Stress BOND HAST Pressure Temp Cycle Sample Size Device Hr./Cyc 20,000
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ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKR 1212 SOLDER PROCESS
Stress BOND HAST Pressure Temp Cycle Sample Size Device Hr./Cyc 20,000 22,000 19,800 220,000 Condition 200_C 130_C, 85%RH 121_, PSIG -65_C-150_C Total Fails Fail Percentage 0.00 0.00 0.00 0.00
Document Number: 72460 05-Nov-03
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