Power, High Performance Radiation Hardened Operational Amplifier
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HS-2700RH
Power, High Performance Radiation Hardened Operational Amplifier
HS-2700RH radiation hardened internally compensated operational amplifiers which employ dielectric isolation achieve excellent dynamic performance with very quiescent power consumption. performance amplifier input characterized high CMRR (106dB), offset voltage (0.5mV), along with bias offset current (5.0nA 2.5nA respectively). These input specifications, conjunction with offset null capability open-loop gain 300,000V/V, enable HS-2700RH provide accurate, high-gain signal amplification. Gain bandwidth 1MHz slew rate 20V/µs allow processing fast, wideband signals. Input output signal amplitudes least volts accommodated while providing output drive capability 10mA. maximum reliability, output protected event short circuits ground. amplifier operates from wide range supplies (±5.5V ±20V) with maximum quiescent supply drain only 150µA. HS-2700RH therefore, ideally suited low-power instrumentation filtering applications that require fast, accurate response over wide range signal frequency. HS-2700RH rated operational from -55oC +125oC available lead CerDIP package lead Metal package.
PACKAGE Lead CerDIP Lead Metal
October 1995
Features
Power Supply Current .150µA 90µA High CMRR 86dB 106dB Input Bias Current 20nA Offset Current 10nA 2.5nA Total Dose. (Si)
Applications
High Gain Amplifier Instrumentation Amplifiers Active Filters Telemetry Systems Battery-Powered Equipment
Ordering Information
PART NUMBER HS1-2700RH-Q HS2-2700RH-Q TEMPERATURE RANGE -55oC 125oC -55oC 125oC
Pinouts
LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE (CerDIP), MIL-STD-1835, GDIP1-T14 VIEW
GUARD GUARD
LEAD METAL PACKAGE (CAN) MIL-STD-1835, MACY1-X8 VIEW
OUTPUT
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper I.C. Handling Procedures. Copyright
Harris Corporation 1995
Spec Number File Number
518812 3624.1
Specifications HS-2700RH
Absolute Maximum Ratings
Voltage Between Terminals Differential Input Voltage ±18V Voltage Either Input Terminal VJunction Temperature (TJ) +175oC Storage Temperature Range -65oC +150oC Lead Temperature (Soldering 10s) +275oC
Reliability Information
Thermal Resistance CerDIP Package 75oC/W 20oC/W Metal Package 160oC/W 70oC/W Maximum Package Power Dissipation +125oC CerDIP Package 0.67W Metal Package 0.31W device power exceeds package dissipation capability, provide heat sinking derate linearly following rate: CerDIP Package 13.3mW/oC Metal Package 6.3mW/oC
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
Operating Conditions
Operating Temperature Range -55oC +125oC Operating Supply Voltage ±15V VINcm
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS Device Tested VSUPPLY ±15V, RSOURCE 100, RLOAD 500k, VOUT Unless Otherwise Specified LIMITS PARAMETERS Input Offset Voltage SYMBOL CONDITIONS GROUP SUBGROUP Input Bias Current VOUT +10V VOUT -10V +10V -25V VOUT -10V -10V +25V VOUT +10V -AVOL Common Mode Rejection Ratio +CMRR TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC UNITS kV/V kV/V kV/V kV/V
Input Offset Current
Large Signal Voltage Gain
+AVOL
-CMRR
+25oC +125oC, -55oC
Output Voltage Swing
+VOUT
+25oC +125oC, -55oC +25oC +125oC, -55oC
-VOUT
Spec Number
518812
Specifications HS-2700RH
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Tested VSUPPLY ±15V, RSOURCE 100, RLOAD 500k, VOUT Unless Otherwise Specified LIMITS PARAMETERS Output Current SYMBOL +IOUT CONDITIONS VOUT -10V GROUP SUBGROUP -IOUT VOUT +10V Quiescent Power Supply Current +ICC IOUT -ICC IOUT Power Supply Rejection Ratio +PSRR VSUP +20V, -15V +10V, -15V VSUP -10V +15V, -20V +15V, -10V Note -VIOAdj Note NOTE: Offset adjustment range [VIO (measured) ±1mV] minimum referred output. This test functionality only assure adjustment through TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC -150 -150 VIO-1 VIO-1 VIO+1 VIO+1 UNITS
-PSRR
Offset Voltage Adjustment
+VIOAdj
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS Device Tested VSUPPLY ±15V, RLOAD CLOAD 75pF, AVCL +3V/V, Unless Otherwise Specified LIMITS PARAMETERS Slew Rate SYMBOL CONDITIONS VOUT GROUP SUBGROUP VOUT Rise Fall Time VOUT +160mV VOUT -160mV TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC UNITS V/µs V/µs V/µs V/µs
Spec Number
518812
Specifications HS-2700RH
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Tested VSUPPLY ±15V, RLOAD CLOAD 75pF, AVCL +3V/V, Unless Otherwise Specified LIMITS PARAMETERS Overshoot SYMBOL CONDITIONS VOUT +160mV GROUP SUBGROUP VOUT -160mV TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC UNITS
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS Table intentionally left blank.
TABLE POST RAD(S) ELECTRICAL CHARACTERISTICS Device Tested VSUPPLY ±15V, RSOURCE 100, RLOAD 500k, VOUT Unless Otherwise Specified LIMITS PARAMETERS Input Offset Voltage Input Bias Current SYMBOL CONDITIONS VOUT +10V VOUT -10V +10V -25V VOUT -10V -10V +25V VOUT +10V VOUT -10V VOUT +10V GROUP SUBGROUP TEMPERATURE +25oC +25oC UNITS
+25oC
Input Offset Current
+25oC
Large Signal Voltage Gain
+AVOL
+25oC
kV/V
-AVOL
+25oC
kV/V
Common Mode Rejection Ratio
+CMRR
+25oC
-CMRR
+25oC
Output Voltage Swing
+VOUT -VOUT
+25oC +25oC +25oC +25oC
Output Current
+IOUT -IOUT
Spec Number
518812
Specifications HS-2700RH
TABLE POST RAD(S) ELECTRICAL CHARACTERISTICS (Continued) Device Tested VSUPPLY ±15V, RSOURCE 100, RLOAD 500k, VOUT Unless Otherwise Specified LIMITS PARAMETERS Quiescent Power Supply Current SYMBOL +ICC -ICC Power Supply Rejection Ratio +PSRR VSUP +20V, -15V +10V, -15V VSUP +15V, -20V +15V, -10V (Note (Note CONDITIONS GROUP SUBGROUP TEMPERATURE +25oC +25oC +25oC -150 UNITS
-PSRR
+25oC
Offset Voltage Adjustment
+VIOadj -VIOadj
+25oC +25oC
VIO-1 VIO+1
NOTE: Offset adjustment range [VIO (measured) ±1mV] minimum referred output. This test functionality only assure adjustment through
TABLE POST RAD(S) ELECTRICAL CHARACTERISTICS Device Tested VSUPPLY ±15V, RLOAD CLOAD 75pF, AVCL 3V/V, Unless Otherwise Specified LIMITS PARAMETERS Slew Rate SYMBOL CONDITIONS VOUT to+4V (Note VOUT (Note VOUT +160mV (Note VOUT -160mV (Note VOUT +160mV (Note VOUT -160mV (Note GROUP SUBGROUP TEMPERATURE +25oC UNITS V/µs
+25oC
V/µs
Rise Fall Time
+25oC
+25oC
Overshoot
+25oC
+25oC
NOTE: Offset adjustment range [VIO (measured) ±1mV] minimum referred output. This test functionality only assure adjustment through
Spec Number
518812
Specifications HS-2700RH
TABLE POST BURN-IN DELTA PARAMETERS PARAMETERS IBIAS DELTA LIMITS ±2.0mV ±15nA
TABLE APPLICABLE SUBGROUPS GROUP SUBGROUPS CONFORMANCE GROUPS Initial Test Interim Test Final Test Group (Note Subgroup Subgroup Group Group Subgroup NOTES: Alternate Group testing accordance with MIL-STD-883 Method 5005 exercised. Table parameters only. MIL-STD-883 METHOD 100% 5004 100% 5004 100% 5004 100% 5004 Sample 5005 Sample 5005 Sample 5005 Sample 5005 Sample 5005 TESTED (Note RECORDED (Note (Note
Spec Number
518812
HS-2700RH Harris Space Level Product Flow
Wafer Acceptance (All Lots) Method 5007 (Includes SEM) (Note GAMMA Radiation Verification (Each Wafer) Method 1019, Samples/Wafer, Rejects 100% Attach 100% Nondestructive Bond Pull, Method 2023 Sample Wire Bond Pull Monitor, Method 2011 Sample Shear Monitor, Method 2019 2027 100% Internal Visual Inspection, Method 2010, Condition 100% Temperature Cycle, Method 1010, Condition Cycles 100% Constant Acceleration, Method 2001, Condition Method 5004 100% PIND, Method 2020, Condition 100% External Visual
NOTES: Modified Inspection, compliant MIL-STD-883, Method 2018. This device does meet Class minimum metal step coverage 50%. metal does meet current density requirement A/cm2. Data provided upon request. Failures from subgroup deltas used calculating PDA. maximum allowable Radiographic (X-Ray) inspection performed point after serialization allowed Method 5004. Alternate Group testing performed allowed MIL-STD-883, Method 5005. Data Package Contents: Cover Sheet (Harris Name and/or Logo, P.O. Number, Customer Part Number, Date Code, Harris Part Number, Number, Quantity). Wafer Acceptance Report (Method 5007). Includes reproductions photos with percent step coverage. GAMMA Radiation Report. Contains Cover page, disposition, Dose, Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read Record data file Harris. X-Ray report film. Includes penetrometer measurements. Screening, Electrical, Group attributes (Screening attributes begin after package seal). Serial Number Sheet (Good units serial number number). Variables Data (All Delta operations). Data identified serial number. Data header includes number date test. Certificate Conformance part shipping invoice part Data Book. Certificate Conformance signed authorized Quality Representative.
100% Serialization 100% Initial Electrical Test (T0) 100% Static Burn-In, Condition Hours, +125oC Equivalent, Method 1015 100% Interim Electrical Test (T1) 100% Delta Calculation (T0-T1) 100% PDA, Method 5004 (Note 100% Final Electrical Test 100% Fine/Gross Leak, Method 1014 100% Radiographic (X-Ray), Method 2012 (Note 100% External Visual, Method 2009 Sample Group Method 5005 (Note 100% Data Package Generation (Note
Spec Number
518812
HS-2700RH Test Circuit (Applies Tables
ACOUT OPEN OPEN OPEN -VEE 1.6K +VCC 75pF (NOTE) -1/10
LOOP STABILITY, VALUE CAPACITOR PREVENT OSCILLATION
OPEN
EOUT RESISTORS CAPACITORS ±10% (mF) BUFFER 500K OPEN
OPEN
NOTE: Includes stray capacitances.
Timing Waveforms
VOUT
1.6K
75pF
FIGURE SIMPLIFIED TEST CIRCUIT (Applies Table
+1.0V INPUT INPUT
+40mV
-1.0V +2.5V OUTPUT -2.5V SLEW RATE
OVERSHOOT +160mV OUTPUT RISE TIME
-40mV
FIGURE SLEW RATE WAVEFORM
FIGURE TRANSIENT RESPONSE WAVEFORM
NOTE: Measured both positive negative transitions. Capacitance Compensation should minimized.
Spec Number
518812
HS-2700RH Typical Performance Curves
VOLTAGE (mV) TEMPERATURE (oC) TEMPERATURE (oC) CURRENT (mA) BIAS CURRENT
+25oC, VSUPPLY ±15V, Unless Otherwise Specified
OFFSET CURRENT
FIGURE OFFSET VOLTAGE FUNCTION TEMPERATURE
FIGURE INPUT BIAS CURRENT OFFSET CURRENT FUNCTION TEMPERATURE
BIAS CURRENT (nA) -100 -200 -300 -400 -500 COMMON MODE VOLTAGE ±15.0V +25oC
BIAS CURRENT (µA) ±15.0V +25oC
DIFFERENTIAL INPUT VOLTAGE
FIGURE BIAS CURRENT FUNCTION COMMON MODE VOLTAGE
FIGURE BIAS CURRENT FUNCTION DIFFERENTIAL INPUT VOLTAGE
1000 POWER SUPPLY CURRENT (µA)
POWER SUPPLY CURRENT (µA)
±15.0V +25oC
±20.0V ±15.0V ±10.0V ±5.5V
DIFFERENTIAL INPUT VOLTAGE (mV)
TEMPERATURE (oC)
FIGURE POWER SUPPLY CURRENT FUNCTION DIFFERENTIAL INPUT VOLTAGE
FIGURE POWER SUPPLY CURRENT FUNCTION TEMPERATURE
Spec Number
518812
HS-2700RH Typical Performance Curves
GAIN (dB) ±20.0V ±15.0V ±10.0V ±5.5V TEMPERATURE (oC)
+25oC, VSUPPLY ±15V, Unless Otherwise Specified (Continued)
FIGURE VOLTAGE GAIN FUNCTION TEMPERATURE NOTE: Open loop (comparator) applications recommended, because above characteristic.
Burn-In Circuits
HS1-2700RH CerDIP HS2-2700RH METAL
NOTES: ±5%, 1/4W (Min) 0.01µF/Socket (Min) 0.1µF/Row (Min) 1N4002 equivalent (per board) |(V+) (V-)|
NOTES: ±5%, 1/4W (Min) 0.01µF/Socket (Min) 0.01µF/Socket (Min) 0.1µF/Row (Min) 1N4002 equivalent (per board) |(V+) (V-)| Insulated scope probe must used during board check-out.
Spec Number
518812
HS-2700RH Irradiation Circuit
NOTES: ±5%, 1/4W +15V 1.0V -15V 1.0V
Spec Number
518812
HS-2700RH Schematic Diagram
OSV1
430K
NOMINAL CURRENTS SHOWN MICROAMPERES
Spec Number
518812
HS-2700RH Metallization Topology
DIMENSIONS: 20mils (1780 1530 1530µm) METALLIZATION: Type: Aluminum Thickness: GLASSIVATION: Type: Nitride Thickness: WORST CASE CURRENT DENSITY: A/cm2 SUBSTRATE POTENTIAL (Powered Up): Unbiased
Metallization Mask Layout
HS-2700RH
OUTPUT
Spec Number
518812
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