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Schottky Power Rectifier
Surface Mount Power Package
Schottky Power Rectifiers employ Schottky Barrier principle large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation metal overlay contact. Ideally suited voltage, high frequency rectification, free wheeling polarity protection diodes, surface mount applications where compact size weight critical system. These state-of-the-art devices have following features: Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package Automated Handling Highly Stable Oxide Passivated Junction High Blocking Voltage Volts 150°C Operating Junction Temperature Guardring Stress Protection
MBRS1100T3 MBRS190T3
Motorola Preferred Device
SCHOTTKY BARRIER RECTIFIER AMPERE VOLTS
Mechanical Characteristics Case: Epoxy, Molded Weight: (approximately) Finish: External Surfaces Corrosion Resistant Terminal Leads Readily Solderable Lead Mounting Surface Temperature Soldering Purposes: 260°C Max. Seconds Shipped Tape Reel, 2500 units reel Polarity: Notch Plastic Body Indicates Cathode Lead Markings; MBRS190T3: Markings; MBRS1100T3: MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage Blocking Voltage Average Rectified Forward Current 120°C 100°C Symbol VRRM VRWM IF(AV) IFSM dv/dt MBRS190T3
CASE 403A-03
MBRS1100T3
Unit Volts
Amps Amps V/ns
Nonrepetitive Peak Surge Current (Surge applied rated load conditions halfwave, single phase, Operating Junction Temperature Voltage Rate Change
+150
THERMAL CHARACTERISTICS
Thermal Resistance Junction Lead 25°C) °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage 25°C) Maximum Instantaneous Reverse Current (Rated Voltage, 25°C) (Rated Voltage, 100°C) Pulse Test: Pulse Width Duty Cycle 2.0%.
Preferred devices Motorola recommended choices future best overall value.
0.75
Volts
Rectifier Device Data Motorola, Inc. 1999
This Material Copyrighted Respective Manufacturer
MBRS1100T3 MBRS190T3
TYPICAL ELECTRICAL CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT (AMPS) 0.05 0.02 100°C 25°C 150°C 0.04 0.02 0.01
REVERSE CURRENT
150°C 125°C 100°C
25°C
INSTANTANEOUS VOLTAGE (VOLTS)
REVERSE VOLTAGE (VOLTS)
Figure Typical Forward Voltage
Figure Typical Reverse Current*
*The curves shown typical highest voltage device voltage grouping. Typical reverse current lower voltage selections estimated from these curves sufficient below rated
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
F(AV) AVERAGE FORWARD CURRENT (AMPS)
SQUARE WAVE 100°C
RATED APPLIED 22°C/W 100°C SQUARE WAVE
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
LEAD TEMPERATURE (°C)
Figure Power Dissipation
Figure Current Derating, Lead
NOTE: TYPICAL CAPACITANCE NOTE:
CAPACITANCE (pF)
REVERSE VOLTAGE (VOLTS)
Figure Typical Capacitance
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Rectifier Device Data
MBRS1100T3 MBRS190T3
INFORMATION USING SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS
Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection interface between board package. With correct geometry, packages will self align when subjected solder reflow process.
0.089 2.261
0.108 2.743
0.085 2.159
inches
MOUNTING PRECAUTIONS
melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference shall maximum 10°C.
soldering temperature time shall exceed When shifting from preheating soldering, maximum After soldering been completed, device should
allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling Soldering device without preheating cause excessive thermal shock stress which result damage device. temperature gradient shall less. 260°C more than seconds.
Rectifier Device Data
This Material Copyrighted Respective Manufacturer
MBRS1100T3 MBRS190T3
PACKAGE DIMENSIONS
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION SHALL MEASURED WITHIN DIMENSION
INCHES 0.160 0.180 0.130 0.150 0.075 0.095 0.077 0.083 0.0020 0.0060 0.006 0.012 0.030 0.050 0.020 0.205 0.220
MILLIMETERS 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 5.21 5.59
CASE 403A-03 ISSUE
Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters which provided Motorola data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part. Motorola registered trademarks Motorola, Inc. Motorola, Inc. Equal Opportunity/Affirmative Action Employer. Mfax trademark Motorola, Inc. reach EUROPE Locations Listed: Motorola Literature Distribution; P.O. 5405, Denver, Colorado 80217. 1-303-675-2140 1-800-441-2447 Customer Focus Center: 1-800-521-6274 MfaxTM: RMFAX0@email.sps.mot.com TOUCHTONE 1-602-244-6609 ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, Motorola Back System Canada ONLY 1-800-774-1848 King Street, Industrial Estate, N.T., Hong Kong. http://sps.motorola.com/mfax/ 852-26668334 HOME PAGE: http://motorola.com/sps/ JAPAN: Motorola Japan Ltd.; SPD, Strategic Planning Office, 141, 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan. 81-3-5487-8488
MBRS1100T3/D Rectifier Device Data
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