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Stress LEAD Solderability Temp Cycle Sample Size 1400 Device Hr./Cyc 1
Top Searches for this datasheetENVIRONMENTAL PACKAGE TESTING DATA METAL Stress LEAD Solderability Temp Cycle Sample Size 1400 Device Hr./Cyc 1440 445,000 Condition M2004 M2003 65_C 150_C Total Fails Fail Percentage 0.00 0.00 0.00 Document Number: 72454 15-Aug-03 www.vishay.com Other recent searchesVN0104 - VN0104 VN0104 Datasheet SPS-7350-CXX0G - SPS-7350-CXX0G SPS-7350-CXX0G Datasheet PD44325092B-A - PD44325092B-A PD44325092B-A Datasheet PD44325182B-A - PD44325182B-A PD44325182B-A Datasheet PD44325362B-A - PD44325362B-A PD44325362B-A Datasheet MC92602RMAD - MC92602RMAD MC92602RMAD Datasheet LS273 - LS273 LS273 Datasheet FSK15 - FSK15 FSK15 Datasheet ELLS-325RWA - ELLS-325RWA ELLS-325RWA Datasheet CF5020 - CF5020 CF5020 Datasheet AIC1730 - AIC1730 AIC1730 Datasheet
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