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REJ03G1229-0400 Rev.4.00 Jun. 2005 on-resistance RDS(on) typ. -4.


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HAT1091C
REJ03G1229-0400 Rev.4.00 Jun. 2005
on-resistance RDS(on) typ. -4.5 drive current. gate drive devices. High density mounting
Outline
RENESAS Package code: PWSF0006JA-A (Package name: CMFPAK-6) Indexband
Source Drain Drain Drain Drain Gate
Absolute Maximum Ratings
25°C)
Item Drain Source voltage Gate Source voltage Drain current Drain peak current Body Drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes duty cycle When using glass epoxy board. (FR4 1.6mm), 25°C Symbol VDSS VGSS (pulse)Note1 PchNote Tstg Ratings -1.5 -1.5 +150 Unit
Rev.4.00, Jun. 2005, page
HAT1091C
Electrical Characteristics
25°C)
Item Drain Source breakdown voltage Gate Source breakdown voltage Gate Source leakage current Drain Source leakage current Gate Source cutoff voltage Drain Source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate Source charge Gate Drain charge Turn delay time Rise time Turn delay time Fall time Body Drain diode forward voltage Notes: Pulse test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(th) RDS(on) Ciss Coss Crss td(on) td(off) Min. -0.4 Typ. -0.85 Max. -1.4 -1.1 Unit Test Conditions ±100 Note3 -0.8 -4.5 Note3 -0.7 -2.5 Note3 -0.8 Note3 -4.5 -1.5 -4.5 -0.8 =12.5 -1.5
Rev.4.00, Jun. 2005, page
HAT1091C
Main Characteristics
Power Temperature Derating
-100
Maximum Safe Operation Area
When using board. shot pulse, 25°C
Power Dissipation
Drain Current
Test condition. When using glass epoxy board. (FR4
-0.3 -0.1 -0.03
Operation this area limited RDS(on)
Ambient Temperature (°C)
-0.01 -0.03 -0.1 -0.3
-100 Drain Source Voltage
Typical Output Characteristics
Pulse Test
Typical Transfer Characteristics
Pulse Test
Drain Current
-2.5
-1.5
Drain Current
-3.5
-25°C 25°C 75°C
Drain Source Voltage
Gate Source Voltage
Drain Source Saturation Voltage Gate Source Voltage
Drain Source Saturation Voltage VDS(on) (mV)
-400 Pulse Test -300
Drain Source State Resistance RDS(on)
Static Drain Source State Resistance Drain Current 10000
-2.5 1000
-200
-1.5
-4.5
-100
-0.8 -0.5
Pulse Test -0.1 Drain Current
Gate Source Voltage
Rev.4.00, Jun. 2005, page
HAT1091C
Static Drain Source State Resistance Temperature
Pulse Test -1.5 -2.5 -0.5 -0.8
Static Drain Source State Resistance RDS(on)
Forward Transfer Admittance |yfs|
Forward Transfer Admittance Drain Current
-25°C
75°C
25°C
-4.5 -1.5, -0.5, -0.8
Pulse Test
-0.1
-0.3
Case Temperature
(°C)
Drain Current
Dynamic Input Characteristics
Typical Capacitance Drain Source Voltage
1000
Capacitance (pF)
Drain Source Voltage
Gate Source Voltage
Ciss
Coss
-1.5
Crss
Gate Charge
(nC)
Drain Source Voltage
Reverse Drain Current Source Drain Voltage
Pulse Test
Switching Characteristics
1000
-4.5 25°C
Switching Time (ns)
Reverse Drain Current
td(on)
td(off)
-0.4 -0.8 -1.2 -1.6 -2.0
-0.01 -0.03 -0.1 -0.3
Source Drain Voltage
Drain Current
Rev.4.00, Jun. 2005, page
HAT1091C
Switching Time Test Circuit Monitor D.U.T. -4.5 Vout td(on) td(off) Vout Monitor Waveform
Rev.4.00, Jun. 2005, page
HAT1091C
Package Dimensions
JEITA Package Code RENESAS Code PWSF0006JA-A Package Name CMFPAK-6 CMFPAK-6V MASS[Typ.] 0.0065g
Reference Symbol
Dimension Millimeters
Pattern terminal position areas
0.15 2.05 0.15
0.22 0.13 0.11 0.65
0.01 0.79 0.15 2.15 0.45 0.05 0.05 0.35
Section
1.65
Ordering Information
Part Name HAT1091C-EL-E Quantity 3000 Shipping Container Taping
Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product.
Rev.4.00, Jun. 2005, page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. Renesas Technology Corp. assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corp. without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corp. assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corp. various means, including Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corp. assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corp. semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corp. necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corp. further details these materials products contained therein.
RENESAS SALES OFFICES
Refer latest detailed information. Renesas Technology America, Inc. Holger Way, Jose, 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> 2715-2888, Fax: <886> 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. Harbour Front Avenue, #06-10, Keppel Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
2005. Renesas Technology Corp., rights reserved. Printed Japan.
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