PhotopSeries, combines photodiode with operational amplifier same pack

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PhotopSeries, combines photodiode with operational amplifier same pack

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PhotopsPhotodiode-Amplifier Hybrids
PhotopSeries, combines photodiode with operational amplifier same package. Photopsgeneral-purpose detectors have spectral range from either 1100 1100nm. They have integrated package ensuring noise output under variety operating conditions. These op-amps specifically selected Sensors engineers compatibility photodiodes. Among many these specific parameters noise, drift capability supporting variety gains bandwidths determined external feedback components. Operation from level several possible either unbiased configuration speed, drift applications biased faster response time. LN-Series Photopsare used with OV-bias. modification above devices possible. modifications simply adding bandpass optical filter, integration additional chip (hybrid) components inside same package, utilizing different op-amp, photodetector replacement, modified package design mount ceramic. your specific requirements, contact Applications Engineers.
APPLICATIONS
General Purpose Light Detection Laser Power Monitoring Medical Analysis Laser Communications Code Readers Industrial Control Sensors Pollution Monitoring Guidance Systems Colorimeter
FEATURES
Detector/Amplifier Combined Adjustable Gain/Bandwidth Noise Wide Bandwidth Package Large Active Area
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: 1245 499, Fax: 1245 801, info@lasercomponents.co.uk
Photops(Photodiode Specifications)
Typical Electro-Optical Specifications
Shunt Resistance
Model Number
Active Area
Responsivity (A/W)
Capacitance (pF)
Dark Current (nA)
Reverse Voltage
(W/Hz)
Temp.* Range (°C) Package Style
Operating Storage
Area (mm2)
Dimension (mm)
typ.
typ.
-10V
typ.
max.
350-1100 Spectral Range
UDT-451 UDT-455 UDT-455LN** UDT-455HS UDT-020D UDT-555D 4.57 11.3 2.54 -0.60 0.65 1500 0.25 -1.9
+100
max.
min.
min.
typ.
typ.
typ.
typ.
typ.
30** TO-5
TO-8 Special
200-1100 Spectral Range
UDT-455UV UDT455UV/LN** UDT-020UV UDT-055UV UDT-555UV UDT555UV/LN** 11.3 4500 2.54
TO-5
4.57 7.98 0.10 0.14
1000 2500
-5**
TO-8 Special
Special
Operational Amplifier Specifications Typical Electro-Optical Specifications TA=23
Quiescent Supply Current (mA)
Temp. Coefficient Input Offset Voltage
Model Number
max. max. typ. typ. typ. min.
max.
max. typ. typ.
max.
typ. min.
typ. min.
typ. min.
nV/Hz
typ. typ.
typ.
UDT-451 UDT-455 UDT-455UV UDT-020D UDT-020UV UDT-455HS UDT-455LN** UDT455UV/LN** UDT-055UV UDT-555D UDT-555UV
±400
0.26
0.15
±500
2500
0.22
±200
mechanical drawings please refer pages thru Series Devices used with Bias. Non-Condensing temperature Storage Range, Non-Condensing Environment.
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: 1245 499, Fax: 1245 801, info@lasercomponents.co.uk
Supply Voltage
Input Offset Voltage
Input Bias Current
Gain Bandwidth Product
Slew Rate
Open Loop Gain,
Input Noise Voltage
Input Noise Current
Photop Series
Schematic Diagrams
output voltage proportional light intensity light given
Frequency Response (Photodiode/Amplifier Combination)
frequency response photodiode amplifier combination determined characteristics photodetector, pre-amplifier well feedback resistor (RF) feedback capacitor (CF). known gain, (RF), frequency response detector/pre-amp combination given
However, desired frequency response limited Gain Bandwidth Product (GBP) op-amp. order have stable output, values must chosen such that frequency response detector pre-amp combination, less than maximum frequency op-amp, i.e. f3dB fmax.
where amplifier input capacitance. conclusion, example frequency response calculations, given below. gain 108, operating frequency opamp with MHz:
Thus, 15.9 fmax about 14.5 kHz. Hence, circuit stable since fmax. more detailed application specific discussions further reading, refer APPLICATION NOTES INDEX catalog. Note: shaded boxes represent Photopcomponents their connections. components outside boxes typical recommended connections components.
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: 1245 499, Fax: 1245 801, info@lasercomponents.co.uk
Photodiode Care Handling Instructions
AVOID DIRECT LIGHT
Since spectral response silicon photodiode includes visible light region, care must taken avoid photodiode exposure high ambient light levels, particularly from tungsten sources sunlight. During shipment from Sensors, your photodiodes packaged opaque, padded containers avoid ambient light exposure damage shock from dropping jarring.
AVOID SHARP PHYSICAL SHOCK
Photodiodes rendered inoperable dropped sharply jarred. wire bonds delicate become separated from photodiode's bonding pads when detector dropped otherwise receives sharp physical blow.
CLEAN WINDOWS WITH OPTICAL GRADE CLOTH TISSUE
Most windows Sensors photodiodes either silicon quartz. They should cleaned with isopropyl alcohol soft (optical grade) pad.
OBSERVE STORAGE TEMPERATURES HUMIDITY LEVELS
Photodiode exposure extreme high storage temperatures affect subsequent performance silicon photodiode. Storage temperature guidelines presented photodiode performance specifications this catalog. Please maintain non-condensing environment optimum performance lifetime.
OBSERVE ELECTROSTATIC DISCHARGE (ESD) PRECAUTIONS
Sensors photodiodes, especially with devices (e.g. Photops) considered sensitive. photodiodes shipped protective packaging. When unpacking using these products, anti-ESD precautions should observed.
EXPOSE PHOTODIODES HARSH CHEMICALS
Photodiode packages and/or operation impaired exposed CHLOROTHENE, THINNER, ACETONE, TRICHLOROETHYLENE.
INSTALL WITH CARE
Most photodiodes this catalog provided with wire leads installation circuit boards sockets. Observe soldering temperatures conditions specified below:
Soldering Iron:
Soldering less Temperature iron 300°C lower. Bath Temperature: Immersion Time: Soldering Time: 260±5°C. within Sec. within Sec.
Soldering:
Vapor Phase Soldering: Reflow Soldering:
Photodiodes plastic packages should given special care. Clear plastic packages more sensitive environmental stress than those black plastic. Storing devices high humidity present problems when soldering. Since rapid heating during soldering stresses wire bonds cause wire bonding separation, recommended that devices plastic packages baked hours 85°C. leads photodiode SHOULD FORMED. your application requires lead spacing modification, please contact Sensors Applications group (310)978-0516 before forming product's leads. Product warranties could voided.
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: 1245 499, Fax: 1245 801, info@lasercomponents.co.uk
Parameter Definitions:
Distance from chip glass. Photodiode Anode. Distance from glass bottom case. Photodiode Cathode
(Note: cathode common case metal package products unless otherwise noted).
Window Diameter. F.O.V. Filed View (see definition below).
Dimensions inches inch 25.4 mm). diameters 0.018 0.002" unless otherwise specified. Tolerances (unless otherwise noted)
General: 0.XX ±0.01" 0.XXX ±0.005" Chip Centering: ±0.010" Dimension `A': ±0.015"
Windows
`UV' Enhanced products provided with QUARTZ glass windows, 0.027 0.002" thick. `XUV' products provided with removable windows. `DLS' products provided with coated glass windows. `FIL' photoconductive photovoltaic products epoxy filled instead glass windows.
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: 1245 499, Fax: 1245 801, info@lasercomponents.co.uk
Mechanical Specifications
units inches. Pinouts bottom view.
www.lasercomponents.com
Issue: 02/04 www/pdf/udt/ photops.pdf
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: 1245 499, Fax: 1245 801, info@lasercomponents.co.uk

PhotopSeries, combines photodiode with operational amplifier same pack

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