Views Quality Reliability Hitachi products should always meet ind
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Quality Assurance Memories
Views Quality Reliability
Hitachi products should always meet individual users' purposes required quality levels, maintaining satisfactory performance general applications. Hitachi works continuously assure high reliability standards memories actual usage. meet user needs cover expanding applications, Hitachi defined these goals: Establish reliability design during product development. Establish quality steps manufacturing process. Strengthen inspection process points. Improve product quality based user data.
Furthermore, reach highest quality performance levels, development production teams cooperate very closely with Hitachi research laboratories. these methods together make possible Hitachi meet exceed user requirements.
Reliability Design Semiconductor Devices
Reliability Targets establishment reliability targets important manufacturing marketing, well determining function price. Practically, reliability targets cannot determined from failure rates produced single common test condition; they based many factors such equipment characteristics, target system purposes, derating applied during design, operating conditions, maintenance requirements. Reliability Design Factors Timely analysis execution essential achieve performance based reliability targets. primary design items interest design standardization, device process structural design, design review, reliability testing. Design standardization Design standardization requires establishment design rules specification parts, materials, processes. When design rules being established circuit, cell, layout designs, critical quality reliability features should also examined. doing this effectively, stand-ardized processes materials, even newly developed products, should generate much higher reliability (with possible exception special requirements functions). Device process structural design important during device design consider total balance process design, structural design, circuit layout design. Especially case applying processes materials, Hitachi study technology depth prior detailed device development.
Quality Assurance Memorie
Reliability testing test site test site also called test pattern. useful method evaluating reliability complex complicated functions. purposes test site are: make clear definitions about mental failure modes analyze relationships between failure modes manufacturing processes and/or conditions analyze failure mechanisms establish points manufacturing effects test site are: Evaluation common fundamental failure modes failure mechanisms Determination predominant failure modes, comparisons with field experiences Analysis relationships between failure causes manufacturing factors Simplification testing
Design Review Design review method systematically confirm whether design satisfies performance required users, whether meets specifications, whether technical items accumulated test data application data effectively utilized. addition, from standpoint comparisons competitive products, major focus design review insure quality reliability product. Hitachi, design review perform-ed part product development, when changing existing products. following items considered design review. Describing product based specified design documents. Planning executing each product function program (such calculations) considering product documentation from standpoint each participant. Experiments further investigations indicated results exactly expected. Determining contents methods reliability testing based design documents drawings. Checking manufacturing process ability achieve design goals. Arranging preparations production. Planning executing each product function program design changes proposed individual specialists. Generating tests, experiments, calculations needed confirm results each design change. Refering past performance failure experiences with similar devices. Confirming prevention repetition such experience, planning executing test program prove this level performance. Hitachi, design reviews including these steps analysis decision made using individual check lists according each objective.
Quality Assurance Memorie
Quality Assurance System Semiconductor Devices
Activity Quality Assurance Hitachi, these general purposes quality assurance: Problems resolved within each step, that final stage production even very small potential failure factors will removed. Information developed every step used other steps, indicated, improve quality entire production sequence, therefore achieve satisfactory levels reliability performance. Qualification maximum product quality reliability, qualification tests done each stage trial production mass production, based design reliability described Section "Reliability Design Semiconductor Devices." These purposes qualification Hitachi. Qualify product objectively from customer standpoint third party). Consider failure experiences data provided customers. Qualify every change design process. Qualify, with special emphasis, final choices parts, materials, processes. Establish control points within production procedure considering process ability factors manufacturing variance.
Figure shows general outline design qualification Hitachi.
Quality Assurance Memorie
Step
Target Specification Design Trial Production Materials, Parts Approval
Contents
Design Review Characteristics Material Parts Appearance Dimension Heat Resistance Mechanical Electrical Others
Electrical Characteristics Function Voltage Current Temperature Others Appearance. Dimension
Purpose
Confirmation Characteristics Reliability Materials Parts
Characteristics Approval
Confirmation Target Sepc. Mainly about Electrical Characteristics
Quality Approval
Reliability Test Life Test Thermal Stress Moisture Resistance Mechanical Stress Others
Confirmation Quality Reliability Design
Quality Approval
Reliability Test Process Check same Quality Approval
Confirmation Quality Reliability Mass Production
Mass Production
Figure Flowchart Device Design Qualification
Quality Assurance Memorie
Quality Reliability Control Mass Production mass production, quality functional responsibility each department, primarily defined manufacturing department quality assurance department. total function flow shown Figure
Process Material, Parts Material, Parts Quality Control Method
Inspection Material Parts
Inspection Material Parts Semiconductor Devices Manufacturing Equipment, Environment, Sub-material, Worker Control
Sampling, Confirmation Quality Level
Manufacturing
Confirmation Quality Level
Screening
Inner Process Quality Control
Sampling, Confirmation Quality Level
100% Inspection
100% Inspection Visual Electrical Characteristics Sampling Inspection Visual Electrical Characteristics
Testing, Inspection
Products Products Inspection
Sampling
Reliability Test
Confirmation Quality Level, Sampling
Warehouse Quality Information Claim Field Experience General Quality Information Feedback Information
Shipment Customer
Figure Flowchart Quality Control Manufacturing Process
Quality Assurance Memorie
3.3.1 Quality Control Parts Materials With tendency toward higher performance higher reliability devices, quality control parts materials becomes more important. Items such crystals, lead frames, fine wire wire bonding, packages materials required manufacturing processes like mask patterns chemicals subject inspection control. Besides qualification parts materials stated Section 3.2, quality control parts materials begins incoming inspection, which performed based purchase specifications, drawings (mainly) sampling tests based MIL-STD-105D. Other activities related quality assurance follows. Technology meetings with vendors. Approval guidance vendors. Analysis test physical chemistry.
Quality Assurance Memorie
typical check points parts materials shown Table Table Quality Control Check Points Parts Materials (example)
Material parts Water Important control items Appearance Dimension Sheet resistance Defect density Crystal axis Appearance Dimension Resistoration Gradation Appearance Dimension Purity Elongation ratio Appearance Dimension Processing accuracy Plating Mounting characteristics Appearance Dimension Leakage resistance Plating Mounting characteristics Electrical characteristics Mechanical strength Composition Electrical charactristics Thermal characteristics Molding performance Mounting characteristics Check points Damage contamination surface Flatness Resistance Defect numbers Defect numbers, scratches Dimension level Uniformity gradation Contamination, scratches, bend, twist Purity level Mechanical strength Contamination, scratches Dimension level Bondability, solderability Heat resistance Contamination, scratches Dimension level Airtightness Bondability, solderability Heat resistance Mechnical strength Characteristics plastic material
Mask
Fine wire wire bonding
Frame
Ceramic package
Plastic
Molding performance Mounting characteristics
Quality Assurance Memorie
3.3.2 Process Quality Control Control process quality extremely significant overall process device quality assurance. Quality control functions every stage production described below. Figure lists specific process quality control factors. Quality control products every stage production Potential device failure factors should removed soon possible manufacturing process. this, check points within each process prevent products exhibiting failure factors move onto following process. Especially devices designed high reliability, manufacturing lines rigidly monitored control process quality. Additionally, perform very stringent checks some processes and/or lots, even 100% inspections certain critical processes remove potentially failing items related unavoidable manufacturing variances. Screening based high temperature aging temperature cycling also part quality assurance procedures. Controlling quality during processing includes these items: Control conditions equipment workers Sampling test uncompleted products Proposal implementation improvements working conditions Continuous worker education Maintenance improvement yields Identification quality problems, implementation countermeasures them Communication quality-related information
Quality control manufacturing facilities measuring equipment Manufacturing facilities have been developed answer need higher device performance automated production. also important define accurately measure quality reliability. Hitachi, automated manufacturing used reduce manufacturing variances. operation high perfrmance equipment requires automated control function properly. Maintenance inspections carried daily ensure proper quality control, some instances other more frequent intervals according specifications, every check point. adjustment maintenance measuring equipment done according specifications past experience, vigorously monitored maintain improve quality products. Quality control manufacturing environment submaterial Final quality reliability devices especially affected manufacturing processes. therefore thoroughly control factors manufacturing environment, such gases pure water. Dust control critical achieve higher integration higher device reliability. maintain improve cleanliness manufacturing site, take great care keep buildings, facilities, air-conditioning systems, materials, clothes, possible elements associated with production clean dust-free can. extend this effort periodically check ambient manufacturing facility floating dust, check minute amounts which might have accumulated floor, other surfaces, equipment.
Quality Assurance Memorie
Process
Purchase Material Wafer Surface Oxidation Inspection Surface Oxidation Photo Resist Inspection Photo Resist Level Check Diffusion Inspection Diffusion Level Check Evaporation Inspection Evaporation Level Check Wafer Inspection Inspection Chip Electrical Characteristics Chip Scribe Inspection Chip Appearance Judgement Frame Assembling Assembling Appearance after Chip Bonding Appearance after Wire Bonding Pull Strength, Compresion Width, Shear Strength Appearance after Assembling Quality Check Chip Bonding Quality Check Wire Bonding Prevention Open Short Wafer Chip Thickness, Characteristics Electrical Characteristics Appearance Chip Prevention Crack, Quality Assurance Scribe Evaporation Diffusion Photo Resist Dimension, Appearance Diffusion Depth, Sheet Resistance Gate Width Characteristics Oxide Film Breakdown Voltage Thickness Vapor Film, Scratch, Contamination Dimension Level Check Photo Resist Diffusion Status Control Basic Parameters (VTH, etc) Cleaness surface Prior Check Breakdown Voltage Check Assurance Standard Thickness Wafer Oxidation Appearance, Thickness Oxide Film Characteristics, Appearance Scratch, Removal Crystal Defect Wafer Assurance Resistance Pinhole, Scratch
Control Point
Purpose Control
Level Check Inspection after Assembling Judgement Package Sealing Level Check Final Electrical Inspection Failure Analysis Appearance Inspection Sampling Inspection Products Receiving Shipment Sealing Marking
Appearance after Sealing Outline, Dimension Marking Strength Analysis Failures, Failure Mode, Mechanism
Guarantee Appearance Dimension Feedback Analysis Information
Figure Example Process Quality Control Factors
Quality Assurance Memorie
3.3.3 Final Tests Reliability Assurance Tests Final tests inspection done quality assurance department products already passed 100% testing during manufacturing process. Although 100% performance expected, sample inspection also carried prevent possible accidental mixture failed products with regular, satisfactory devices. extra inspection only confirms that products meet user requirements, considers other potential factors. inspection based MIL-STD-105D. Reliability assurance tests assure reliability, appropriate tests performed periodically each manufacturing user requires such high level examination.
Quality Assurance Memorie
Customer Claim (Failures, Information) Sales Dept. Sales Engineering Dept.
Quality Assurance Dept.
Failure Analysis
Manufacturing Dept.
Design Dept.
Countermeasure Execution Countermeasure
Report Follow-up Confirmation Countermeasure Execution
Quality Assurance Dept. Report
Sales Dept. Sales Engineering Dept. Reply
Customer
Figure Process Flowchart Customer-Reported Failure
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