors.
Parameter Forward voltage Reverse voltage Reverse current Terminal capacitance Reverse recovery time Symbol Conditions Unit
Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7031 measuring methods diodes.
SJJ00310AED
Request your special attention precautions using technical information semiconductors described this material
export permit needs obtained from competent authorities Japanese Government products technical information described this material controlled under "Foreign Exchange Foreign Trade Law" exported taken Japan. technical information described this material limited showing representative characteristics applied circuits examples products. neither warrants non-infringement intellectual property right other rights owned company third party, grants license. liable infringement rights owned third party arising technical information described this material. products described this material intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). Consult sales staff advance information following applications: Special applications (such airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems safety devices) which exceptional quality reliability required, failure malfunction products directly jeopardize life harm human body. applications other than standard applications intended. products product specifications described this material subject change without notice modification and/or improvement. final stage your design, purchasing, products, therefore, most up-to-date Product Standards advance make sure that latest specifications satisfy your requirements. When designing your equipment, comply with guaranteed values, particular those maximum rating, range operating power supply voltage, heat radiation characteristics. Otherwise, will liable defect which arise later your equipment. Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. When using products which damp-proof packing required, observe conditions (including shelf life amount time standing unsealed items) agreed upon when specification sheets individually exchanged. This material reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd.
2003

Silicon epitaxial planar type (Tr) Silicon epitaxial planar type (SBD)

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