Military Operating Temperature Range -55°C 125°C, Processing Fast Inst
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Military Operating Temperature Range -55°C 125°C, Processing Fast Instruction Cycle Time 1K-Word 32-Bit Single-Cycle Dual-Access On-Chip Blocks 32-Bit Instruction Data Words, 24-Bit Addresses Integer, Floating-Point, Logical Operations 32-Bit Floating-Point Integer Multiplier Arithmetic Logic Unit (ALU) 24-Bit Integer Multiplier, 32-Bit Product 32-Bit Floating-Point Multiplier, 40-Bit Product Parallel Multiplier Execution Single Cycle 32-Bit Barrel Shifter Eight Extended-Precision Registers (Accumulators) Circular Bit-Reversed Addressing Capabilities Independent Bidirectional Serial Ports With Support 16-, 32-Bit Transfers
32-Bit Timers With Control Counter Registers Validated Compiler 64-Word 32-Bit Instruction Cache On-Chip Direct Memory Access (DMA) Controller Concurrent Operation 32-Bit Single-Cycle Dual-Access On-Chip Block 32-Bit External Ports (24- 13-Bit Addresses) Address Generators With Eight Auxiliary Registers Auxiliary Register Arithmetic Units (ARAUs) Zero-Overhead Loops With Single-Cycle Branches Interlocked Instructions Multiprocessing Support Two- Three-Operand Instructions Conditional Calls Returns Block-Repeat Capability Fabricated Using Enhanced Performance Implanted CMOS (EPIC) Technology Texas Instruments
description
SMJ320C30KGDB digital signal processor (DSP) high-performance, 32-bit floating-point processor manufactured 0.72-µm, double-level metal CMOS technology. SMJ320C30KGDB internal busing special digital-signal-processing instruction have speed flexibility execute million floating-point operations second (MFLOPS). SMJ320C30KGDB optimizes speed implementing functions hardware that other processors implement through software microcode. This hardware-intensive approach provides performance previously unavailable single chip. SMJ320C30KGDB perform parallel multiply operations integer floating-point data single cycle. Each processor also possesses general-purpose register file, program cache, dedicated ARAUs, internal dual-access memories, channel supporting concurrent short machine-cycle time. High performance ease results these features. large address space, multiprocessor interface, internally externally generated wait states, external interface ports, timers, serial ports, multiple interrupt structure enhanced general-purpose applications. SMJ320C30KGDB supports wide variety system applications from host processor dedicated coprocessor.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. EPIC trademark Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 2001, Texas Instruments Incorporated
products compliant MIL-PRF-38535, parameters tested unless otherwise noted. other products, production processing does necessarily include testing parameters.
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
description (Continued)
High-level language support easily implemented through register-based architecture, large address space, powerful addressing modes, flexible instruction set, well-supported floating-point arithmetic. additional information when designing cold temperature operation, please Texas Instruments application report 320C3x, 320C4x 320MCM42x Power-up Sensitivity Cold Temperature, literature number SGUA001.
known good (KGD) technology
options available multichip modules chip-on-board (COB) applications. current verification technology that supports requirements SMJ320C30KGDB chuck probe process. This process uses standard probed product that tested wafer form speed elevated temperature full data sheet specifications. Each individual then sawed, inspected, packaged shipment.
electrical specifications
electrical timing specifications, SMJ320C30 Digital Signal Processor data sheet, literature number SGUS014.
PREFIX
MIL-PRF-38535
REVISION 'C30 Revision
DEVICE FAMILY Family
SPEED RANGE TEMPERATURE RANGE 55°C 125°C 70°C
TECHNOLOGY CMOS
DEVICE Floating-Point
PACKAGE TYPE Known Good
Figure SMJ320C30KGDB Device Nomenclature
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
JEDEC STANDARD
thickness approximately mils mil. Backside surface finish silicon. Maximum allowable junction operating temperature 175°C. Glassivation material compressive nitride. Bond metal composed copper-doped aluminum. Percent defective allowed burned-in Life test data available. Configuration control notification Group attribute summary available (SMJ only). Suggested die-attach material Silverglass (QMI 3555). Suggested bond wire size 1.25 mil. rating Class Minimum allowable peak process temperature attach 325°C (for 3555). kerf dependent blade size used. backside potential grounded.
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
SMJ320C30KGDB (rev 7.x) known good information
Figure shows SMJ320C30KGDB die-numbering format. Table SMJ320C30KGDB information.
Number Side Number
TMS320C30FW
Designator
Side Number
Side Number
Zero-Zero (origin)
Side Number
Figure '320C30KGD Die-Numbering Format (See Table Table provides reference following:
'C30 signal identities relation numbers 'C30 coordinates, where bond serves origin (0,0)
addition, significant specifications include: coordinate data microns. Coordinate origin (0,0) (center bond 52). active silicon dimensions 779.60 453.10 (306.28 mils 372.17 mils). size approximately 950.20 779.00 (313.00 mils 385.00 mils). Bond dimensions 103.50 103.50 (4.07 mils 4.07 mils).
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Table '320C30KGD Information (0,72
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY PDVDD PDVDD FSR0 CLKR0 CLKX0 FSX0 TCLK0 TCLK1 PADTOG IOD0 IOD1 IOD2 IODVDD IODVDD IOD3 IOD4 IOD5 IOD6 IOD7 IOD8 IOD9 IOD10 VDDL VDDL DVSS VSSL CVSS IOD11 IOD12 IOD13 IOD14 IOD15 IOD16 IOD17 IOD18 IOD19 IOD20 IOD21 IOD22 IOD23 IOD24 IOD25 IOD26 IOD27 IOD28 IOD29 IOD30 IODVDD IODVDD X-COORDINATE BOND Y-COORDINATE BOND 7165.35 7029.99 6895.42 6760.42 6625.42 6490.42 6355.42 6220.42 6085.42 5950.42 5815.42 5673.22 5538.22 5403.22 5268.22 5133.22 4998.22 4863.22 4728.22 4593.22 4458.22 4323.22 4188.22 4053.22 3918.22 3783.22 3644.08 3504.04 3369.04 3234.04 3099.04 2964.04 2829.04 2694.04 2559.04 2424.04 2289.04 2154.04 2019.04 1884.04 1749.04 1614.04 1479.04 1344.04 1209.04 1074.04 939.04 804.04 669.04 529.54 394.56 PITCH LEAD 135.36 134.57 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 142.20 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 139.14 140.04 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 139.50 134.98
614.16
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Table '320C30KGD Information (0,72 (Continued)
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY DVSS VSSL IVSS CVSS IOD31 ADVDD ADVDD VDDL VDDL DVSS CVSS EMU0 EMU1 EMU2 EMU3 EMU4 IOA12 IOA11 IOA10 IOA9 IOA8 IOA7 IOA6 CVSS IVSS VSSL DVSS X-COORDINATE BOND 0.00 139.68 274.68 409.68 609.48 773.28 944.28 1093.68 1343.88 1478.88 1613.88 1784.63 1919.63 2054.63 2225.63 2360.63 2495.63 2688.23 2837.63 2987.03 3136.43 3285.83 3435.23 3599.03 3734.03 3897.83 4032.83 4177.37 4321.91 4480.85 4637.63 4794.23 4950.83 5107.43 5264.03 5443.85 5646.89 5849.93 6029.75 6209.57 6412.61 6570.83 6720.23 6869.63 7019.03 7168.43 7317.83 7467.23 7710.23 7859.63 8009.03 8158.79 Y-COORDINATE BOND 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 PITCH LEAD 139.68 135.00 135.00 199.80 163.80 171.00 149.40 250.20 135.00 135.00 170.75 135.00 135.00 171.00 135.00 135.00 192.60 149.40 149.40 149.40 149.40 149.40 163.80 135.00 163.80 135.00 144.54 144.54 158.94 156.78 156.60 156.60 156.60 156.60 179.82 203.04 203.04 179.82 179.82 203.04 158.22 149.40 149.40 149.40 149.40 149.40 149.40 243.00 149.40 149.40 149.76
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Table '320C30KGD Information (0,72 (Continued)
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY ADVDD ADVDD IOA5 IOA4 IOA3 IOA2 IOA1 IOA0 DDVDD DDVDD VDDL VDDL DVSS CVSS VSSL DDVDD DDVDD X-COORDINATE BOND Y-COORDINATE BOND 394.56 529.54 664.54 799.54 934.54 1069.54 1204.54 1339.54 1481.74 1616.74 1751.74 1886.74 2021.74 2156.74 2291.74 2426.74 2561.74 2696.74 2831.74 2966.74 3101.74 3236.74 3371.74 3506.74 3641.74 3776.74 3913.00 4055.74 4190.74 4325.74 4460.74 4595.74 4730.74 4865.74 5000.74 5135.74 5270.74 5405.74 5540.74 5675.74 5810.74 5945.74 6080.74 6215.74 6350.74 6485.74 6620.74 6755.74 6890.56 7025.67 7160.31 PITCH LEAD 134.98 135.00 135.00 135.00 135.00 135.00 135.00 142.20 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 136.26 142.74 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 135.00 134.82 135.11 134.64
8618.31
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SMJ320C30KGDB FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD
Table '320C30KGD Information (0,72 (Continued)
SIDE 'C30 BOND LOCATIONS DIE/TAB BOND IDENTITY DVSS VSSL IVSS CVSS X2/CLKIN VSUBS EMU5 IORDY MSTRB IOSTRB IOR/W HOLDA HOLD MDVDD MDVDD STRB RESET IACK INT0 VDDL VDDL VSSL IVSS INT1 INT2 INT3 RSV0 RSV1 RSV2 RSV3 RSV4 RSV5 RSV6 RSV7 RSV8 RSV9 RSV10 FSR1 CLKR1 CLKX1 FSX1 CVSS DVSS X-COORDINATE BOND 8167.43 8020.73 7877.63 7742.63 7582.07 7412.51 7176.53 6404.15 6245.93 6087.71 5952.71 5817.71 5682.71 5524.49 5366.27 5231.27 5073.05 4914.83 4779.83 4621.61 4463.39 4328.39 4193.39 4035.17 3876.95 3741.95 3602.27 3458.09 3297.53 3124.55 2943.11 2770.49 2597.87 2425.25 2252.63 2080.01 1914.59 1779.59 1644.84 1509.84 1374.84 1239.84 1104.84 969.84 654.84 498.24 341.64 185.04 28.44 -128.16 Y-COORDINATE BOND PITCH LEAD 146.70 143.10 135.00 160.56 169.56 235.98 772.38 158.22 158.22 135.00 135.00 135.00 158.22 158.22 135.00 158.22 158.22 135.00 158.22 158.22 135.00 135.00 158.22 158.22 135.00 139.68 144.18 160.56 172.98 181.44 172.62 172.62 172.62 172.62 172.62 165.42 135.00 134.75 135.00 135.00 135.00 135.00 135.00 315.00 156.60 156.60 156.60 156.60 156.60
7558 7558.83
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device 5962-9052604Q9B 5962-9052605Q9B SMJ320C30KGDM40C SMJ320C30KGDM50C
Status ACTIVE ACTIVE ACTIVE ACTIVE
Package Type XCEPT XCEPT XCEPT XCEPT
Package Drawing
Pins Package Plan
Lead/Ball Finish Call Call Call Call
Peak Temp Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS) Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
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