Radiation Hardened Quad 2-Input Multiplexers Pinouts LEAD CE
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HCS157MS
Radiation Hardened Quad 2-Input Multiplexers
Pinouts
LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH VIEW
September 1995
Features
Micron Radiation Hardened CMOS Total Dose 200K (Si) Effective Upsets: >100 MEV-cm2/mg Single Event Upset (SEU) Immunity 10-9 Errors/Bit-Day (Typ) Dose Rate Survivability: 1012 (Si)/s Dose Rate Upset >1010 (Si)/s, 20ns Pulse Latch-Up Free Under Conditions Military Temperature Range: -55oC +125oC Significant Power Reduction Compared LSTTL Operating Voltage Range: 4.5V 5.5V Input Logic Levels Input Current Levels VOL,
Description
Harris HCS157MS Radiation Hardened quad 2-input multiplexers which select four bits data from sources under control common select input (S). Enable input NOT) active low. When enable high outputs (1Y-4Y) forced regardless other input conditions. Moving data from groups registers four common output busses common these devices. state Select input determines particular register from which data comes. They also used function generators. HCS157MS utilizes advanced CMOS/SOS technology achieve high-speed operation. This device member radiation hardened, high-speed, CMOS/SOS Logic Family. HCS157MS supplied lead Ceramic flatpack suffix) SBDIP Package suffix).
LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (FLATPACK) MIL-STD-1835 CDFP4-F16, LEAD FINISH VIEW
Ordering Information
PART NUMBER HCS157DMSR HCS157KMSR HCS157D/Sample HCS157K/Sample HCS157HMSR TEMPERATURE RANGE -55oC +125oC -55oC +125oC +25oC +25oC +25oC SCREENING LEVEL Harris Class Equivalent Harris Class Equivalent Sample Sample PACKAGE Lead SBDIP Lead Ceramic Flatpack Lead SBDIP Lead Ceramic Flatpack
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper I.C. Handling Procedures. Copyright
Harris Corporation 1995
Spec Number File Number
518833 3561.1
HCS157MS Functional Block Diagram
CIRCUITS IDENTICAL CIRCUIT ABOVE DASHED OUTLINE
TRUTH TABLE SELECT INPUTS
ENABLE High Level Level Immaterial
DATA INPUTS
OUTPUT
Spec Number
518833
Specifications HCS157MS
Absolute Maximum Ratings
Supply Voltage (VCC). -0.5V +7.0V Input Voltage Range, Inputs .-0.5V +0.5V Input Current, Input .±10mA Drain Current, Output. .±25mA (All Voltage Reference Terminal) Storage Temperature Range (TSTG) -65oC +150oC Lead Temperature (Soldering 10sec) +265oC Junction Temperature (TJ) +175oC Classification Class
Reliability Information
Thermal Resistance SBDIP Package. 73oC/W 24oC/W Ceramic Flatpack Package 114oC/W 29oC/W Maximum Package Power Dissipation +125oC Ambient SBDIP Package. 0.68W Ceramic Flatpack Package 0.44W device power exceeds package dissipation capability, provide heat sinking derate linearly following rate: SBDIP Package. 13.7mW/oC Ceramic Flatpack Package 8.8mW/oC
CAUTION: with semiconductors, stress listed under "Absolute Maximum Ratings" applied devices (one time) without resulting permanent damage. This stress rating only. Exposure absolute maximum rating conditions extended periods affect device reliability. conditions listed under "Electrical Performance Characteristics" only conditions recommended satisfactory device operation.
Operating Conditions
Supply Voltage (VCC). +4.5V +5.5V Input Rise Fall Times 4.5V (TR, .100ns Operating Temperature Range (TA) -55oC +125oC Input Voltage (VIL). Input High Voltage (VIH)
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP SUBGROUPS Output Current (Sink) 4.5V, 4.5V, VOUT 0.4V, (Note 4.5V, 4.5V, VOUT 0.4V, (Note 4.5V, 3.15V, 50µA, 1.35V 5.5V, 3.85V, 50µA, 1.65V Output Voltage High 4.5V, 3.15V, -50µA, 1.35V 5.5V, 3.85V, -50µA, 1.65V Input Leakage Current 5.5V, LIMITS TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC, +125oC, -55oC -7.2 -6.0 UNITS
PARAMETER Supply Current
SYMBOL
(NOTE CONDITIONS 5.5V,
Output Current (Source)
Output Voltage
+25oC, +125oC, -55oC
+25oC, +125oC, -55oC
-0.1 -0.1
+25oC, +125oC, -55oC
+25oC +125oC, -55oC +25oC, +125oC, -55oC
±0.5 ±5.0
Noise Immunity Functional Test NOTES:
4.5V, 3.15V, 1.35V, (Note
voltages referenced device GND. Force/Measure functions interchanged. functional tests, 4.0V recognized logic "1", 0.5V recognized logic "0".
Spec Number
518833
Specifications HCS157MS
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP SUBGROUPS TPLH 4.5V Propagation Delay Enable Output TPHL 4.5V TPLH 4.5V Propagation Delay Select Output TPHL 4.5V TPLH 4.5V NOTES: voltages referenced device GND. measurements assume 500, 50pF, Input 3ns, GND, LIMITS TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC UNITS
PARAMETER Propagation Delay Data Output
SYMBOL TPHL
(NOTES CONDITIONS 4.5V
TABLE ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Capacitance Power Dissipation SYMBOL CONDITIONS 5.0V, 5.0V, 1MHz NOTES Input Capacitance 5.0V, 5.0V, 1MHz Output Transition Time TTHL, TTLH 4.5V 4.5V, NOTE: parameters listed Table controlled design process parameters. Limits guaranteed directly tested. These parameters characterized upon initial design release upon design changes which affect these characteristics. TEMPERATURE +25oC +125oC, -55oC +25oC +125oC, -55oC +25oC +125oC, -55oC UNITS
Spec Number
518833
Specifications HCS157MS
TABLE POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS 200K LIMITS PARAMETER Supply Current Output Current (Sink) SYMBOL (NOTES CONDITIONS 5.5V, 4.5V, GND, VOUT 0.4V 4.5V, GND, VOUT -0.4V 4.5V 3.15, 1.35V, 50µA 5.5V, 3.85, =1.65V, 50µA Output Voltage High 4.5V, 3.15, 1.35V, -50µA 5.5V, 3.85, 1.65V, -50µA Input Leakage Current Noise Immunity Functional Test Propagation Delay Data Output 5.5V, 4.5V, 3.15V, 1.35V, (Note 4.5V 4.5V 4.5V 4.5V 4.5V 4.5V TEMPERATURE +25oC +25oC 0.75 UNITS
Output Current (Source) Output Voltage
+25oC
-6.0
+25oC
+25oC
+25oC
-0.1 -0.1
+25oC
+25oC +25oC
TPHL TPLH
+25oC +25oC +25oC +25oC +25oC +25oC
Propagation Delay Enable Output
TPHL TPLH
Propagation Delay Select Output
TPHL TPLH
NOTES: voltages referenced device GND. measurements assume 500, 50pF, Input 3ns, GND, VCC. functional tests 4.0V recognized logic "1", 0.5V recognized logic "0".
TABLE BURN-IN OPERATING LIFE TEST, DELTA PARAMETERS (+25oC) PARAMETER IOL/IOH GROUP SUBGROUP DELTA LIMIT 12µA -15% Hour
Spec Number
518833
Specifications HCS157MS
TABLE APPLICABLE SUBGROUPS CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test (Postburn-In) Interim Test (Postburn-In) Interim Test (Postburn-In) Final Test Group (Note Group Subgroup Subgroup Group NOTE: Alternate Group testing accordance with Method 5005 MIL-STD-883 exercised. METHOD 100%/5004 100%/5004 100%/5004 100%/5004 100%/5004 100%/5004 100%/5004 Sample/5005 Sample/5005 Sample/5005 Sample/5005 GROUP SUBGROUPS Deltas Deltas Deltas Subgroups ICC, IOL/H, IOZL/H READ RECORD ICC, IOL/H, IOZL/H ICC, IOL/H, IOZL/H ICC, IOL/H, IOZL/H
TABLE TOTAL DOSE IRRADIATION CONFORMANCE GROUPS Group Subgroup NOTE: Except test which will performed 100% Go/No-Go. TEST METHOD 5005 POST Table READ RECORD POST Table (Note
TABLE STATIC BURN-IN DYNAMIC BURN-IN TEST CONNECTIONS OSCILLATOR OPEN GROUND 0.5V 0.5V 50kHz 25kHz
STATIC BURN-IN TEST CONNECTIONS (Note
STATIC BURN-IN TEST CONNECTIONS (Note
DYNAMIC BURN-IN TEST CONNECTIONS (Note NOTES: Each except will have resistor static burn-in. Each except will have resistor dynamic burn-in.
TABLE IRRADIATION TEST CONNECTIONS OPEN GROUND 0.5V
NOTE: Each except will have resistor irradiation testing. Group Subgroup sample size dice/wafer failures.
Spec Number
518833
HCS157MS Harris Space Level Product Flow `MS'
Wafer Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, Samples/Wafer, Rejects 100% Nondestructive Bond Pull, Method 2023 Sample Wire Bond Pull Monitor, Method 2011 Sample Shear Monitor, Method 2019 2027 100% Internal Visual Inspection, Method 2010, Condition 100% Temperature Cycle, Method 1010, Condition Cycles 100% Constant Acceleration, Method 2001, Condition Method 5004 100% PIND, Method 2020, Condition 100% External Visual 100% Serialization 100% Initial Electrical Test (T0) 100% Static Burn-In Condition hrs. min., +125oC min., Method 1015 100% Interim Electrical Test (T1) 100% Delta Calculation (T0-T1) 100% Static Burn-In Condition hrs. min., +125oC min., Method 1015 100% Interim Electrical Test (T2) 100% Delta Calculation (T0-T2) 100% Method 5004 (Notes 1and 100% Dynamic Burn-In, Condition hrs., +125oC Equivalent, Method 1015 100% Interim Electrical Test (T3) 100% Delta Calculation (T0-T3) 100% Method 5004 (Note 100% Final Electrical Test 100% Fine/Gross Leak, Method 1014 100% Radiographic, Method 2012 (Note 100% External Visual, Method 2009 Sample Group Method 5005 (Note 100% Data Package Generation (Note
NOTES: Failures from Interim electrical test combined determining Failures from subgroup deltas used calculating PDA. maximum allowable with more than failures from subgroup Radiographic (X-Ray) inspection performed point after serialization allowed Method 5004. Alternate Group testing performed allowed MIL-STD-883, Method 5005. Data Package Contents: Cover Sheet (Harris Name and/or Logo, P.O. Number, Customer Part Number, Date Code, Harris Part Number, Number, Quantity). Wafer Acceptance Report (Method 5007). Includes reproductions photos with percent step coverage. GAMMA Radiation Report. Contains Cover page, disposition, Dose, Number, Test Package used, Specification Numbers, Test equipment, etc. Radiation Read Record data file Harris. X-Ray report film. Includes penetrometer measurements. Screening, Electrical, Group attributes (Screening attributes begin after package seal). Serial Number Sheet (Good units serial number number). Variables Data (All Delta operations). Data identified serial number. Data header includes number date test. Certificate Conformance part shipping invoice part Data Book. Certificate Conformance signed authorized Quality Representative.
Spec Number
518833
HCS157MS Propagation Delay Timing Diagram Load Circuit
TPLH TPHL OUTPUT INPUT
Transition Timing Diagram
TTLH TTHL
OUTPUT
VOLTAGE LEVELS PARAMETER 4.50 4.50 2.25 UNITS
TEST POINT
50pF
Spec Number
518833
HCS157MS Characteristics
DIMENSIONS: mils METALLIZATION: Type: SiAl Metal Thickness: GLASSIVATION: Type: SiO2 Thickness: WORST CASE CURRENT DENSITY: <2.0 105A/cm2 BOND SIZE: 100µm 100µm mils mils
Metallization Mask Layout
HCS157MS
(16) (15)
(14)
(13)
(12)
(11)
(10)
NOTE: diagram generic plot from similar device. intended indicate approximate size bond location. mask series HCS157 TA14371A.
Spec Number
518833
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