QUALITY SYSTEM Product quality Dallas Semiconductor results from combi

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QUALITY SYSTEM Product quality Dallas Semiconductor results from combi

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QUALITY RELIABILITY
QUALITY SYSTEM Product quality Dallas Semiconductor results from combination design techniques, vendor controls, manufacturing methods, process monitors, quality control inspections. monitors placed strategic points ensure that potential defects detected promptly. QUALITY CONTROL PROCESSES PRODUCT QUALIFICATION Product qualification activity Dallas Semiconductor involves series accelerated stress tests applied production-ready material follows defined qualification plan. Random samples from least three production lots, equally representing production version product, tested meet reliability requirements. device failures detected during production qualification subsequent monitoring fully analyzed Failure Analysis Laboratory. Products Dallas Semiconductor fall into three classifications: Prototype Engineering Sample, Prequal, Fully Qualified.
Incoming Quality Control (IQC):
Piece parts materials inspected IQC. vendors piece parts receive First Article Inspection; subsequent incoming materials receive sample inspection MIL-STD-105. Each manufacturing operation inspects work, ensuring immediate feedback preventing deviations from going undetected subsequent processing.
In-Process Inspections:
Prototype Engineering Sample:
Statistical Process Control (SPC):
Implemented manufacturing, this process determines what inputs product flow critical track control those inputs. Quality Engineering provides training, computer analysis, feedback manufacturing. order guarantee accuracy completeness in-process inspections monitors, Toll Gates strategic locations perform sample inspections MIL- STD-105.
Prototype products have been fully characterized data sheet limits. However, based upon limited data, these products will meet data sheet limits. Final test processes used manufacture product under engineering control. Qualification product started. brand prototype products will PROTO Prequal products meet prototype requirements characterized data sheet limits. Final test processes used manufacture product stable under manufacturing control. Qualification product started.
Prequal:
In-Process Sample Tests:
Fully Qualified:
RELIABILITY SYSTEM Reliability accomplished through rigorous, comprehensive methodology qualifying, analyzing, monitoring equipment, processes, products, packages. state-of-the-art environmental facility allows accelerated stresses performed monitored house. addition, metallurgical laboratory been equipped perform real-time x-ray, x-ray fluorescense, solderability measurements. minimize human influence outcome reliability activity, dedicated group technicians assistants handle reliability stressing testing. Reliability data resides customized computer- based tracking retrieval system. Technical support includes oven chamber calibrations, 100% electrical board checks, strict electrostatic protection.
Fully qualified products meet prototype prequal requirements. qualification requirements given next section have been completed. Product must statistically meet reliability failure rates quality requirements established Quality Reliability Engineering.
Tables list tests which Dallas Semiconductor product must pass order classified fully qualified. RELIABILITY MONITOR PROGRAM order maintain continuous qualification status products, Dallas Semiconductor implemented extensive Reliability Monitor Program (RMP). monitors design, wafer fabrication, assembly processes qualified products database. Product selected monthly from finished goods subjected series reliability tests similar those used original qualification. failures generated from these tests require analysis root cause corrective action. Data from published quarterly available demand.
QUALITY RELIABILITY FULL QUALIFICATION REQUIREMENTS INTEGRATED CIRCUIT PRODUCTS Table
STRESS/TEST Outgoing Elec. Test Infant Life High Temperature Operating Life Condition Prediction High Voltage Life High Temperature Storage Temperature Humidity Bias Autoclave Temperature Cycle X-Ray Bond Pull Dimensions Lead Integrity Solderability Latch-up CONDITION Data Sheet 125°C, 7.0V 125°C, 5.5V 55°C, 5.5V 125°C, 7.0V 150°C, Bias 85°C/85% 5.5V 121°C, ASteam, Unbiased -55°C +125°C MIL-STD-883 Method 2012 MIL-STD-883 Method 2011 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2003 MIL-STD-883 Method 3015 JEDEC Std. Steamage Premold DURATION 1000 years 1000 1000 1000 1000 cycle ACCEPTANCE CRITERIA (LTPD) 0.15% 0.3% *0.4% Fits *0.4% 2.0% 1.0% 1.5% 1.0% 1.5% 3.0% 3.0% ±1000 volts mW/pin
Combined high voltage life operating life requirement.
QUALITY RELIABILITY FULL QUALIFICATION REQUIREMENTS MODULE PRODUCTS Table
STRESS/TEST Outgoing Elec. Test Condition Prediction High Temperature Storage *Temperature Humidity Bias Temperature Cycle X-Ray Dimensions Lead Integrity Solderability Selected products. CONDITION Data Sheet 55°C, 5.5V 85°C, Bias 85°C/85% 5.5V -40°C +85°C MIL-STD-883 Method 2012 MIL-STD-883 Method 2016 MIL-STD-883 Method 2004 MIL-STD-883 Method 2003 Steamage DURATION years 1000 1000 cycle ACCEPTANCE CRITERIA (LTPD) 0.15% Fits 2.0% 1.0% 1.0% 3.0% 3.0%
FULL QUALIFICATION REQUIREMENTS SIPSTIK TOUCH MEMORY PRODUCTS Table
STRESS/TEST Outgoing Elec. Test High Temperature Storage Temperature Humidity Temperature Cycle CONDITION Data Sheet 85°C, Bias 60°C/90% -40°C +85°C DURATION 1000 cycle ACCEPTANCE CRITERIA (LTPD) 0.15% 7.0% 7.0% 7.0%

QUALITY SYSTEM Product quality Dallas Semiconductor results from combi

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