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REJ03G1230-0400 Rev.4.00 Jun. 2005 on-resistance RDS(on) typ. -4.
Top Searches for this datasheetHAT1093C REJ03G1230-0400 Rev.4.00 Jun. 2005 on-resistance RDS(on) typ. -4.5 drive current. gate drive devices. High density mounting Outline RENESAS Package code: PWSF0006JA-A (Package name: CMFPAK-6) Indexband Source Drain Drain Drain Drain Gate Absolute Maximum Ratings 25°C) Item Drain Source voltage Gate Source voltage Drain current Drain peak current Body Drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes duty cycle When using glass epoxy board. (FR4 1.6mm), 25°C Symbol VDSS VGSS (pulse)Note1 PchNote Tstg Ratings +150 Unit Rev.4.00 Jun. 2005, page HAT1093C Electrical Characteristics 25°C) Item Drain Source breakdown voltage Gate Source breakdown voltage Gate Source leakage current Drain Source leakage current Gate Source cutoff voltage Drain Source state resistance Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(th) RDS(on) Min. -0.3 Typ. -0.8 Max. -1.2 -1.1 Unit Test Conditions ±100 ±6.4 Note3 -1.5 -4.5 Note3 -1.5 -2.5 Note3 -1.5 -1.8 Note3 -1.5 Note3 -4.5 -4.5 -1.5 Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate Source charge Gate Drain charge Turn delay time Rise time Turn delay time Fall time Body Drain diode forward voltage Notes: Pulse test Ciss Coss Crss td(on) td(off) Rev.4.00 Jun. 2005, page HAT1093C Package Dimensions JEITA Package Code RENESAS Code PWSF0006JA-A Package Name CMFPAK-6 CMFPAK-6V MASS[Typ.] 0.0065g Reference Symbol Dimension Millimeters Pattern terminal position areas 0.15 2.05 0.15 0.22 0.13 0.11 0.65 0.01 0.79 0.15 2.15 0.45 0.05 0.05 0.35 Section 1.65 Ordering Information Part Name HAT1093C-EL-E Quantity 3000 Shipping Container Taping Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product. Rev.4.00 Jun. 2005, page Sales Strategic Planning Div. Keep safety first your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. 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