Stress BOND HAST Pressure Solder DUNK Solderability Temp Cycle Sample
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ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKR 1212
Stress BOND HAST Pressure Solder DUNK Solderability Temp Cycle Sample Size 2,266 2,156 3,024 Device Hr./Cyc 20,000 226,400 210,936 6,785 1,935 1,654,500 Condition 200_C 130_C, 85%RH 121_, PSIG 260_C, 10SEC M2003 65_C 150_C Total Fails Fail Percentage 0.00 0.00 0.00 0.00 0.00 0.00
Document Number: 72459 15-Aug-03
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