REJ03G1150-0500 (Previous: ADE-208-663C) Rev.5.00 2005 Automotive

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REJ03G1150-0500 (Previous: ADE-208-663C) Rev.5.00 2005 Automotive

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HAT1038R, HAT1038RJ
REJ03G1150-0500 (Previous: ADE-208-663C) Rev.5.00 2005
Automotive Application Type Code "J") on-resistance Capable gate drive High density mounting
Outline
RENESAS Package code: PRSP0008DD-D (Package name: SOP-8 <FP-8DAV>
Source Gate Drain
MOS1
MOS2
Rev.5.00 2005 page
HAT1038R, HAT1038RJ
Absolute Maximum Ratings
25°C)
Item Drain source voltage Gate source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel dissipation Channel temperature Storage temperature Notes: HAT1038R HAT1038RJ HAT1038R HAT1038RJ Symbol VDSS VGSS (pulse)
Note
Value -3.5 -3.5 -3.5 1.05 +150
Unit
Note
Note
Note Tstg
Note
duty cycle Drive operation: When using glass epoxy board (FR4 mm), Drive operation: When using glass epoxy board (FR4 mm), Value 25°C,
Electrical Characteristics
25°C)
Item Drain source breakdown voltage Gate source leak voltage Gate source leak current Zero gate voltage drain current Zero gate voltage drain current HAT1038R HAT1038RJ HAT1038R HAT1038RJ Symbol (BR) (BR) IGSS IDSS IDSS IDSS IDSS (off) (on) (on) |yfs| Ciss Coss Crss (on) (off) -1.2 0.12 0.16 -0.98 -0.1 -2.2 0.15 0.23 -1.28 Unit Test Conditions ±100 125°C Note Note
Note
Gate source cutoff voltage Static drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Note: Pulse test
-3.5 -3.5 diF/dt A/µs
Note
Rev.5.00 2005 page
HAT1038R, HAT1038RJ
Main Characteristics
Power Temperature Derating
Maximum Safe Operation Area
-100
Test Condition: When using glass epoxy board (FR4 mm),
-0.3 -0.1
Channel Dissipation
Drain Current
Operation this area limited (on)
-0.03 25°C shot pulse -0.01 -0.1 -0.3
-100
Ambient Temperature
(°C)
Drain Source Voltage
Note When using glass epoxy board (FR4
Typical Output Characteristics
-3.5 Pulse Test
Typical Transfer Characteristics
Pulse Test
Drain Current
Drain Current
75°C -25°C 25°C
-2.5
Drain Source Voltage
Gate Source Voltage
Drain Source Saturation Voltage Gate Source Voltage
Drain Source State Resistance (on) Drain Source Saturation Voltage (on)
-0.5 Pulse Test
Static Drain Source State Resistance Drain Current
Pulse Test
-0.4
-0.3 -0.2 -0.1 -0.5
0.05
0.02 0.01 -0.1 -0.3
-100
Gate Source Voltage
Drain Current
Rev.5.00 2005 page
HAT1038R, HAT1038RJ
Static Drain Source State Resistance Temperature
Forward Transfer Admittance |yfs|
Pulse Test -0.5 -0.5 -25°C 25°C Pulse Test -0.1 -0.2 -0.5 75°C
Static Drain Source State Resistance (on)
Forward Transfer Admittance Drain Current
Case Temperature
(°C)
Drain Current Typical Capacitance Drain Source Voltage
2000 1000 Ciss Crss Coss
Body-Drain Diode Reverse Recovery Time
Reverse Recovery Time (ns)
-0.1 -0.2 25°C -0.5
Capacitance (pF)
Reverse Drain Current
Drain Source Voltage
Dynamic Input Characteristics
Switching Characteristics
1000 td(off) duty -0.1 -0.2 -0.5 td(on)
Drain Source Voltage
-3.5
-100
Gate Source Voltage
Switching Time (ns)
Gate Charge
(nc)
Drain Current
Rev.5.00 2005 page
HAT1038R, HAT1038RJ
Reverse Drain Current Source Drain Voltage
Repetitive Avalanche Energy (mJ)
Maximum Avalanche Energy Channel Temperature Derating
-3.5 duty
Reverse Drain Current
Pulse Test -0.4 -0.8 -1.2 -1.6 -2.0
Source Drain Voltage
Channel Temperature (°C)
Normalized Transient Thermal Impedance Pulse Width Drive Operation)
Normalized Transient Thermal Impedance
0.05
0.02 0.01
125°C/W, 25°C When using glass epoxy board (FR4
0.01
0.001
0.0001
1000
10000
Pulse Width Normalized Transient Thermal Impedance Pulse Width Drive Operation)
Normalized Transient Thermal Impedance
0.05
0.02 0.01
166°C/W, 25°C When using glass epoxy board (FR4
0.01
0.001
0.0001
1000
10000
Pulse Width
Rev.5.00 2005 page
HAT1038R, HAT1038RJ
Avalanche Test Circuit Avalanche Waveform IAP2 VDSS VDSS
V(BR)DSS D.U.T
Monitor
Monitor
Switching Time Test Circuit
Monitor D.U.T. Vout Monitor
Switching Time Waveform
Vout td(on) td(off)
Rev.5.00 2005 page
HAT1038R, HAT1038RJ
Package Dimensions
JEITA Package Code P-SOP8-3.95 4.9-1.27 RENESAS Code PRSP0008DD-D Package Name FP-8DAV MASS[Typ.] 0.085g
Index mark
Terminal cross section (Ni/Pd/Au plating)
NOTE) DIMENSIONS "*1(Nom)" "*2" INCLUDE MOLD FLASH. DIMENSION "*3" DOES INCLUDE TRIM OFFSET.
Reference Symbol
Dimension Millimeters 4.90 3.95
0.10
0.14
0.25 1.75
0.34
0.40
0.46
0.15
0.20
0.25
5.80 6.10 1.27 0.25 0.75 0.40 0.60 1.08 1.27 6.20
Detail
Ordering Information
Part Name HAT1038R-EL-E HAT1038RJ-EL-E 2500 2500 Quantity Taping Taping Shipping Container
Note: some grades, production terminated. Please contact Renesas sales office check state production before ordering product.
Rev.5.00 2005 page
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corp. puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corp. product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corp. third party. Renesas Technology Corp. assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corp. without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corp. assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corp. various means, including Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corp. assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corp. semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corp. authorized Renesas Technology Corp. product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corp. necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corp. further details these materials products contained therein.
RENESAS SALES OFFICES
Refer latest detailed information. Renesas Technology America, Inc. Holger Way, Jose, 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> 2715-2888, Fax: <886> 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. Harbour Front Avenue, #06-10, Keppel Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
2005. Renesas Technology Corp., rights reserved. Printed Japan.
Colophon .3.0

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