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REJ03G1151-0600 (Previous: ADE-208-754D) Rev.6.00 2005 on-resista
Top Searches for this datasheetHAT1043M REJ03G1151-0600 (Previous: ADE-208-754D) Rev.6.00 2005 on-resistance drive current High density mounting gate drive device driven from source Outline RENESAS Package code: PTSP0006FA-A (Package name: TSOP-6) Source Gate Drain Rev.6.00 2005 page HAT1043M Absolute Maximum Ratings 25°C) Item Drain source voltage Gate source voltage Drain current Drain peak current Body-drain diode reverse drain current Channel dissipation Channel dissipation Channel temperature Storage temperature Symbol VDSS VGSS (pulse) Note Note Value -4.4 -17.6 -4.4 1.05 +150 Unit (pulse) Note (continuous) Tstg Note Notes: duty cycle When using alumina ceramic board mm), 25°C When using alumina ceramic board mm), 25°C Electrical Characteristics 25°C) Item Drain source breakdown voltage Gate source leak current Zero gate voltage drain current Gate source cutoff voltage Static drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate source charge Gate drain charge Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Note: Pulse test Symbol (BR) IGSS IDSS (off) (on) (on) |yfs| Ciss Coss Crss (on) (off) -0.4 -0.95 ±0.1 -1.4 -1.23 Unit -4.4 -4.4 diF/dt A/µs Test Conditions Note -4.5 -2.5 Note -4.5 -4.4 -4.5 Note Rev.6.00 2005 page HAT1043M Main Characteristics Power Temperature Derating -100 Maximum Safe Operation Area -0.3 -0.1 Channel Dissipation Drain Current Operation this area limited (on) -0.03 25°C shot pulse -0.01 -0.1 -0.3 -100 Ambient Temperature (°C) Drain Source Voltage Note When using alumina ceramic board Test Condition: When using alumina ceramic board mm), Typical Output Characteristics Pulse Test Typical Transfer Characteristics Pulse Test Drain Current -2.5 Drain Current -25°C 75°C 25°C -1.5 Drain Source Voltage Gate Source Voltage Drain Source Saturation Voltage Gate Source Voltage Pulse Test Static Drain Source State Resistance Drain Current Drain Source State Resistance (on) 1000 Pulse Test Drain Source Saturation Voltage (on) -0.5 -0.4 -2.5 -0.3 -0.2 -4.5 -0.1 -0.1 -0.2 -0.5 Gate Source Voltage Drain Current Rev.6.00 2005 page HAT1043M Static Drain Source State Resistance Temperature Forward Transfer Admittance Drain Current Static Drain Source State Resistance (on) Forward Transfer Admittance |yfs| Pulse Test -2.5 -4.5 25°C -0.1 -0.3 Pulse Test 75°C -25°C Case Temperature (°C) Drain Current Typical Capacitance Drain Source Voltage 3000 1000 Ciss Coss Crss Body-Drain Diode Reverse Recovery Time Reverse Recovery Time (ns) Capacitance (pF) 25°C -0.5 -0.1 -0.2 Reverse Drain Current Drain Source Voltage Dynamic Input Characteristics Switching Characteristics Switching Time (ns) 1000 td(on) td(off) Drain Source Voltage -4.4 Gate Source Voltage -4.5 duty -0.1 -0.2 -0.5 Gate Charge (nc) Drain Current Rev.6.00 2005 page HAT1043M Reverse Drain Current Source Drain Voltage Reverse Drain Current Pulse Test -0.4 -0.8 -1.2 -1.6 -2.0 Source Drain Voltage VSDF Normalized Transient Thermal Impedance Pulse Width Normalized Transient Thermal Impedance 0.05 0.02 0.01 0.01 119°C/W, 25°C When using alumina ceramic board 0.001 0.0001 1000 10000 Pulse Width Switching Time Test Circuit Monitor D.U.T. Vout Monitor Switching Time Waveform Vout td(on) td(off) Rev.6.00 2005 page HAT1043M Package Dimensions JEITA Package Code SC-95 Modified RENESAS Code PTSP0006FA-A Package Name TSOP-6 TSOP-6V MASS[Typ.] 0.012g Reference Symbol Dimension Millimeters Section Pattern terminal position areas 0.25 1.45 0.25 0.32 0.13 0.11 2.95 0.15 1.75 0.05 0.05 0.45 Ordering Information Part Name Quantity Shipping Container HAT1043M-EL-E 3000 Taping Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product. Rev.6.00 2005 page Sales Strategic Planning Div. Keep safety first your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. 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