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LM26001 1.5A Switching Regulator with High Efficiency Sleep Mode


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LM26001 1.5A Switching Regulator with High Efficiency Sleep Mode
LM26001 1.5A Switching Regulator with High Efficiency Sleep Mode
LM26001 switching regulator designed high efficiency requirements applications with stand-by modes. device features low-current sleep mode maintain efficiency under light-load conditions current-mode control accurate regulation over wide input voltage range. Quiescent current reduced typically shutdown mode less than sleep mode. Forced mode also available disable sleep mode. LM26001 deliver 1.5A continuous load current with fixed current limit, through internal N-channel switch. part wide input voltage range 4.0V operate with input voltages during line transients. Operating frequency adjustable from with single resistor synchronized external clock. Other features include Power good, adjustable soft-start, enable pin, input under-voltage protection, internal bootstrap diode reduced component count.
Features
High efficiency sleep mode typical sleep mode typical shutdown mode 3.0V minimum input voltage 4.0V continuous input range 1.5% reference accuracy Cycle-by-cycle current limit Adjustable Frequency (150 kHz) Synchronizable external clock Power Good Flag Forced function Adjustable Soft-start TSSOP-16 exposed package Thermal Shut Down
Applications
Automotive Telematics Navigation systems In-Dash Instrumentation Battery Powered Applications Stand-by power home gateways/set-top boxes
Typical Application Circuit
20179401
2006 National Semiconductor Corporation
DS201794
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LM26001
Connection Diagram
20179402
View 16-Lead Plastic TSSOP
Ordering Information
Order Number LM26001MXA LM26001MXAX Package Type TSSOP-16EXP TSSOP-16EXP Package Drawing MXA16A MXA16A Package Marking LM26001EM LM26001EM Supplied Units Rail 2500 Units Tape Reel
Descriptions
Name PGOOD COMP FREQ FPWM SYNC VBIAS BOOT Power supply input Power supply input Power Good pin. open drain output which goes high when output voltage greater than nominal. Enable analog level input pin. When pulled below 0.8V, device enters shutdown mode. Soft-start pin. Connect capacitor from this soft-start time. Compensation pin. Connect resistor capacitor pair compensate control loop. Feedback pin. Connect resistor divider between Vout output voltage. Ground Frequency adjust pin. Connect resistor from this operating frequency. FPWM logic level input pin. normal operation, connect GND. When pulled high, sleep mode operation disabled. Frequency synchronization pin. Connect external clock signal synchronized operation. SYNC must pulled non-synchronized operation. Connect external greater supply bypass internal regulator improved efficiency. used, VBIAS should tied GND. output internal regulator. Bypass with minimum capacitor. Bootstrap capacitor pin. Connect 0.1µF minimum ceramic capacitor from this generate gate drive bootstrap voltage. Switch pin. source internal N-channel switch. Switch pin. source internal N-channel switch. Exposed thermal connection. Connect GND. Description
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LM26001
Absolute Maximum Ratings (Note
Military/Aerospace specified devices required, please contact National Semiconductor Sales Office/ Distributors availability specifications. Voltages from indicated pins GND: (Note VBIAS BOOT PGOOD FREQ SYNC FPWM -0.3V -0.5V -0.3V -0.3V -0.3V SW-0.3V SW+7V -0.3V -0.3V -0.3V -0.3V -0.3V
Storage Temperature Power Dissipation (Note Recommended Lead Temperature Vapor Phase (70s) Infrared (15s) Susceptibility (Note Machine Model Human Body Model Charged Device Model
-0.3V -65°C +150°C
215°C 220°C 200V
Operating Ratings (Note
Operating Junction Temp. Supply Voltage (Note -40°C 125°C 3.0V
Electrical Characteristics Specifications standard type 25°C only, limits boldface type apply over junction temperature (TJ) range -40°C +125°C. Unless otherwise stated, Vin=12V. Minimum Maximum limits guaranteed through test, design, statistical correlation. Typical values represent most likely parametric norm 25°C, provided reference purposes only. (Note
Symbol System (Note Iq_Sleep_VB (Note Iq_Sleep_VDD Iq_PWM_VB Iq_PWM_VDD IBIAS_PWM VOUT/VIN VOUT/IOUT ISS_Source Vbias_th Switching RDS(ON) Isw_off VFREQ range VSYNC Switch Resistance Switch state leakage current Switching Frequency FREQ voltage Switching Frequency range Sync threshold Sync hysteresis ISYNC FSYNC_UP FSYNC_DN SYNC leakage current Upper frequency synchronization range Lower frequency synchronization range compared nominal compared nominal SYNC rising SYNC falling 38V, RFREQ 62k, 124k, 240k 0.12 0.002 0.42 Shutdown Current Quiescent Current Quiescent Current Quiescent Current Quiescent Current Bias Current Feedback Voltage Bias Current Vout line regulation Vout load regulation output voltage Soft-start source current VBIAS switchover threshold VCOMP 1.15V 35V, IVDD= 5.50 2.50 0.001 0.07 5.95 6.50 3.05 Sleep mode, VBIAS Sleep mode, VBIAS mode, VBIAS mode, VBIAS Sleep mode, VBIAS mode, VBIAS 1.2155 0.65 1.234 0.85 0.70 1.2525 Parameter Conditions Unit
IBIAS_Sleep (Note Bias Current
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LM26001
Electrical Characteristics Specifications standard type 25°C only, limits boldface type apply over junction temperature (TJ) range -40°C +125°C. Unless otherwise stated, Vin=12V. Minimum Maximum limits guaranteed through test, design, statistical correlation. Typical values represent most likely parametric norm 25°C, provided reference purposes only. (Note (Continued)
Symbol TOFFMIN TONMIN THSLEEP_HYS THWAKE IBOOT Protection ILIMPK VFB_SC F_min_sc VTH_PGOOD IPGOOD_HI RDS_PGOOD VUVLO Peak Current Limit Short circuit frequency foldback threshold Frequency foldback Power Good Threshold PGOOD hysteresis PGOOD leakage current PGOOD resistance Under-voltage Lock-Out Threshold PGOOD PGOOD sink current falling shutdown, rising, soft-start, Logic VthEN IEN_Source VTH_FPWM IFPWM ICOMP VCOMP Error trans-conductance COMP source current COMP sink current COMP voltage range VCOMP 0.9V VCOMP 0.9V 0.64 1.27 1000 µmho Enable Threshold voltage Enable hysteresis source current FPWM threshold FPWM leakage current FPWM Thermal Shutdown Threshold Thermal resistance Power dissipation lfpm flow 2.60 3.60 Measured falling 0.3V Measured PGOOD rising 1.85 0.87 3.20 4.20 °C/W Parameter Minimum Off-time Minimum On-time Sleep mode threshold hysteresis Wake threshold BOOT leakage current rising, THWAKE Measured falling COMP 0.6V BOOT 16V, Conditions 101.2 1.234 0.0006 Unit
Note Absolute Maximum Ratings indicate limits beyond which damage device occur. Operating Ratings indicate conditions which device intended functional, guarantee specific performance limits. guaranteed specifications test conditions, Electrical Characteristics. Note maximum allowable power dissipation function maximum junction temperature, TJ_MAX, junction-to-ambient thermal resistance, ambient temperature, maximum allowable power dissipation ambient temperature calculated using: PD_MAX (TJ_MAX /JA. maximum power dissipation 2.6W determined using 25°C, 38°C/W, TJ_MAX 125°C. Note human body model capacitor discharged through resistor into each pin. machine model 200pF capacitor discharged directly into each pin. charged device model JESD22-C101-C. Note Below 4.0V input, power dissipation increase increased RDS(ON). Therefore, minimum input voltage 4.0V required operate continuously within specification. minimum 3.9V (typical) also required startup. Note room temperature limits 100% production tested. limits temperature extremes guaranteed through correlation using standard Statistical Quality Control (SQC) methods. limits used calculate Average Outgoing Quality Level (AOQL). Note specify current into pin. IBIAS current into VBIAS when VBIAS voltage greater than quiescent current specifications apply non-switching operation. Note absolute maximum specification applies voltage. extended negative voltage limit applies pulse 1µs, pulse 20µs.
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LM26001
Typical Performance Characteristics
12V, 25°C. Temperature
Unless otherwise specified following conditions apply: (IDC
20179403
20179405
IVBIAS Temperature (Sleep Mode)
IVBIAS Temperature (PWM Mode)
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20179406
Normalized Switching Frequency Temperature (300kHz)
UVLO Threshold Temperature (VDD= VIN)
20179416
20179417
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LM26001
Typical Performance Characteristics Unless otherwise specified following conditions apply:
12V, 25°C. (Continued) Short Circuit Foldback Frequency (325 nominal)
Peak Current Limit Temperature
20179415
20179412
Efficiency Load Current (330kHz)
Efficiency Load Current (500kHz)
20179408
20179409
Startup Waveforms
Load Transient Response
20179410
20179452
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LM26001
Block Diagram
20179418
Operation Description
GENERAL LM26001 current mode buck regulator. beginning each clock cycle, internal high-side switch turns allowing current ramp inductor. inductor current internally monitored during each switching cycle. control signal derived from inductor current compared voltage control signal COMP pin, derived from feedback voltage. When inductor current reaches threshold, high-side switch turned inductor current ramps down. While switch off, inductor current supplied through catch diode. This cycle repeats next clock cycle. this way, duty cycle output voltage controlled regulating inductor current. Current mode control provides superior line load regulation. Other benefits include cycle cycle current limiting simplified compensation scheme. Typical waveforms shown Figure
20179419
FIGURE Waveforms Load, SLEEP MODE light load conditions, LM26001 automatically switches into sleep mode improved efficiency. loading decreases, voltage increases COMP voltage decreases. When COMP voltage reaches 0.6V (typical) clamp threshold, voltage rises above nominal, sleep mode enabled switching stops. regulator remains sleep mode until voltage falls
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LM26001
Operation Description
(Continued)
FPWM Pulling FPWM high disables sleep mode forces LM26001 always operate mode. Light load efficiency reduced mode, switching frequency remains stable. FPWM connected pull high. FPWM mode, under light load conditions, regulator operates discontinuous conduction mode (DCM) discontinuous conduction mode, current through inductor starts zero ramps peak, then ramps down zero again. Until next cycle, inductor current remains zero. nominal load currents, FPWM mode, device operates continuous conduction mode, where positive current always flows inductor. Typical discontinuous operation waveforms shown below.
reset threshold, which point switching resumes. This window limits corresponding output ripple approximately nominal output voltage. sleep cycle will repeat until load current increased. Figure shows typical switching output voltage waveforms sleep mode.
20179420
FIGURE Sleep Mode Waveforms 25mA Load, sleep mode, quiescent current reduced less than when switching. sleep mode threshold calculated according equation below:
20179423
FIGURE Discontinuous Mode Waveforms 75mA Load, Where Imin=Ilim/16 (2.5A/16 typically) D=duty cycle, defined (Vout+Vdiode)/Vin. When load current increases above this limit, LM26001 forced back into operation. sleep mode threshold varies with frequency, inductance, duty cycle shown Figure very light load, FPWM mode, LM26001 enter sleep mode. This prevent over-voltage condition from occurring. However, FPWM sleep threshold much lower than normal operation. ENABLE LM26001 provides shutdown function disable device when output voltage does need maintained. analog level input with typically hysteresis. device active when above 1.1V (typical) shutdown mode when below this threshold. When goes high, internal regulator turns charges capacitor. When reaches 3.9V (typical), soft-start begins source current. shutdown mode, regulator shuts down total quiescent current reduced (typical). Because sources (typical) pull-up current, this left open always-on operation. When open, will pulled VIN. connected VIN, must connected through resistor limit noise spikes. also driven externally with maximum voltage 15V, whichever lower.
20179422
FIGURE Sleep Mode Threshold Vout 3.3V
SOFT-START soft-start feature provides controlled output voltage ramp startup. This reduces inrush current eliminates output overshoot turn-on. soft-start pin, must connected through capacitor. power8
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LM26001
Operation Description
(Continued)
enable, UVLO recovery, internal (typical) current charges soft-start capacitor. During soft-start, error amplifier output voltage controlled both softstart voltage feedback loop. voltage ramps duty cycle increases proportional softstart ramp, causing output voltage ramp rate which duty cycle increases depends capacitance soft-start capacitor. higher capacitance, slower output voltage ramps soft-start capacitor value calculated with following equation:
voltage falls below frequency foldback threshold during frequency synchronized operation, SYNC function disabled. Operating frequency versus voltage short circuit conditions shown typical performance characteristics section. conditions where time close minimum (less than 200nsec typically), such high input voltage high switching frequency, current limit function properly. This because current limit circuit cannot reduce on-time below minimum which prevents entry into frequency foldback mode. There ways ensure proper current limit foldback operation under high input voltage conditions. First, operating frequency reduced increase nominal time. Second, inductor value increased slow current ramp reduce peak over-current. FREQUENCY ADJUSTMENT SYNCHRONIZATION switching frequency LM26001 adjusted between using single external resistor. This resistor connected from FREQ ground shown typical application. resistor value calculated with following empirically derived equation: RFREQ (6.25 1010) fSW-1.042
Where desired soft-start time softstart source current. During soft-start, current limit synchronization remain effect, while sleep mode frequency foldback disabled. Soft-start mode ends when voltage reaches 1.23V typical. this point, output voltage control transferred discharged. CURRENT LIMIT peak current limit internally directly measuring peak inductor current through internal switch. ensure accurate current sensing, should bypassed with minimum ceramic capacitor placed directly pin. When inductor current reaches current limit threshold, internal turns immediately allowing inductor current ramp down until next cycle. This reduction duty cycle corresponds reduction output voltage. current limit comparator disabled less than 100ns leading edge increased immunity switching noise. Because current limit monitors peak inductor current, load current limit threshold varies with inductance frequency. Assuming minimum current limit 1.85A, maximum load current calculated follows:
20179451
Where Iripple peak-to-peak inductor ripple current, calculated shown below:
FIGURE Swtiching Frequency RFREQ switching frequency also synchronized external clock signal using SYNC pin. SYNC allows operating frequency varied above below nominal frequency setting. adjustment range from above nominal below nominal. External synchronization requires 1.2V (typical) peak signal level SYNC pin. FREQ resistor must always connected initialize nominal operating frequency. operating frequency synchronized falling edge SYNC input. When SYNC goes low, high-side switch turns This allows duty cycle used sync signal when synchronizing frequency higher than nominal. When synchronizing lower frequency, however, there minimum duty cycle requirement SYNC signal, given equation below:
find worst case (lowest) current limit threshold, maximum input voltage minimum current limit specification. During high over-current conditions, such output short circuit, LM26001 employs frequency foldback second level protection. feedback voltage falls below short circuit threshold 0.9V, operating frequency reduced, thereby reducing average switch current. This especially helpful short circuit conditions, when inductor current rise very high during minimum on-time. Frequency reduction begins below nominal frequency setting. minimum operating frequency foldback mode typical.
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LM26001
Operation Description
(Continued)
this mode operation, once duty cycle reaches maximum, LM26001 skip maximum seven pulses, effectively increasing duty cycle thus minimizing dropout from input output. Typical off-pulse skipping waveforms shown below.
Where fnom nominal switching frequency FREQ resistor, fsync square wave. SYNC used, must pulled normal operation. pull-down resistor recommended protect against missing sync signal. Although LM26001 designed operate kHz, maximum load current limited higher frequencies increased temperature rise. Thermal Considerations section. VBIAS VBIAS used bypass internal regulator which provides bias voltage LM26001. When VBIAS connected voltage greater than internal regulator automatically switches over VBIAS input. This reduces current into (Iq) increases system efficiency. Using VBIAS added benefit reducing power dissipation within device. most applications where Vout 10V, VBIAS connected Vout. used, VBIAS should tied GND. VBIAS drops below 2.7V (typical), device automatically switches over supply internal bias voltage from Vin. Total device input current gate drive current, VBIAS current, plus some negligible current into pin. Total minimum input supply current calculated shown below:
20179429
FIGURE Off-pulse Skipping Waveforms 3.5V, Vnom 3.3V, fnom 305kHz UVLO sensed both VDD, activated when either voltage falls below 2.9V (typical). Although typically less than 200mV below VIN, will discharge through VIN. Therefore when voltage drops rapidly, remain high, especially sleep mode. fast line voltage transients, using larger capacitor help hold UVLO shutdown extending discharge time. holding VDD, larger also reduce RDS(ON) (and dropout voltage) conditions. Alternately, under heavy loading voltage fall several hundred below VIN. this case, UVLO triggered even though voltage above UVLO threshold. When UVLO activated LM26001 enters standby state which remains charged. input voltage voltage rise above 3.9V (typical) device will restart from softstart mode. PGOOD power good pin, PGOOD, available monitor output voltage status. internally connected open drain MOSFET, which remains open while output voltage within operating range. PGOOD goes (low impedance ground) when output falls below nominal pulled low. When output voltage returns within nominal, measured pin, PGOOD returns high state. improved noise immunity, there delay between PGOOD threshold PGOOD going low.
Where gate drive current, calculated (4.6 10-9) Total supply input current varies according load, system efficiency, operating frequency. calculate minimum input current during sleep mode, Iq_Sleep_VB, IBIAS_SLEEP. input current mode, same equation, with Iq_PWM_VB, IBIAS_PWM. VBIAS connected ground, same equation with Ibias term eliminated either Iq_Sleep_VDD Iq_PWM_VDD. OPERATION UVLO LM26001 designed remain operational during short line transients when input voltage drop 3.0V. Minimum nominal operating input voltage 4.0V. Below this voltage, switch RDS(ON) increases, lower gate drive voltage from VDD. minimum voltage required approximately 3.5V normal operation within specification. also used pull-up voltage functions such PGOOD FPWM. Note that used externally, recommended loads greater than input voltage approaches nominal output voltage, duty cycle maximized hold output voltage.
Design Information
EXAMPLE CIRCUIT Figure shows complete typical application schematic. components have been selected based design criteria given following sections.
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LM26001
Design Information
(Continued)
20179430
FIGURE Example Circuit 1.5A Max, SETTING OUTPUT VOLTAGE output voltage ratio voltage divider shown typical application. resistor values determined following equation: Remember that inductor value also affects sleep mode threshold shown Figure When choosing inductor, saturation current rating must higher than maximum peak inductor current current rating should higher than maximum load current. Peak inductor current, Ipeak, calculated
Where 1.234V typically. maximum value 150k recommended input voltage decreases towards nominal output voltage, LM26001 skip seven off-pulses described Operation section. output voltage applications, on-time reaches TonMIN, device will skip on-pulses maintain regulation. There limit number pulses that skipped. this mode operation, however, output ripple voltage increase slightly. INDUCTOR output inductor should selected based inductor ripple current. amount inductor ripple current compared load current, ripple content, defined Iripple/ Iload. Ripple content should less than 40%. Inductor ripple current, Iripple, calculated shown below:
example, maximum load 1.5A ripple content 40%, peak inductor current equal 1.8A which safely below minimum current limit 1.85A. increasing inductor size, ripple content peak inductor current lowered, which increases current limit margin. size output inductor also determined using desired output ripple voltage, Vrip. equation determine minimum inductance value based Vrip follows:
Where output capacitors, Vrip peak-to-peak value. This equation assumes that output capacitors have some amount ESR. does apply ceramic output capacitors. this method used, ripple content should still verified less than 40%. OUTPUT CAPACITOR primary criterion selecting output capacitor equivalent series resistance, ESR. (Re) selected based requirements output ripple voltage transient response. Once inductor value been selected, ripple voltage calculated given using equation above Lmin. Lower values result lower output ripple.
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Larger ripple content increases losses inductor reduces effective current limit. Larger inductance values result lower output ripple voltage higher efficiency, slightly degraded transient response. Lower inductance values allow smaller case size, increased ripple lowers effective current limit threshold.
LM26001
Design Information
(Continued)
also calculated from following equation:
Where allowed voltage excursion during load transient, maximum expected load transient. total high, load transient requirement cannot met, matter large output capacitance. criteria ripple voltage transient excursion cannot met, more capacitors should used parallel. non-ceramic capacitors, minimum output capacitance secondary importance, determined only load transient requirement. there enough capacitance, output voltage excursion will exceed maximum allowed value even maximum requirement met. minimum capacitance calculated follows:
nally, external diode needed. minimum value recommended Cboot. Smaller values result insufficient hold time drive voltage increased power dissipation. During operation, when on-time extended, bootstrap capacitor risk discharging. Cboot capacitor discharged below approximately 2.5V, LM26001 enters high frequency re-charge mode. Cboot re-charged synchronous shown block diagram. Switching returns normal when Cboot been recharged. CATCH DIODE When internal switch off, output current flows through catch diode. Alternately, when switch diode sees reverse voltage equal Vin. Therefore, important parameters selecting catch diode peak current peak inverse voltage. average current through diode given IDAVE Iload (1-D) Where duty cycle, defined Vout/Vin. catch diode conducts largest currents during lowest duty cycle. Therefore IDAVE should calculated assuming maximum input voltage. diode should rated handle this current continuously. over-current short circuit conditions, catch diode should rated handle peak currents equal peak current limit. peak inverse voltage rating diode must greater than maximum input voltage. Schottky diode must used. It's forward voltage maximizes efficiency BOOT voltage, while also protecting against large negative voltage spikes COMPENSATION purpose loop compensation ensure stable operation while maximizing dynamic performance. Stability analyzed with loop gain measurements, while dynamic performance analyzed with both loop gain load transient response. Loop gain equal product controloutput transfer function (power stage) feedback transfer function (the compensation network). stability purposes, target have loop gain slope that -20dB /decade from very frequency beyond crossover frequency. Also, crossover frequency should exceed one-fifth switching frequency, i.e. case switching frequency. dynamic purposes, higher bandwidth, faster load transient response. large gain means high regulation accuracy (i.e. voltage changes little with load line variations). achieve this loop gain, compensation components should according shape control-output bode plot. typical plot shown Figure below.
assumed total ESR, greater than ReMAX. Also, assumed that already been selected. Generally speaking, output capacitance requirement decreases with typical value greater than works well most applications. INPUT CAPACITOR switching converter, very fast switching pulse currents drawn from input rail. Therefore, input capacitors required reduce noise, EMI, ripple input LM26001. Capacitors must selected that handle both maximum ripple current highest ambient temperature well maximum input voltage. equation calculating input ripple current shown below:
noise suppression, ceramic capacitor range should placed close possible pin. larger, high input capacitor should also used. This capacitor recommended damping input voltage spikes during power holding input voltage during transients. input voltage applications, line transients fall below UVLO threshold there enough input capacitance. Both tantalum electrolytic type capacitors suitable bulk capacitor. However, large tantalums available high input voltages their working voltage must derated least BOOTSTRAP drive voltage internal switch supplied BOOT pin. This must connected ceramic capacitor, Cboot, from switch node, shown typical application. LM26001 provides voltage interwww.national.com
LM26001
Design Information
(Continued)
Where output capacitance, load resistance, output capacitor ESR, switching frequency. effects slope compensation current sense gain included this equation. However, equation approximation intended simplify loop compensation calculations. derive exact transfer function, 0.2V/V sense gain 36mVp-p slope compensation. Since determined output network, shifts with loading. Determine range frequencies (fpmin/max) across expected load range. Then determine compensation values described below shown Figure
20179438
FIGURE Control-Output Transfer Function control-output transfer function consists pole (fp), zero (fz), double pole (half switching frequency). Referring Figure following should done create -20dB /decade roll-off loop gain: Place pole (fpc) Place zero (fzc) Place second pole (fpc1) resulting feedback (compensation) bode plot shown below Figure Adding control-output response feedback response will then result nearly continuous -20db/decade slope.
20179443
FIGURE Compensation Network compensation network automatically introduces frequency pole (fpc), which close 0Hz. Once range determined, should calculated using:
20179439
Where desired feedback gain between transconductance error amplifier. gain value around 10dB (3.3v/v) generally good starting point. Bandwidth increases with increasing values Next, place zero (fzc) near using determined with following equation:
FIGURE Feedback Transfer Function control-output corner frequencies determined approximately following equations: selected value should place within decade above below fpmax, less than fpmin. higher value (closer fpmin) generally provides more stable loop, high value will slow transient response time. Conversely, smaller value will result faster transient response, lower phase margin.
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LM26001
Design Information
(Continued)
second pole (fpc1) also placed This pole created with single capacitor, minimum value this capacitor calculated
anode. Additionally, ground area between catch diode bulk input capacitor very noisy should somewhat isolated from rest ground plane. ceramic input capacitor must connected close possible grounded close pin. Often this capacitor most easily located bottom side pcb. placement close practical, ceramic input capacitor also grounded close catch diode ground. above layout recommendations illustrated below Figure
necessary applications. However operating frequency being synchronized below nominal frequency, recommended. Although required stability, very helpful suppressing noise. phase lead capacitor also added increase phase gain margins. phase lead capacitor most helpful high input voltage applications when synchronizing frequency greater than nominal. This capacitor, shown Figure should placed parallel with feedback resistor, introduces additional zero pole compensation network. These frequencies calculated shown below:
20179449
FIGURE Example Layout phase lead capacitor will boost loop phase around region zero frequency, fzff. fzff should placed somewhat below fpz1 frequency However, large, will have effect. good practice connect pin, small signal components (COMP, FREQ) separate ground plane, shown Figure GND, schematics signal ground symbol. Both exposed must connected ground. This quieter plane should connected high current ground plane quiet location, preferably near Vout ground shown dashed line Figure plane should made large possible, since also used thermal dissipation. Several vias placed directly below increase heat flow other layers when they available. recommended hole diameter 0.3mm. trace from resistor divider should short entire feedback trace must kept away from inductor switch node. Application Note AN-1229 more information regarding layout switching regulators.
Layout
Good board layout critical switching regulators such LM26001. First, ground plane area must sufficient thermal dissipation purposes, second, appropriate guidelines must followed reduce effects switching noise. Switch mode converters very fast switching devices. such devices, rapid increase input current combined with parasitic trace inductance generates unwanted Ldi/dt noise spikes node also node. magnitude this noise tends increase output current increases. This parasitic spike noise turn into electromagnetic interference (EMI), also cause problems device performance. Therefore, care must taken layout minimize effect this switching noise. current sensing circuit current mode devices easily effected switching noise. This noise cause duty cycle jitter which leads increased spectral noise. Although LM26001 100ns blanking time beginning every cycle ignore this noise, some noise remain after blanking time. Following important guidelines below will help minimize switching noise effect current sensing. switch node area should small possible. catch diode, input capacitors, output capacitors should grounded large ground plane, with bulk input capacitor grounded close possible catch diode
Thermal Considerations
Although LM26001 built current limit, ambient temperatures above 80°C, device temperature rise limit actual maximum load current. Therefore, temperature rise must taken into consideration determine maximum allowable load current. Temperature rise function power dissipation within device. following equations used calculate power dissipation (PD) temperature rise, where total switching losses, losses, drive losses, VBIAS losses: PDTOTAL PswAC PswDC PVBIAS
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LM26001
Thermal Considerations
(Continued)
PswDC Iload2 (0.2 0.00065 25)) 10-9 PVBIAS Vbias IVBIAS Given this total power dissipation, junction temperature calculated follows: (PDTOTAL Where JA=38°C/W (typically) when using multi-layer board with large copper plane area. varies with board type metallization area.
calculate maximum allowable power dissipation, assume 125°C. ensure that junction temperature does exceed maximum operating rating 125°C, power dissipation should verified maximum expected operating frequency, ambient temperature, input voltage. calculated maximum load current based continuous operation exceeded during transient conditions. power dissipation remains above maximum allowable level, device temperature will continue rise. When junction temperature exceeds maximum, LM26001 engages Thermal Shut Down (TSD). TSD, part remains shutdown state until junction temperature falls within normal operating limits. this point, device restarts soft-start mode.
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LM26001 1.5A Switching Regulator with High Efficiency Sleep Mode
Physical Dimensions
inches (millimeters) unless otherwise noted
eTSSOP-16 Package 16-Lead Exposed TSSOP Package Package Number MXA16A
National does assume responsibility circuitry described, circuit patent licenses implied National reserves right time without notice change said circuitry specifications. most current product information visit www.national.com. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT GENERAL COUNSEL NATIONAL SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. BANNED SUBSTANCE COMPLIANCE National Semiconductor follows provisions Product Stewardship Guide Customers (CSP-9-111C2) Banned Substances Materials Interest Specification (CSP-9-111S2) regulatory environmental compliance. Details found www.national.com/quality/green. Lead free products RoHS compliant.
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