INDE Driver Character Display Controller/Driver Graphic Display D
|
|
|
Top Searches for this datasheet
Hitachi Controller/Driver Data Book
INDE
Driver Character Display Controller/Driver Graphic Display Driver Small System Graphic Display Driver (Negative Power Supply Type) Graphic Display Driver (Positive Power Supply Type) Segment Display Controller/Driver
Controller
Type Driver
Contents
GENERAL INFORMATION
Quick Reference Guide Type Number Order Selection Guide Differences Between Products Package Information. Notes Mounting. Information Chip Shipment Products Reliability Quality Assurance Reliability Test Data Drivers. Flat Plastic Package (QFP) Mounting Methods. Liquid Crystal Driving Methods
DATA SHEET
Driver
HD44100R HD66100F HD61100A HD61200 Driver with 40-Channel Outputs Driver with 80-Channel Outputs Driver with 80-Channel Outputs Driver with 80-Channel Outputs Matrix Liquid Crystal Display Controller/Driver Matrix Liquid Crystal Display Controller/Driver Matrix Liquid Crystal Display Controller/Driver Matrix Liquid Crystal Display Controller/Driver Panel Controller/Driver Matrix Liquid Crystal Display with Matrix. Matrix Liquid Crystal Display Controller/ Driver Supporting Japanese Kanji Display.
Character Display Controller/Driver
HD44780U LCD-II HD66702 LCD-II/E20 HD66710 LCD-II/F8 HD66712 LCD-II/F12 HD66720 LCD-II/K8 HD66730 LCD-II/J6
Graphic Display Driver Small System
HD44102 HD44103 HD44105 HD61102 HD61103A HD61202 HD61203 HD66410 HD66503 HD66108 HD66520T Matrix Liquid Crystal Graphic Display Column Driver Matrix Liquid Crystal Graphic Display 20-Channel Common Driver Matrix Liquid Crystal Graphic Display Common Driver. Matrix Liquid Crystal Graphic Display Column Driver Matrix Liquid Crystal Graphic Display 64-Channel Common Driver Matrix Liquid Crystal Graphic Display Column Driver Matrix Liquid Crystal Graphic Display 64-Channel Common Driver RAM-Provided 128-Channel Driver Matrix Graphic LCD. 240-Channel Common Driver with Internal Timing Circuit RAM-Provided 165-Channel Driver Liquid Crystal Matrix Graphics 160-Channel 4-Level Grayscale Display Column Driver with Internal Bit-Map
Graphic Display Driver (Negative Power Supply Type)
HD66204 HD66205 HD66214T HD66224T HD66215T Matrix Liquid Crystal Graphic Display Column Driver with 80-Channel Outputs Matrix Liquid Crystal Graphic Display Common Driver with 80-Channel Outputs 80-Channel Column Driver Micro-TCP 1015 Matrix Liquid Crystal Graphic Display Column Driver with 80-Channel Outputs 1030 Common Driver Matrix Liquid Crystal Graphic Display with 100-Channel Outputs 1046 Driver High Voltage 1067 Driver High Voltage 1084
Graphic Display Driver (Positive Power Supply Type)
HD66106F HD66107T
HD66110ST HD66113T HD66115T HD66120T
Column Driver. 120-Channel Common Driver Packaged Slim Tape Carrier Package 160-Channel Common Driver Packaged Slim Tape Carrier Package 240-Channel Segment Driver Matrix Graphic Liquid Crystal Display
1105 1122 1139 1156
Segment Display Controller/Driver
HD61602/HD61603 Segment Type Driver 1172 HD61604/HD61605 Segment Type Driver 1205
Controller
HD61830/HD61830B HD63645/HD64645/HD64646 HD66840/HD66841 HD66850F Timing Controller (LCDC) 1234 Timing Controller (LCTC). 1271 Video Interface Controller (LVIC/LVIC-II). 1318 Color Interface Engine (CLINE). 1379
Type Driver
HD66300T HD66310T HD66330T Horizontal Driver TFT-Type Color 1448 TFT-Type Driver 1511 64-Level Gray Scale Driver Liquid Crystal Display 1531
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package Extension Driver HD44100R +75*1 (20) Static-1/53 FP-60A Chip HD66100F +75*1 Static-1/16 FP-100 HD61100A +75*1 Static-1/128 FP-100 HD61200 1/32-1/128 FP-100
Type Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package
Column Driver HD66204 +75*1 1/64-1/240 FP-100 TFP100 Chip HD66214T 1/64-1/240 HD66224T 1/64-1/240 SLIM-TCP HD66107T 1/100-1/480 HD66110ST 1/100-1/480 SLIM-TCP HD66120T 1/100-1/480 SLIM-TCP
+80°C (special request). Please contact Hitachi agents. Under development
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Column Drive (within RAM) HD44102CH +75*1 0.28 Static-1/32 HD61102 15.5 HD61202 HD66108T HD66520T Column Driver HD66300T HD66310T +75*2 (-20 +60) 12/15 HD66330T
+75*1 0-65 100-165 1/32, 1/34, 1/36, 1/48, 1/50, 1/64, 1/66
1/64-1/240
Static-1/64 1/32-1/128
Package
FP-80 Chip
FP-100
FP-100 TFP-100 Chip
SLIM-TCP
Type Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package
Segment Display HD61602 +75*1 0.52 Static, 1/2, 1/3, FP-80 FP-80A HD61603 +75*1 0.52 Static FP-80 HD61604 +75*1 0.52 Static, 1/2, 1/3, FP-80 HD61605 +75*1 0.52 Static FP-80
+80°C (special request). Please contact Hitachi agents. +75°C version, +65°C version
Quick Reference Guide
Type Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Common Driver HD44103CH HD44105H HD61103A HD61203 HD66205 HD66215T HD66113T HD66115T
+75*1 +75*1 +75*1 +75*1 +75*1 1/8, 1/12, 1/16, 1/24, 1/32 FP-60 1/8, 1/12, 1/32, 1/48 FP-60 Chip 1/48, 1/64, 1/96, 1/128 FP-100 1/48, 1/64, 1/96, 1/128 FP-100 TFP-100 Chip 1/64-1/240 100/101
1/100-1/480
1/64-1/240 1/100-1/480
Package
FP-100 TFP-100 Chip
SLIM-TCP
SLIM-TCP
SLIM-TCP
Type
Character Display Controller HD44780U (LCD-II) +75*1 9920 HD66702R (LCD-II/E20) +75*1 7200 HD66710 (LCD-II/F8) +75*1 9600 HD66712 (LCD-II/F12) 9600 HD66720 (LCD-II/K8) +75*1 9600 HD66730 (LCD-II/J6) +75*1
Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit)
0.25 0.25 1/17, 1/33 FP-128 Chip (16) (42) 1/9, 1/17 FP-100A TFP-100 Chip 0.08 1/14, 1/27, 1/40, 1/53 FP-128 Chip
driver
Common Column
0.25
0.25
Instruction Operation frequency (MHz) Recommend duty Package
1/8, 1/11, 1/16 1/8, 1/11, 1/16 1/17, 1/33 FP-80B TFP-80 Chip FP-144A Chip FP-100A TFP-100 Chip
+80°C (special request). Please contact Hitachi agents.
Quick Reference Guide
Type Graphic Display Controller HD63645F HD64645F HD64646FS LCTC Static-1/512 FP-80 FP-80B HD66840F HD66841F LVIC 16/24 (840) (841) Static-1/1024 FP-100A
Type Number Power supply internal circuits Power supply driver circuits Power dissipation (mW) Operating temperature (°C) Memory (bit) (bit) driver Common Column Instruction Operation frequency (MHz) Recommend duty Package
HD61830 LCDC 7360 Static-1/128 FP-60
HD61830B LCDC +75*1 7360 Static-1/128 FP-60
HD66850 CLINE 9762 Static-1/512 FP-136
+80°C (special request). Please contact Hitachi agents.
Type Number Order
Sorted Type Name
Type HD44100RFS HD44102CH HD44103CH HD44105H HD44780UA00FS/00TF/01FS/ 02FS/UB**FS/UB**TF LCD-II HD61100A HD61102RH HD61103A HD61200 HD61202/TFIA HD61203/TFIA HD61602R/RH HD61603R HD61604R HD61605R HD61830A00H LCDC HD61830B00H LCDC HD63645F LCTC HD64645F LCTC HD64646FS LCTC HD66100F/FH HD66107T00/01/11/12/24/25 HD66108T00 HD66110TB0/TB2 HD66113TA0 HD66115TA0/1 HD66120T HD66204F/FL/TF/TFL HD66205F/FL/TF/TFL/TA1/TA2/ TA3/TA6/TA7/TA9L HD66214TA1/2/3/6/9L HD66215TA0/1/2 HD66224TA1/TA2/TB0 HD66300T00 HD66310T00/T0015 HD66330TA0 HD66410Txx HD66503 HD66520T HD66702RA00F/00FL/01F/02F/ RB**F/RB**FL LCD-II/E20 HD66710A00FS/00TF/01TF/02TF/ B**FS/B**TF LCD-II/F8 HD66712A00FS/00TA0/00TB0/02FS/ B**FS LCD-II/F12 HD66720A03FS/TF HD66730A00FS HD66840FS LVIC HD66841FS LVIC-II HD66850F CLINE Function 40-channel driver 50-channel column driver within 20-channel common driver 32-channel common driver controller/driver character) 80-channel column driver 64-channel column driver within 64-channel common driver 80-channel column driver 64-channel column driver within 64-channel common driver Segment display type driver Segment display type driver Segment display type driver Segment display type driver controller controller timing controller family) timing controller family) timing controller family) 80-channel driver 160-channel column/common driver 165-channel graphic controller/driver 160-channel column driver 120-channel common driver 160-channel common driver 240-channel segment driver 80-channel column driver 80-channel common driver 80-channel column driver 100-channel common driver 80-channel column driver 120-channel analog column driver 160-channel digital column driver gray scale) 192-channel digital column driver gray scale) RAM-provided 128-channel driver 240-channel common driver 160-channel grayscale display column driver controller/driver character) controller/driver character) controller/driver character) Panel controller/driver controller/driver video interface controller gray scale control) video interface controller gray scale control) Color interface engine gray scale control) 1318 1318 1379 Reference Page 1172 1172 1205 1205 1234 1234 1271 1271 1271 1084 1105 1122 1139 1156 1015 1046 1030 1448 1511 1531
Selection Guide
Hitachi Driver System
Type full color system Reference Figure
HD66205 (gate driver)
Screen Size (Max) (800 dots
Lineup HD66310T (drain) HD66330T (drain) HD66205 (gate) HD66215T (gate)
Application Personal computer Terminal workstation Navigation system
Controller
Color
HD66330T (drain driver)
full color system
(720 dots
Color palette HD66850 (controller) HD66115T (common driver) Color
HD66110T (column driver)
HD66850F (controller) HD66107T (column, common) HD66110T (column) HD66115T (common) HD66120T (column) HD66113T (common) HD66300T (drain) HD66205 (gate) HD66215T (gate)
Personal computer Terminal workstation
Color LCD-TV system
dots
Tuner Controller HD66215T (gate driver) Color
LCD-TV Portable video
HD66300T (drain driver)
Video converter
dots
CRTC display
HD66840 LVIC
module
HD66840F, HD66841F HD66106F (driver) HD66107T (driver) HD66204 (column)/ 66205 (common) HD66224T (column)/ HD66215T (common) HD63645/64645/ 64646 (controller) HD66204 (column)/ 66205 (common) HD66224T (column)/ HD66215T (common) HD61100A (column) HD61830B (controller) HD61200 (column) HD61103A (common) HD61203 (common) HD44102 (column)/ 61102 (column) HD44103 (common) HD61202 (column) HD44105 (common)/ 61103A (common) HD61203 (common) HD66108 (column/common) HD44780U (LCD-II) (controller/driver) HD44100R (column) HD66100F (column) HD66702 (LCD-II/E20) HD66710 (LCD-II/F8) HD66712 (LCD-II/F12) HD61602 (controller/driver) HD61604 (controller/driver) HD61603 (controller/driver) HD61605 (controller/driver)
Personal computer Terminal
Display system compatible
dots
HD63645F (controller) HD66215T (common driver) (display system)
Personal computer Wordprocessor Terminal
HD66224T (column driver)
Graphic display system
HD618308 (controller)
HD61203 (common driver)
LOVE
Character Graphic dots
Laptop computer Facsimile Telex Copy machine
HD61200 (column driver)
Graphic display system (bitmap)
dots
HD61203 (common driver)
Laptop computer Handy wordprocessor
HD61202 (column driver)
Character display system
HD44780U (controller)
TOKYO
HD66100F/ HD44100H (column driver)
characters columns characters column
Electrical typewriter, Multifunction telephone, Handy terminal
Segment display system
digits column
HD61602/HD61604 (controller/driver)
ECR, Measurement system, Telephone industrial measurement system
Driver output HD66702 HD61603 HD61605 Controller/driver HD66712 HD61604 HD61602 HD66720 HD66710 HD44780U HD44102
HD66108
HD61202 HD61102 Column driver (Built RAM)
Static 1/480 1/200 Duty 1/240 1/128 1/64 1/100 1/32 1/16 HD44103 HD44105 HD44100R 1/16 1/32 1/64 1/128 1/100 1/480 1/200 Duty 1/240
HD61103A HD61203
HD66100F HD61200 HD61100A HD66204/HD66214T/HD66224T Common driver
HD66205/ HD66215T HD66113T HD66107T/HD66115T HD66503T
Selection Guide
HD66106F HD66107T/HD66110ST HD66520T
Column driver
HD66120T Driver output
Selection Guide
Application
Character Graphic Display character cursor)
Character Line HD66100F HD44100R HD61200 (column) HD61203 (common) HD66204 (column) HD66205 (common) HD66214T/HD66224T (column) HD66215T (common) HD66107T HD66110T (column) HD66115T (common) HD66120T (column) HD66113T (common) Over
Graphic Display
Horizontal Vertical Over HD66204 (column) HD66205 (common) HD66214T/HD66224T (column) HD66215T (common) HD66107T HD66110T (column) HD66115T (common) HD66120T (column) HD66113T (common) HD61202 (column) HD61203 (common) Over
Note: Applications this page only examples, this combination devices best.
Differences Between Products
HD66100F HD44100R
HD66100F driver circuits Power supply internal logic Display duty Package Static 1/16 plastic HD44100H Static 1/33 plastic
HD61100A HD61200
HD61100A drive circuits Display duty Power supply drive circuits Power supply limits driver circuit voltage Common Column Static 1/128 limit) HD61200 1/32 1/128 Shown figures below
Resistance between terminal terminal (one V1L, V1R, V2L, V2R, V3L, V3R, V4L, V4R) when load current flows through terminals specified under
following conditions: V1R, (VCC VEE) V2R, (VCC VEE)
V1L, V3L, V4L, V2L, Terminal Y80)
Figure Resistance between Terminals following description range power supply voltage liquid crystal display drives. Apply positive voltage negative voltage within range. This range allows stable impedance driver output (RON). Notice depends power supply voltage VEE.
range power supply voltage liquid crystal display drive Correlation between driver output waveform power supply voltages liquid crystal display drive (V4L V4R) (V2L V2R) Correlation between power supply voltage
(V1L V1R) (V3L V3R)
Figure Power Supply Voltage Range
Differences Between Products
HD66100F HD61100A
HD66100F drive circuits Common Column Power supply drive circuits Display duty Operating frequency (MHz) Data fetch method Package Static 1/16 (max) Shift plastic (FP-100) HD61100A 17.0 Static 1/128 (max) Latch plastic (FP-100)
HD61830 HD61830B
HD61830 Oscillator Operating frequency (MHz) Display duty Programmable screen size (max) Other Internal Static 1/128 dots (1/64 duty) HD61830B External Static 1/128 dots (1/64 duty)
Package marking
HD61830A00
JAPAN
Type
HD61830B00
JAPAN
Type
Figure Package Marking
Differences Between Products
HD61102 HD61202
HD61102 Display duty Recommended voltage between Power supply limits driver circuits voltage Absolute maximum rating Static 1/64 15.5 limit) (output) 17.0 HD61202 1/32 1/64 Shown following figures connection) 19.0
Resistance between terminal terminal (one V1L, V1R, V2L, V2R, V3L, V3R, V4R) when load current flows through terminals specified under
following conditions: V1R, (VCC VEE) V2R, (VCC VEE)
V1L, V3L, V4L, V2L, Terminal Y64)
Figure Resistance between Terminals following description range power supply voltage liquid crystal display drives. Apply positive voltage negative voltage within range. This range allows stable impedance driver output (RON). Notice that depends power supply voltage VEE.
range power supply voltage liquid crystal display drive (V1L V1R) (V3L V3R) Correlation between driver output waveform power supply voltages liquid crystal display drive (V4L V4R) (V2L V2R)
Correlation between power supply voltage
17.0
Figure Power Supply Voltage Range
Differences Between Products
HD61103A HD61203
HD61103A Recommended voltage between Power supply limits drive circuits voltage Output terminal limit) Shown following figure HD61203 Shown figures below Shown following figure
Resistance between terminal terminal (one V1L, V1R, V2L, V2R, V5L, V5R, V6R) when load current flows through terminals X64. This value specified
under following conditions: V1R, (VCC VEE) V2R, (VCC VEE)
V1L, V6L, V5L, V2L, Terminal Y64)
Figure Resistance between Terminals Here description range power supply voltage liquid crystal display drive. Apply positive voltage negative voltage within range. This range allows stable impedance driver output (RON). Notice that depends power supply voltage VEE.
(V1L V1R) (V6L V6R)
range power supply voltage liquid crystal display drive
(V5L V5R) (V2L V2R)
Figure Correlation between Driver Output Waveform Power Supply Voltages Liquid Crystal Display Drive
Figure Correlation between Power Supply Voltage
Differences Between Products
PMOS NMOS NMOS PMOS V1L,
V6L,
V5L,
V2L,
Figure HD61103A Output Terminal
Figure HD61203 Output Terminal
HD61602, HD61603, HD61604, HD61605
HD61602 Power supply (VDD) Instruction word power supply circuit Segment terminals Display size frame frequency (fOSC kHz) Static duty duty duty bits digits marks digits marks digits digits marks HD61603 bits digits HD61604 bits digits marks digits marks digits digits marks HD61605 bits digits
Differences Between Products
LCD-II Family (HD44780U, HD66702R HD66710)
Item Power supply voltage Liquid crystal drive voltage VLCD Maximum display digits chip Segment display Display duty cycle CGROM LCD-II (HD44780U) characters lines None 1/8, 1/11, 1/16 9,920 bits (208: characters characters) bytes bytes None None Character unit (5-V operation) (3-V operation) QFP1420-80 80-pin bare chip LCD-II/20 (HD66702) (standard) (low voltage) characters lines None 1/8, 1/11, 1/16 7,200 bits (160: characters characters) bytes bytes None None Character unit LQFP2020-144 144-pin bare chip 13.0 characters lines/ characters lines segments 1/17 1/33 9,600 bits (240: characters) LCD-II/F8 (HD66710)
CGRAM DDRAM SEGRAM Segment signals Common signals Liquid crystal drive waveform Number displayed lines power mode Horizontal scroll timing Package
bytes bytes bytes Available unit (5-V operation) (3-V operation) QFP1420-100 100-pin bare chip
Common
Common
Segment
Segment
Commonsegment
Commonsegment
frame
frame
frame
Figure Waveform (1/3 Duty, Bias)
Figure Waveform (1/3 Duty, Bias)
Differences Between Products
HD66204, HD66214T HD66224T
HD66204 Data input (bit) Package 100-pin plastic FP-100, TFP-100 HD66214T HD66224T
HD66205, HD66215T HD66115T
HD666205 drive circuits Power supply drive circuits (VCC-VEE) HD66215T 100/101 (VCC-VEE) HD66115T (VLCD-GND)
HD66107T HD66110RT
HD66107T drive circuits Data transfer Operating frequency (MHz) Power supply drive circuits Package 4/8-bits HD66110ST 4-bits/8-bits
HD63645, HD64645 HD64646
HD63645F interface Package Other family 80-pin plastic (FP-80) HD64645F family 80-pin plastic (FP-80) HD64646FS family 80-pin plastic (FP-80A) HD64646 another drive interface HD64645
HD66840F HD66841F
HD66840F Frame-based thinning control Display mode Each line Signal screen Both sides driver Horizontal stripe HD66841F Each each line Dual screen sides driver Vertical stripe registers
Gray-scale palette
Package Information
Package Information
Hitachi driver devices plastic flat packages reduce size equipment which they incorporated provide higher density mounting utilizing features thin liquid crystal display elements.
Package Dimensions
Scale:
FP-60
Code EIAJ JEDEC
FP-60
Applicable
HD44103, HD44105, HD61830, HD61830B
Package Information
FP-60A
Code EIAJ JEDEC
FP-60A SC-582-F
HD44100R Applicable
FP-80
Code EIAJ JEDEC
FP-80
Applicable
HD61602, HD61603, HD61604, HD61605, HD63645, HD64645, HD44102
Package Information
FP-80A
Code EIAJ JEDEC
FP-80A
HD61602 Applicable
FP-80B
Code EIAJ JEDEC
FP-80B
HD64646, HD44780U Applicable
Package Information
TFP-80
Code EIAJ JEDEC
TFP-80
HD44780U Applicable
FP-100
Code EIAJ JEDEC
FP-100
Applicable
HD61100A, HD61102, HD61103A, HD66204, HD66205, HD61200, HD61202, HD61203, HD66100F
Package Information
FP-100A
Code EIAJ JEDEC
FP-100A
HD66840F, HD66841F, HD66710 Applicable
FP-100B
Code EIAJ JEDEC
FP-100B
HD66100F Applicable
Package Information
TFP-100
Code EIAJ JEDEC
TFP-100
HD66204, HD66205, HD61202, HD61203 Applicable
FP-136
Code EIAJ JEDEC
FP-136
HD66850F Applicable
Package Information
FP-144A
Code EIAJ JEDEC
FP-144A SC-596-A
HD66702 Applicable
Notes Mounting
Damage from Static Electricity
Semiconductor devices easily damaged static discharges, they should handled mounted with utmost care. Precautions discussed below. Work Environment relative humidity facilitates accumulation static charge. Although surface mounting package devices must stored atmosphere prevent moisture absorption, they should handled mounted work environment with relative humidity greater prevent static buildup. Preventing Static Buildup Handling Avoid insulating materials that easily accumulate static charge workplaces where mounting operations performed. particular, charged objects induce charges Ground instruments, conveyors, work benches, floor mats, tools, soldering irons prevent accumulation static charges. conductive mats (with resistance order 1011 workbenches floors ground them. (See figure Personnel should wear grounding bracelets their arms legs. prevent electric shocks, insert resistor greater series shown figure soldering irons used, voltage soldering irons designed with semiconductors. Ground soldering iron tips semiconductors finished boards even without direct contact. Recommended measures include anti-static work garments, conductive carrier boxes, ionized blowers.
Resistor
High resistance conductive (grounded) Personal ground (bracelet) High resistance conductive (grounded) Humidifier Anti-static work clothes Anti-static shoes
Figure Static Electricity Countermeasures Semiconductor Handling
Notes Mounting
shown figure Preventing Semiconductor Discharges Precautions during Mounting Semiconductors damaged static charges package chip itself. However, damage will occur lead frame contacts metal object charge dissipates. Grounding metal object does help this situation. following measures should taken. Avoid contact friction between semiconductors easily charged insulators. Avoid handling working with semiconductors metal surfaces. Semiconductors should handled grounded high resistance mats. Grounded high resistance mats must used when mounting semiconductors boards. Ground mats before handling semiconductors. Particular caution required following conductivity testing, since capacitors board retain charge. boards also acquire static charge contact, friction, induction. Take precautions prevent discharge through contact with transport boxes other metal objects during transportation. Such precautions include anti-static bags other techniques isolating boards. semiconductor charged, allow that device contact metal objects.
Metal conductive material
Insulated wire over
Figure Personal Ground
Soldering iron
Figure Soldering Iron Grounding Example
Notes Mounting
Notes Mounting
Storage Moisture absorption Package internal moisture density Water diffusion coefficient Chip Resin
Solder reflow
Vaporization internal moisture content
22.4 /latm fad: Resin bonding strength Generated stress
Frame
Boundary separation Wmax Form coefficient Resin Young's modulus Internal pressure shorter dimension Thickness resin under
Wmax
Expansion
Cracking
Crack
(T): Resin strength Form coefficient
Figure Package Crack Generation Mechanism
Adhesive strength bending strength
Generated stress units/mm2)
units/mm2)
(MLX)SAT
Moisture absorption ratio (85°C 85%RH)
Temperature (°C)
Figure Temperature Dependence Resin Adhesive Strength, Mechanical Strength, Generated Stress
Notes Mounting
Recommended Soldering Conditions
Soldering temperature stipulations must followed moisture absorption states plastic packages must carefully monitored prevent degradation reliability surface mount packages thermal shock. This section presents Hitachi's recommended soldering conditions. Recommended Soldering Temperatures table
Table Recommended Soldering Temperatures
Method Vapor-phase reflow 215°C Package surface temperature 160°C Recommended Conditions maximum Notes
About 5°C/s Time
Infrared reflow Hot-air reflow Package surface temperature
235°C, maximum 160°C
maximum
About 4°C/s 5°C/s Time
Since TSOP, TQFP, packages whose body thickness less than especially vulnerable thermal shock, recommend limiting soldering conditions maximum temperature 230°C maximum time seconds these packages.
Notes Mounting
Precautions Prior Reflow Soldering
Surface mount packages that hold large chips weaker than insertion mount packages. Since whole package heated during reflow operation, characteristics described below should considered when determining handling used prior reflow soldering conditions used reflow operation. Package Cracking Mechanism Reflow Soldering Packages that have absorbed moisture thought crack mechanism shown figure Moisture absorbed during storage diffuses through interior package. When package this state passed through reflow furnace, that moisture rediffuses. Some escapes along boundary between resin frame. This lead boundary separation. pressure this space increases resin warps, finally resulting crack. Fick diffusion model used calculate diffusion moisture resin: volume moisture absorbed package expressed follows: increase internal pressure calculated from moisture diffusion during reflow heating using function. Figure shows relationships between maximum stresses when packages various moisture absorption states heated, adhesion strength between resin frame various temperatures, strength resin itself. While this model indicates that cracks will result this example when moisture absorption ratio exceeds (vapor phase soldering 215°C) process, actual tests show that cracks result packages with moisture absorption ratio 0.25 wt%. This indicates that model valid. Therefore moisture management should focus moisture content vicinity frame.
Notes Mounting
Surface Mounting Package Handling Precautions
Package Temperature Distribution most common method used mounting surface mounting device infrared reflow. Since package made black epoxy resin, portion package directly exposed infrared heat source will absorb heat faster thus rise temperature more quickly than other parts package unless precautions taken. shown example figure surface directly facing infrared heat source 30°C higher than leads being soldered 40°C 50°C higher than bottom package. soldering performed under these conditions, package cracks occur. avoid this type problem, recommended that aluminum infrared heat shield placed over resin surface package. using 2-mm thick aluminum heat shield, bottom surfaces resin held 175°C when peak temperature leads 240°C. excessive, there will sudden vaporization during soldering, causing interface resin lead frame spread apart. extreme cases, package cracks will occur. Therefore, especially thin packages, important that moistureproof storage used. remove moisture absorbed during transportation, storage, handling, recommended that package baked 125°C hours before soldering. Heating Cooling method soldering electrical parts solder method, compared reflow method, rate heat transmission order magnitude higher. When this method used with plastic items, there thermal shock resulting package cracks deterioration moistureresistant characteristics. Thus, recommended that solder method used. Even with reflow method, excessive rate heating cooling undesirable. rate temperature change less than 4°C/sec recommended. Package Contaminants recommended that resin-based flux used during soldering. Acid-based fluxes have tendency leaving acid residue which adversely affects product reliability. Thus, acidbased fluxes should used. With resin-based fluxes well, residue left behind, leads other package parts will begin corrode. Thus, flux must thoroughly washed away. cleansing solvents used wash away flux left package extended period time, package markings fade, care must taken. precautions mentioned above general points observed reflow. However, specific reflow conditions will depend such factors package shape, printed circuit board type, reflow method, device type. details surface mounting small thin packages, please consult separate manual available mounting. there additional
(Resin)
Infrared rays (Surface)
Temperature (°C)
(Soler)
Time (sec)
Figure Temperature Profile During Infrared Heat Soldering (Example) Package Moisture Absorption epoxy resin used plastic packages will absorb moisture stored high-humidity environment. this moisture absorption becomes
Information
Features (TAB Technology)
structure materials used Tape Carrier Package (TCP) give following features compared with conventional packages: Thin, Lightweight, Fine Pitch With thickness less than fine-pitch leads, reduced pitch device enables more functionality package equivalent size. Specifically, these features enable: Thin high definition (Liquid Crystal display Module) Lightweight ultra-high count systems Flexible Design following tailored design system (e.g. mother board design): Pattern layout design
Applications
Thinness, ultra-high count, fine pitch open possibilities applications compact highly functional systems. Figure shows some applications TCP-packaged chips.
Personal computers, word processors
driver
modules
Calculators organizers
Memory
Memory cards
Workstations
Computers
Figure Examples TCP-Packaged Chip Applications
Hitachi Products
Hitachi Driver Hitachi offers tape-carrier-packaged drivers modules ranging from miniature large sizes. Table shows some examples standard tape carrier packages drivers. Hitachi drivers combine device that withstand high voltages provide high definition with tape carrier package that promises excellent reliability, making possible applications that would feasible with conventional QFP. material specifications products table table
Table TCPs Hitachi Drivers
Function Signal Output Analog Product Code Appearance Total Count (Output) Outer Lead Pitch
Application TFT*1
Drive Column only
Remarks
HD66330TA0 Color STN*2 liquid crystal Color STN*2 liquid crystal Column only Digital
(192)
0.16
HD66110STB2 Column only Digital
(160)
0.092 Outer lead pitch: 0.074 products also available
HD66120TA0 Color STN*2 liquid crystal Small liquid crystal Common only Digital
(240)
0.07 Outer lead pitch: 0.250 products also available
HD66115TA0 Column common Digital
(160)
0.18 Built-in controller (on-chip RAM)
HD66108T00 Notes: TFT: Thin Film Transistor STN: Super Twist Nematic
(165)
Table TCPs Hitachi Drivers (cont)
Function Signal Output Digital Product Code Appearance Total Count (Output) Outer Lead Pitch
Application Small liquid crystal
Drive Column common
Remarks
HD66712TA0
(94)
0.24 Folding
HD66712TB0
(94)
External View Cross-Sectional Structure
Components
Sprocket hole (perforation)
Wiring
Test
Outer lead output
Resin
Guide pattern
chip
Guide hole
Base film
User area
Outer lead input
Solder resist
Outer lead hole
Cross-Sectional Structure
Solder resist
Resin
Copper foil
Base film Adhesive chip Bump (Au)
Materials Features Material Specifications: Table lists Hitachi material specifications. require other materials. this case, ordering manual [ADE-801-001 (O)]. Table lists current material specifications various Hitachi products.
Table Hitachi Material Specifications
Item Base film Adhesive Copper foil Resin Outer lead plating Solder resist Solder resist rear surface folding slit Specifications UPILEX® S-type: thickness KAPTON® V-type: thickness Toray #5900 TOMOEGAWA E-type Rolled copper: thickness Electro-deposited copper: thickness Epoxy resin Epoxy solder resist Polyimide solder resist
Cross-sectional view
chip
Folding only
Table Material Specifications Hitachi Products
Product Code HD66330TA0 HD66110STB2 HD66120TA0 HD66115TA0 HD66108T00 HD66712TA0 HD66712TB0 Application Color Color Color Small liquid crystal Small liquid crystal Small liquid crystal Base Film UPILEX® UPILEX® UPILEX® UPILEX® KAPTON® UPILEX® UPILEX® Adhesive TOMOEGAWA E-type TOMOEGAWA E-type TOMOEGAWA E-type TOMOEGAWA E-type Toray #5900 TOMOEGAWA E-type TOMOEGAWA E-type Copper Foil Electro-deposited copper Electro-deposited copper Electro-deposited copper Electro-deposited copper Rolled copper Electro-deposited copper Electro-deposited copper Outer Lead Plating
Properties Materials: Properties Hitachi materials follows. Base film properties base film shown table Hitachi currently adopts UPILEX® which exhibits high rigidity super dimensional stability with respect temperature changes compared with conventional KAPTON® Copper foil (copper wiring) properties rolled foil electrodeposited foil shown table Hitachi plans adopt electro-deposited foil excellent elongation properties room temperature (RT) compared with conventional rolled foil.
Table Properties Base Film (See references page
Property Coefficient linear expansion 10-5/°C Tensile modules (MPa) 100°C 200°C UPILEX® (Ube Industries, Ltd.) 8826.0 KAPTON® Pont-Toray Co., Ltd.) 3481.4
Table Properties Copper Foil (See reference page
Sampling Condition foil foil foil foil Rolled Foil (Hitachi Cable, Ltd.) CF-W5-1S-LP 421.7 229.5 Electro-Deposited Foil (Mitsui Mining Smelting Co., Ltd.) 3EC-VLP 538.4 10.1 249.1
Property Tensile strength (MPa) Elongation Tensile strength 180°C (kgf/mm2) Elongation 180°C
Note: Data from film suppliers. Number measured samples: pieces each 1.01972 10-1 kgf/mm2
Adhesive relationship between peeling strength (adhesive/electro-deposited foil) lead width shown figure Hitachi adopts following combinations because their higher peeling strength. Adhesive TOMOEGAWA E-type/electrodeposited foil Adhesive Toray #5900/rolled foil
Adhesive
Copper foil
TOMOEGAWA Electro-deposited E-type foil
Peeling strength (gf/100
Toray #5900 Rolled foil
TOMOEGAWA Rolled foil E-type
40/40 60/60 (120 80/80 (160 100/100 (200
Line width/space (µm) (pattern pitch)
Peeling strength
measure Measuring method: peel
Peeling direction
Copper foil
Measuring condition: 25°C Number measured samples: Five pieces measured each specification, leads measured each piece.
Pattern pitch
Adhesive Base film
Line width
Space
Figure Relationship between Peeling Strength Lead Width
Fine-Pitch Bump Formation Bumps essential products; they foundation technology have excellent corrosion resistance their structure. When current trend toward high-performance chips with ultra-large pin-out began driving counts upward (and reducing pitch), Hitachi quick develop volume production process forming fine-pitch bumps. Figure shows Hitachi bump structure. Figure shows flowchart bump formation process.
Straight-Wall Bumps (Fine-Pitch)
100, Bump (Au) 50*2, 40*3 UBM*1
Passivation Notes: UBM: Under Bump Metal Case 80-µm bump pitch Case 70-µm bump pitch
Unit:
Figure Hitachi Bump Structure
photolithography Passivation Through-hole photolithography evaporation deposition Bump photolithography Bump formation process Gold plating Remove resist etching
Figure Bump Formation Flowchart
Fabrication Flow Tape: tapes purchased from tape manufacturers. many cases, quality products depends critically quality tape, addition evaluating constituent materials, Hitachi strictly controls stability tape fabrication process. Fabrication Process: fabrication process starts from wafers chips) with bumps, patterned tape. After being bonded highprecision inner lead bonder, chips sealed resin. Figure shows standard fabrication process TCPs used Hitachi LCDs.
Bump (gold) Wafer tape Bump formation Silicon chip
Pelletizing
Inner lead bonding
Inner Lead Bonding This step bonds bumps chips inner leads formed patterning. Gang bonding been adopted standard procedure Hitachi. Sealing Chips sealed resin ensure inner lead bonding strength. standard bonding process employs potting liquid resin which seals chip. Resin Inner lead
Sealing
Marking
Inspection chip Shipping packing
Copper foil
Base tape
Figure Standard Fabrication Process TCPs Used Hitachi LCDs
Packing Packing Format: products packed moisture-proof packages. reel wound with tape sealed opaque antistatic sheet with protect product from mechanical shock then packed into carton before delivery ensure solderability lead plating. Labels which indicate product name, quantity, placed reel, antistatic sheet, carton. Figure shows packing format.
Width Products
Width Products
Label
Reel
Label
Reel
Conductive separator
Separator
Lead tape tape Antistatic sheet
Lead tape
Conductive tape
tape Antistatic sheet
Label Silica Silica
Label
Label carton side Shock absorber Carton Label carton side Shock absorber Carton
Figure Packing Format
Tape Specification:
Width Tape tape Lead tape +1/-0.5 added both ends +1/-0.5 added both ends
Reel Specification: dimensions.
Figure
shows
reel
recycling purpose, would appreciate return reel separator after use.
Conductive tape Separator Conductive separator
Note: lengths tape, conductive tape, separator vary slightly depending quantity product tape.
Units: Material: Styrene Dimensions without tolerance design values.
16.75 ±0.3
Note: width tape.
Figure Reel Dimensions
Winding Direction: Figure shows winding TCPs. combination product directions when pulling from reel placement patterned face either front back tape makes four types winding directions. winding direction essential specification which affects chip punching machine assembly equipment during packaging process. wind direction differs according product, please check delivery specification before using TCP.
Note
Product direction (two types) Patterned face either front back (two types) Four types winding direction
Magnification (example)
Reel
Product (TCP tape)
Figure Example Winding Direction
Mounting Methods
Mounting Structure Typical example structure using TCPs illustrated figure Basic Mounting Process figure
panel
PCB*
Note: PCB: Printed circuit board
Figure Structure
ACF* panel Punching Single
applied Prepress Thermocompression bonding Contact inspection Soldering Contact inspection Resin coating Repair
Repair
Lighting test
Note: ACF: Anisotropic conductive film
Figure (Outer Lead Bonding) Basic Flowchart
Process Outline outline assembly process using TCPs given figure
applied Applies glass panel thermal pressing.
panel
prepress
Aligns panel patterns temporarily connects them temperature pressure.
Thermo-compression bonding
Thermocompresses multiple TCPs panel, which have been temporarily connected, high temperature high pressure either individually together.
Soldering Joins output leads TCPs patterns soldering.
Figure Outline Assembly Process
Mounting Conditions Mounting TCPs Panels (See reference page 28): adhesive film that connect electrodes glass panel with output leads TCPs. There types ACFs: whose thermosetting thermoplastic properties make handling easier (such repair) reduces stresses caused temperature changes. whose thermosetting properties provide connection thermostability. resistance high
Please select depending type application. Selection thickness appropriate thickness must selected depending height, line width space width circuit connected; rough calculation formula obtaining proper thickness shown below.
Electrode
Glass substrate
Copper foil (circuit) Adhesive Base film
thickness before connection thickness after connection Circuit height Pitch Space width (top) Space width (bottom) Correction value AC-6073, AC-6103 0.15T AC-7104, AC-7144 0.25T
Incomplete filling occur space thickness thin, while thick, connection reliability becomes poor since conductive particles flattened out. necessary select appropriate thickness. Some adjustment thickness controlled bonding conditions (especially pressure).
Laminating bonding conditions necessary optimize bonding conditions according ACF, glass panel specifications. bonding conditions adopted ANISOLM® (Hitachi Chemical Co., Ltd.) shown table reference. Please determine your optimum bonding conditions based following.
Table Bonding Conditions ANISOLM®
Mixture Thermosetting Thermoplastic Thermosetting
Item
Unit
Remarks
AC-6073 AC-6103 AC-7104 AC-7144 Standard specifications Min. pitch Line Space Thickness Width Length Color Core diameter Bonding Laminating Temperature conditions Pressure Time Bonding Temperature Pressure Time Note: 1.01972 10-1 kgf/mm2 Resolution Line/ 2.5, Transparent (gray) 18.5 2.5, Transparent (gray) 18.5 Temperature ANISOLM® Temperature ANISOLM®
Measuring Method Temperature Profile (example)
Heating head Silicone rubber (0.2 0.3mm) Teflon film 50µm) Base film Adhesive Glass substrate Thermocouple Copper foil Glass plate
ANISOLM temperature (°C)
Final temperature
Time
Temperature after should over final temperature (°C)
Figure Bonding Temperature Profile
Soldering Conditions: Solder TCPs under following conditions. soldering temperature low, solder melt. However, soldering temperature high, solder adequately spread over leads owing their oxidized surfaces, and/or leads plating become attached heating collet. latter case, copper foil leads become exposed. Please determine adequate soldering conditions mass production carefully. Soldering temperature solder joint): 260°C Soldering time: seconds max.
Temperature solder joint (°C)
260°C
seconds (max.)
Time (second)
Note Temperature solder joint normally 50°C lower than heating collet temperature. Soldering temperature great impact quality products. Operating conditions should therefore specified after examining temperature relationship between heating collet solder joint.
Heating collet Base film Outer lead Solder joint Footprint
Note case soldering quad type TCPs, please TCPs using vacuum collets equivalent prevent base film warpage circuit position misalignment.
Vacuum collet Heating collet Outer lead Base film Footprint Vacuum collet Heating collet
Storage Restrictions Packed products should used within months. products removed from antistatic sheet should stored having point -30°C lower. However, they should used soon possible after removal, because solderability leads plated with solder decreases with time. Handling Precautions Electrical Handling Anti-electrostatic discharge measures products require following care beyond what required non-TCP products. Give special attention ion-blow grounding especially when removing products from reel, since they easily collect static electricity because base film. products become charged, discharge electricity little little using ion-blow; rapid discharge damage devices. Handle product that static electricity applied outer leads. Depending equipment used, this require taking proper anti-electrostatic discharge measures, such allowing tapeguide contact outer leads. Outer lead coating Outer leads should coated with resin other appropriate materials prevent short-circuits disconnections corrosion. Conductive foreign particles easily cause shortcircuits since lead spacing products much narrower than that non-TCP products. Disconnections from corrosion also easily occur solder flux similar materials adhering leads while mounting products board. This because product leads formed bonding very thin copper foil base film order attain high-density mounting. prevent electric breakdown when mounting products board, allow electrical contact with die's bottom surface. These types failures easily occur since products have bare monocrystal die's bottom surface order make product thin possible. prevent degradation electrical characteristics, expose products sunlight. Mechanical Handling prevent cracks when mounting products board, allow physical contact with die's bottom surface. These types failures easily occur since products have bare monocrystal die's bottom surface order make product thin possible. Handle products carefully avoid bending leads from base film transformation. bend products since this cause
cracks solder resist. Punching Punching continuous base film extract single products requires following care. Align each product correctly according tape perforations (sprocket holes). metal punching with pressing installation prevent resin cracks Determine punching position that cutting edge does touch molding area based relationship between maximum molding area (specified design drawing) punching accuracy. Punch products section where outer leads straight (not slanted) prevent shortreduce cutting stresses outer leads. (Refer figure 13.)
Punching without pressing installation
Punching with pressing installation Pressing installation
Cutting edge
Stress
circuits caused conductive particles. (Refer figure 14.)
punching area
Margin area
Punching area
Figure Punching
Figure Punching Position Mounting structure Copper foil easily break even from small physical stress because thinness needed accommodate fine patterns. Large stresses should therefore applied copper foil when mounting products board. Bending stresses When edges aligned, resin cracks occur bending stresses. avoid this problem, locate board closer panel that support molded part package. (Refer figure Thermal stresses consists glass, TCPs glassepoxy substrate having their respective coefficients thermal expansion (CTE). This difference expansion effects cause "thermal stresses" that especially concentrate TCPs. joining structure LCMs roughly shown figure Before beginning mass production, investigate determine joining structure that reduces thermal stresses prevent contact other defects from occurring. stack more than cartons products.
Bending stresses
Move closer panel Bending Stresses Applied Bending Stresses Applied
subject cartons high physical impact.
composed various materials having their respective CTEs.
Glass
Figure Positioning Mounting TCPs
Figure Joining Structure Correction (Indium Oxide) Electrode Pitch: products expand absorbing moisture heat during storage assembly. Pitch correction electrode should performed based dimensions after mounted conductive film. However, pitch correction performed based dimensions before mounting, must based data measured after removing products from package storing temperature 25°C humidity hours. Correct electrode pitch depending bonding equipment conditions used. Miscellaneous heat lead tape separator; they have poor heat-resistivity will expand. subject TCPs high temperature long period time while cleaning other operations; copper foil peel rapid deterioration adhesion between copper foil base film. Carrier tapes have some waviness that
18.75 +0.15 Output dimension after joined 18.74 +0.10 18.73 Output dimension (mm) +0.05 18.72 18.71 -0.05 18.70 Measured sample: HD66214TA7 (Base film: UPILEX Number measured samples: pieces Storage conditions: ±5°C, 60%RH hours -0.10 Dimensional change rate
18.69
18.68 Before sealing carton Immediately after unsealing Storage time (hours)
cause problems tape transport. tapeguide equivalent secure tape. Figure Dimensional Change Output
number folding bending operations that performed before lead breaks shown figure greater bending angle, sooner lead will break. should mounted such that bending angle each slit does exceed 90°.
42.6 0.15 0.3p 0.45
Tape cutting position Folding slit shape Folding with slits Thickness (measured value)
Unit:
1.25 slits Folding with slits Thickness (measured value) Slide glass Triple-bend degrees less slit) Double-bend Triple-bend
Slide glass
Double-bend degrees slit) 99.99
Cumulative defect rate
Number measured sample: pieces each case HD66712TB0 Polyimide application rear slit
0.01
1000
Number times folded
Figure Example Number Times Folded Cumulative Defect Rate
Standardization
present, standardization drive TCPs difficult because differences mounting methods customer specifications. However, standardization TCPs (QTP DTP) that correspond shape TQFP TSOP packages been discussed Tape Carrier Package Working Group Semiconductor External Standards Committee (EE-13) EIAJ (Electronics Industries Association Japan). This working group, which composed various semiconductor manufacturers including Hitachi, tape manufacturers, socket manufacturers, taking comprehensive approach. EIAJ adopted metric control standards against JEDEC*'s inch control standards, determined standards based following items: Fixed test layout, variable package size Fixed test layout, variable terminal pitch Accordingly, users share socket deciding width tape test pitch. JEDEC already agreed metric-control TCP, Hitachi making efforts produce metric-control TCPs. General rules covering outlines that have already been formulated published EE-13 committee shown below. EIAJ ED-7431 Quad Tape Carrier Package (QTP) EIAJ ED-7432 Dual Tape Carrier Package (Type (DTP(I)) EIAJ ED-7433 Dual Tape Carrier Package (Type (DTP(II)) summary these general rules given below. Note that these standards necessarily apply drive TCPS. Note: JEDEC: Joint Electronic Council. Device Engineering
Quad Tape Carrier Package (QTP) Tape width: Package size: Test pitch: 0.5, 0.4, 0.3, 0.25 Outer lead pitch: 0.5, 0.4, 0.3, 0.25, 0.2, 0.15 Sprocket-hole type: Super Wide, Super Wide, Super
EIAJ ED-7431
Number test pads: Fixed maximum number test pads, regardless outer lead count. 35-mm tape: pitch; pitch.
Dual Tape Carrier Package (Type (DTP(I)) Tape width: Package size: Test pitch: Outer lead pitch: 0.5, 0.4, Sprocket-hole type: Super Number test pads: EIAJ ED-7432
Dual Tape Carrier Package (Type (DTP(II)) Tape width: Package size: mil, mil, mil, mil, mil, mil, (Enom) Test pitch: 1.27 (outer lead pitch: 1.27, 1.0) (outer lead pitch: 0.8, 0.65) Outer lead pitch: 1.27, 1.0, 0.8, 0.65 Sprocket-hole type: Super Number test pads: (test pitch: 1.27 (test pitch:
EIAJ ED-7433
Reference Materials
Mounting Equipment Manufacturer Manufacturer: Hitachi Chemical Co., Ltd.
Area Address Hitachi Chemical Co., America, Ltd. International Drive, Brook, 10573, U.S.A. Hitachi Chemical Europe Immermmstr. D-4000 Germany Hitachi Chemical Asia-Pacific Pte, Ltd. Bras Basah Road, #08-04 Plaza Park, Singapore 0718 Hitachi Chemical Taipei Office Room 1406, Chia Hsim Bldg., Sec. Chung Shang Road Taipei, Taiwan Hitachi Chemical Beijing Office Room 1207, Beijing Fortune Building, Dong, Huan Bei-Lu, Chao Yang District, Beijing, China Hitachi Chemical Co., (Hong Kong) Ltd. Room 912, Houston Centre, Mady Road, Tsimshatsui East, Kowloon, Hong Kong (914) 934-2424 (914) 934-8991
Europe
(211) 35-0366
(211) 16-1634
S.E. Asia
337-2408
337-7132
Taiwan
581-3632, 561-3810
521-7509
Beijing
501-4331
501-4333
Hong Kong
66-9304
723-3549
Manufacturer: Matsushita Electric Industrial Co., Ltd.
Area (Illinois) Deutschland Asia (Japan) Address Panasonic Factory Automation Company Panasonic Factory Automation Deutchland Matsushita Manufacturing Equipment (708) 452-2500 (040) 8549-2628 (0552) 75-6222
Manufacturer: Shinkawa Co., Ltd.
Area U.S.A. Address MARUBENI INTERNATIONAL ELECTRONICS CORP. U.S.A. 3285 Scott Blvd, Santa Clara, 95054 MARUBENI INTERNATIONAL ELECTRONICS CORP. SINGAPORE Tannery Lane #06-01/02, Lian Teng Building, 1334 MARUBENI HYTECH CORP. Japan 20-22, Koishikawa 4-chome, Bunkyo-ku, Tokyo 112, Japan 408-727-8447 408-727-8370
Singapore, Malaysia, Thailand Korea, Hong Kong, China, Taiwan, Philippine, Brazil Europe
741-2300
741-4870
(03)-3817-4952
(03)-3817-4959
MARUBENI INTERNATIONAL ELECTRONICS EUROPE GMBH Niederrhein STR, 4000 Federal Republic Germany
0211-4376-00
0211-4332-85
Manufacturer: Kyushu Matsushita Electric Co., Ltd.
Area CHICAGO ATLANTA Address 1240 Landmeier Grove Village, 60007 1080 Holcomb Bridge Building 100, Suite Roswell, Georgia 30076 Bovet Road, Suite Mateo, 99402 238/246 King Street, London United Kingdom Scotts Road, #21-10/13 Shaw Centre Singapore 0922 Floor, Donghwa Bldg. 454-5, Dokok-1 Dong, Kangnam-Ku, Seoul, Korea 6TH, FL., 360, HSING ROAD, KWEISHAN, TAOYUAN HSIEN, TAIWAN KUALALUMPUR BRANCH FLOOR, WISMA RUBBER, JAPAN MELAKA, 50100 KUALALUMPUR 20TH FL., Thaniya Plaza Bldg, Silom Road, Bangrak, BANGKOK, 10500 THAILAND (708) 822-7262 (404) 906-1515 (708) 952-8079 (404) 998-9830
JOSE LONDON SINGAPORE SEOUL
(415) 608-0317 (081) 748-2447 7387681 (02) 571-2911
(415) 341-1395 (081) 846-9580 7325238 (02) 571-2910
TAIWAN
(03) 328-7070
(03) 328-7080 (03) 328-7090 (03) 291-8002
MALAYSIA
(03) 291-0066
BANGKOK
(02) 231-2345
(02) 231-2342
Manufacturer: Japan Abionis Co., Ltd.
Area Worldwide Address Overseas Department Contact: Asami, 81-3-3501-7358 81-3-3504-2829
Tape Manufacturers Manufacturer: Hitachi Cable Ltd.
Area U.S.A. Europe Sigapore Hong Kong Address HITACHI CABLE AMERICA INC. HITACHI CABLE INTERNATIONAL, LTD. (LONDON) HITACHI CABLE INTERNATIONAL, (SINGAPORE) HITACHI CABLE INTERNATIONAL, (HONG KONG) 1-914-993-0991 001-44-71-439-7223 001-65-2681146 001-852-721-2077 001-1-914-993-0997 001-44-71-494-1956 001-65-2680461 001-852-369-3472
Manufacturer: Mitsui Mining Smelting Co., Ltd.
Area U.S.A. Europe Address MITSUI MINING SMELTING CO., (USA) INC. MITSUI MINING SMELTING CO., LTD. London Office MITSUI MINING SMELTING CO., LTD. MICROCIRCUIT DIVISION 212-679-9300 71-405-7717 212-679-9303 71-405-0227
Asia
03-3246-8079
03-3246-8063
Manufacturer: Shindo Company Ltd.
Area U.S.A. Address SHINDO COMPANY LTD., U.S. BRANCH OFFICE 2635 NORTH FIRST ST., STE. JOSE, 95134 U.S.A. 408-435-0808 408-435-0809
Aeolotropy Conductive Film Manufacturers Manufacturer: Hitachi Chemical Co., Ltd.
Area Address Hitachi Chemical Co., America, Ltd. International Drive, Brook, 10573, U.S.A. Hitachi Chemical Europe GmbH. Immermannstr. D-4000 Germany Hitachi Chemical Asia-Pacific Pte, Ltd. Bras Basah Road, #08-04 Plaza Park, Singapore 0718 Hitachi Chemical Taipei Office Room 1406, Chia Hsin Bldg., Sec. Chung Shang Road Taipei, Taiwan Hitachi Chemical Beijing Office Room 1207, Beijing Fortune Building, Dong, Huan Bei-Lu, Chao Yang District, Beijing, China Hitachi Chemical Co., (Hong Kong) Ltd. Room 912, Houston Centre, Mady Road, Tsimshatsui East, Kowloon, Hong Kong (914) 934-2424 (914) 934-8991
Europe
(211) 35-0366
(211) 16-1634
S.E. Asia
337-2408
337-7132
Taiwan
581-3632, 561-3810
521-7509
Beijing
501-4331
501-4333
Hong Kong
66-9304
723-3549
Manufacturer: Sony Chemicals
Area U.S.A. Europe Southeast Asia Address SONY CHEMICALS CORPORATION AMERICA SONY CHEMICALS EUROPE B.V. SONY CHEMICALS SINGAPORE LTD. 1-(708) 616-0070 31-20-658-1850 65-382-1500 1-(708) 616-0073 31-20-659-8481 65-382-1750
References
KAPTON® Catalog UPILEX® Catalog Electro-deposited Foil Comparison List Hitachi Anisotropic Discharge Film Pont-Toray Co., Ltd. Industries, Ltd. Mitsui Mining Smelting Co., Ltd. Electronic Devices Group Hitachi Chemical Co., Ltd. 1992.7.21
Table Hitachi Standard Product Specifications
User Pattern Area Width (mm) 50.20 32.00 32.42 43.50 32.52 32.00 51.0 46.0 15.60 15.81 16.6 24.5 32.40 44.0 18.68 18.8 20.08 46.00 33.40 35.30 52.0 56.2 36.0 38.2 24.80 46.2 21.50 21.00 11.70 15.4 19.55 17.8 21.3 17.40 23.65 10.5 18.8 18.9 46.20 31.95 33.60 49.7 54.8 33.7 36.7 23.80 43.2 9.44 18.68 11.6 42.9 11.00 10.5 23.5 15.2 11.0 16.38 9.00 15.10 23.6 44.0 23.3 48.34 20.25 28.00 20.00 31.60 20.00 42.40 20.00 31.60 20.25 28.00 20.25 46.80 (mm) Solder Resist Width Product Tape (mm) Length*2 Material*3 Plating
Product
1000
Function
Output Lead Output Lead Input Lead Pitch Length Pitch Outputs (µm) (mm) (µm)
Input Lead Length Input Lead (mm) Arrange*1
HD66107T00
driver
HD66107T01
driver
HD66107T11
driver
HD66107T12
driver
HD66107T24
driver
HD66107T25
driver
HD66108T00
driver
HD66108TA0
Common/column
5.34
Hitach Standard Product Structure
HD66108TB0
Common/column
HD66110STB2
Column
HD66110STB3
Column
1.95
HD66110STB4
Column
2.14
Hitachi provide standard products listed table immediately. Figures
HD66113TA0
Common
HD66115TA0
Common driver
HD66115TA3
Common
HD66120TA0
Column
2.54
HD66120TA2
Column
3.15
HD66120TA3
Column
HD66300T00
analog driver
HD66310T00
level gray scale
HD66330TA0
level gray scale
HD66503TA0
Common
HD66503TB0
Common
HD66520TA0
Column
HD66520TB0
Column
HD66712TA0
Common/column
show structure each product.
HD66712TB0
Common/column
Notes: Input lead arrange: Straight, Directions Number perforations Tape material: Kapton, Upilex "Kapton" trademark Dupont, Ltd. "Upilex" trademark Industries, Ltd.
Figure Hitachi Standard HD66107T00
Figure Hitachi Standard HD66107T01
Figure Hitachi Standard HD66107T11
Figure Hitachi Standard HD66107T12
Figure Hitachi Standard HD66107T24
Figure Hitachi Standard HD66107T25
Figure Hitachi Standard HD66108T00
Figure Hitachi Standard HD66108TA0
Figure Hitachi Standard HD66108TB0
Figure Hitachi Standard HD66110STB2
Figure Hitachi Standard HD66110STB3
Figure Hitachi Standard HD66110STB4
Figure Hitachi Standard HD66113TA0
Figure Hitachi Standard HD66115TA0
Figure Hitachi Standard HD66115TA3
Figure Hitachi Standard HD66120TA0
Figure Hitachi Standard HD66120TA2
Figure Hitachi Standard HD66120TA3
Figure Hitachi Standard HD66300T00
Figure Hitachi Standard HD66310T00
Figure Hitachi Standard HD66330TA0
Figure Hitachi Standard HD66503TA0
Figure Hitachi Standard HD66503TB0
Figure Hitachi Standard HD66520TA0
Figure Hitachi Standard HD66520TB0
Figure Hitachi Standard HD66712TA0
Figure Hitachi Standard HD66712TB0
Chip Shipment Products
(chip board) (chip glass) products form only small percentage thin form miniature mounting products shipped. However, these products, which referred here "chip shipment products", involve shipping unmounted chips from factory. Since chip shipment products treated semifinished products, there will differences between their quality guarantee ranges electrical characteristics items those published packaged (i.e., complete) products. differences quality guarantee ranges, electrical characteristics items, visual inspection described (customer approval specifications). Product functionality operation completely identical complete (packaged) product. This section describes standard shipment specifications chip shipment products. actual shipment stipulations will those mentioned stipulated individual products.
Chip Packing Specifications
Delivery Units Delivery unit counts (lot size) range from minimum units 10,000 units. Packing Specifications Trays vacuum packed sealed with trays single pack. chip products given pack will from same production lot. Figure shows chip shipment product packing. Chip products stored trays protected sheet protective paper. Markings following items will marked each tray. Product number number Count Inspection certification seal
following items will marked each pack.
Electrical Characteristics Quality Level
mentioned above, quality guarantee ranges electrical characteristics chip shipment products differ from those standard products. Refer individual products specific details. basic differences follows. Electrical Characteristics electrical characteristics chip shipment products guaranteed single point 75°C. Quality Level Electrical characteristics: 4.0% Visual inspection: 4.0% (The specific details visual inspection other items contained CAS.)
Product number Disbursement number Count Inspection certification seal
following items will marked outer packing. Product number Disbursement number Count Inspection certification seal
possible, please return empty trays your Hitachi sales representative.
Storage Specifications
After delivery after opening transport packaging, chip shipment products must stored manner that does cause their electrical, physical, mechanical properties degrade humidity reactive contamination. recommend following storage conditions these products.
Chip Shipment Products
When Stored Packed State Storage conditions: Nitrogen, -30°C degrees below zero, Celsius) Storage period: months date inspection certification seal shall used start storage period. When Stored after Bonding Wire Bonding Temperature: under 30°C, Humidity: under 70%, Airborne particles: less than 5000 cubic foot Storage period Seven days Storage conditions Nitrogen, -30°C Storage period days Storage condition
Cardboard (cover)
Product
Urethane foam Product
Product
Silica
Vacuum pack
Urethane foam
Cardboard
HD44780SA00D, HCD66702, HD44102D, HD44105D, HD61202D, HD61203D, pcs./ HD61104AD, HD61105AD, tray HD66106D
pcs./ tray HD44100D, HD66100D, pcs./ HCD66204, HCD66205 tray
Chip tray
(Unit:
Figure Chip Packing
Chip Shipment Products
Chip Shape Specifications
figure
Products Available Chip Shipment Products
Hitachi, Ltd. currently provides products listed table chip shipment products. Figures show their respective chip sizes bonding layouts.
Table Chip Shipment Product Table
Figure Product HCD44100R HD44102D HD44105D HCD44780U*** HCD66702R*** HCD66702R***L HCD66710*** HD61202D HCD66712*** HCD66720*** HCD66730*** HD61203D HD66100D HD66106D HCD66204 HCD66205 HCD66204L HCD66205L Base Product HD44100RFS HD44102CH HD44105H HD44780U***FS HD66702R***F HD66702R***FL HD66710***FS HD61202 HD66712***FS HD66720***FS HD66730***FS HD61203 HD66100F HD66106FS HD66204F HD66205F HD66204FL HD66205FL Page
Chip Shipment Products
Min.
Max.
Surface shape maximum values
direction: direction: chip dimensions) (unit:
Figure Chip Cross-Section
Chip Shipment Products
HCD44100R
Chip size Coordinate: Origin: size 2.40 3.94 center Chip center (SiL)
Type code
(Unit: Name Coordinate 1815 1815 1815 1815 1815 1600 1420 1240 1060 -200 -380 -560 -740 -920 Name Coordinate -1100 -1300 -1500 -1740 -1815 -1815 -1815 -1815 -1815 -1815 -1815 -1815 -1815 -1815 -1780 -1600 -1410 -1235 -990 -810 Name SHL1 SHL2 1075 1075 1075 1075 1075 1075 1075 1075 1075 1075 1045 1170 1350 1550 1800 1815 1815 1815 1815 1815 Coordinate -630 -450 -270
-280 -460 -640 -820 -1000 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045 -1045
-1045 -1045 -1045 -1045 -850 -670 -490 -310 -130 1030 1075 1075 1075 1075 1075
1075 1075 1075
Figure HCD44100R
Chip Shipment Products
HD44102D
Chip size Coordinate: Origin: size 5.40 6.16 center Chip center
Type code
(Unit:
Name
Coordinate 2890 2890 2465 2215 1965 1715 1465 1215 -285 -535 -785 -1035 -1285 -1535 -1785 -2035 -2285 -2890 -2890 -2890 -2890
Name
Coordinate -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2890 -2605 -2365 -2125 -1885 -1645 -1405 -1165 -880 -600 -330
Name
Coordinate 1050 1320 1560 1800 2040 2815 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890 2890
-2130 -2465 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2515 -2155 -1865 -1635 -1405
-1175 -945 -715 -480 -255 1160 1410 1640 1930 2245 2515 2515 2515 2515 2515 2515 2515 2515 2515 2515 2515 2515
2515 2515 2515 2515 2515 2515 2515 2515 2070 1835 1600 1365 1135 -340 -605 -850 -1100 -1350 -1600 -1845
Figure HD44102D
Chip Shipment Products
HD44105D
Chip size Coordinate: Origin: size
4.56 6.00 center Chip center
Type code HD44105
(Unit: Coordinate Name -575 -875 -1175 -1475 -1775 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 -2105 2822 2822 2822 2822 2822 2372 2047 1732 1417 1102 -208 -438 -668 -898 -1128 -1358 Coordinate Name -2105 -2105 -2105 -2105 -2005 -1770 -1460 -1010 -605 -265 1290 1730 2105 2105 2105 2105 2105 2105 -1628 -2053 -2363 -2593 -2822 -2822 -2822 -2822 -2822 -2822 -2822 -2822 -2822 -2308 -2078 -1848 -1610 -1388 -1138 Coordinate Name 2105 2105 2105 2105 2105 2105 2105 2105 2105 2105 2105 2105 2105 1855 1555 1255 -833 -528 -223 1002 1307 1587 1867 2147 2427 2707 2822 2822 2822 2822 2822 2822
Figure HD44105D
Chip Shipment Products
HCD44780U***
Chip size 4.90 4.90 Coordinate: center Origin: Chip center size aperture area bonding
Type code HD44780U
(Unit: Coordinate Name COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 -941 -623 -304 1022 1204 1454 1684 2070 2260 2290 2290 2290 2290 2313 2313 2313 2313 2313 2313 2313 2313 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2290 -2099 -1883 -1667 -1452 -1186 -970 -755 -539 -323 -108 Coordinate Name COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 SEG40 SEG39 SEG38 SEG37 SEG36 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 2313 2313 2313 2313 2313 2313 2313 2313 2296 2100 1617 1401 1186 -108 -323 -539 -755 -970 -1186 -1401 -1617 1186 1401 1617 1833 2095 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313 2313
Coordinate Name SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 OSC1 OSC2 -2100 -2280 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2313 -2280 -2080 -1749 -1550 -1268 2313 2313 2089 1833 1617 1401 1186 -108 -323 -539 -755 -970 -1186 -1401 -1617 -1833 -2073 -2290 -2290 -2290 -2290 -2290
Figure HCD44780U***
Chip Shipment Products
HCD66702R***, HCD66702R***L
Chip size Coordinate: Origin: size 5.20 5.20 center Chip center
Type code
HD66702
Name SEG34 SEG33 SEG32 SEG31 SEG30 SEG29 SEG28 SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 Coordinate 2350 2205 2065 1925 1790 1655 1525 1395 1265 1135 1005 -165 -295 -425 -555 -685 -815 -945 -1075 -1205
(Unit: Name SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 OSC2 OSC1 TEST Coordinate -1335 -1465 -1600 -1735 -1870 -2010 -2180 -2325 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 Name COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 SEG100 SEG99 SEG98 SEG97 SEG96 SEG95 Coordinate -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2290 -2145 -2005 -1865 -1730 -1595 -1465 -1335 -1205 -1075 -945 -815
-2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475
-2475 -2475 -2475 -2475 -2475 -2475 -2475 -2475 -2445 -2305 -2165 -2025 -1875 -1745 -1595 -1465 -1335 -1185 -1055 -905 -775 -625 -495 -345 -195
1075 1205 1335 1465 1595 1725 1855 1990 2125 2265 2410 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475
Figure HCD66702R***, HCD66702R***L
Chip Shipment Products
HCD66702R***, HCD66702R***L
(Unit: Name SEG94 SEG93 SEG92 SEG91 SEG90 SEG89 SEG88 SEG87 SEG86 SEG85 SEG84 SEG83 SEG82 SEG81 SEG80 Coordinate -685 -555 -425 -295 -165 1005 1135 1265 1395 1525 1655 1790 Name SEG74 SEG73 SEG72 SEG71 SEG70 SEG69 SEG68 SEG67 SEG66 SEG65 SEG64 SEG63 SEG62 SEG61 SEG60 SEG59 SEG58 SEG57 SEG56 SEG55 Coordinate 1925 2065 2205 2350 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 Name SEG54 SEG53 SEG52 SEG51 SEG50 SEG49 SEG48 SEG47 SEG46 SEG45 SEG44 SEG43 SEG42 SEG41 SEG40 SEG39 SEG38 SEG37 SEG36 SEG35 Coordinate 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475
2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475 2475
2475 2475 2475 2475 2320 2175 2035 1895 1760 1625 1495 1365 1235 1105
-195 -325 -455 -585 -715 -845 -975 -1105 -1235 -1365 -1495 -1625 -1760 -1895 -2035 -2175 -2320
SEG79 SEG78 SEG77 SEG76 SEG75
Figure HCD66702R***, HCD66702R***L
Chip Shipment Products
HCD66710***
Type code Chip size Coordinate: Origin: size 5.36 6.06 center Chip center
Name SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM25 COM26 COM27 COM28 COM29 COM30 COM31 COM32 COM24 COM23 COM22 COM21 Coordinate -2495 2910 -2695 2730 -2695 2499 -2695 2300 -2695 2100 -2695 1901 -2695 1698 -2695 1498 -2695 1295 -2695 1099 -2695 -2695 -2695 -2695 -2695 -2695 -113 -2695 -302 -2695 -501 -2695 -701 -2695 -900 -2695 -1100 -2695 -1303 -2695 -1502 -2695 -1702 -2695 -1901 -2695 -2101 -2695 -2300 -2695 -2500 -2695 -2731 -2495 -2910 -2051 -2910 -1701 -2910 -1498 -2910 -1302 -2910 Name COM20 COM19 COM18 COM17 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 COM33 V5OUT3 V5OUT2 OSC1 OSC2
(Unit: Coordinate -1102 -2910 -899 -2910 -700 -2910 -500 -2910 -301 -2910 -101 -2910 -2910 -2910 -2910 -2910 -2910 1077 -2910 1266 -2910 1488 -2910 1710 -2910 2063 -2910 2458 -2910 2660 -2731 2660 -2500 2660 -2300 2640 -2090 2650 -1887 2675 -1702 2675 -1502 2675 -1303 2675 -1103 2675 -900 2675 -701 2675 -501 2675 -302 2675 2675 2675 Name TEST SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 Coordinate 2675 2675 2675 2675 1099 2675 1299 2675 1502 2695 1698 2695 1901 2695 2104 2695 2300 2695 2503 2695 2730 2495 2910 2049 2910 1699 2910 1499 2910 1300 2910 1100 2910 2910 2910 2910 2910 2910 -101 2910 -301 2910 -500 2910 -700 2910 -899 2910 -1099 2910 -1302 2910 -1501 2910 -1701 2910 -2051 2910
Figure HCD66710***
Chip Shipment Products
HD61202D
Chip size Coordinate: Origin: size Type code 6.08 5.92 center Chip center
Coordinate -2674 2806 -2882 2612 -2882 2400 -2882 2213 -2882 2030 -2882 1838 -2882 1655 -2882 1478 -2882 1258 -2882 1042 -2882 -2882 -2882 -2882 -2882 -2882 -254 -2882 -470 -2882 -686 -2882 -902 -2882 -1118 -2882 -1334 -2882 -1550 -2882 -1766 -2882 -1982 -2882 -2198 -2882 -2414 -2882 -2630 -2802 -2806 -2586 -2806 -2370 -2806 -2034 -2806 -1818 -2806 -1602 -2806 -1386 -2806 Coordinate -1174 -2806 -962 -2806 -750 -2806 -538 -2806 -326 -2806 -114 -2806 -2806 -2806 -2806 -2806 -2806 1178 -2806 1394 -2806 1610 -2806 1826 -2806 2042 -2806 2378 -2806 2590 -2806 2802 -2806 2882 -2630 2882 -2414 2882 -2198 2882 -1982 2882 -1766 2882 -1550 2882 -1334 2882 -1118 2882 -902 2882 -686 2882 -470 2882 -254 2882 2882 2882
(Unit: Name Name VEE1 Coordinate 2882 2882 2882 1042 2882 1258 2882 1490 2882 1670 2882 1847 2882 2030 2882 2213 2882 2400 2882 2618 2514 2806 2262 2806 1922 2806 1670 2806 1330 2806 1078 2806 2806
Name VEE2
-134 -434 -694 -994 -1254 -1554 -1814 -2114 -2374
2806 2806 2806 2806 2806 2806 2806 2806 2806 2806 2806
Figure HD61202D
Chip Shipment Products
HCD66712***
Dummy Dummy Chip size Coordinate: Origin: size 6.00 6.40 center Chip center
Type code HD66712
Dummy
Coordinate -2450 3046 -2650 3046 -2846 2866 -2846 2886 -2846 2340 -2846 2160 -2846 2000 -2846 1840 -2846 1680 -2846 1520 -2846 1360 -2846 1200 -2846 1040 -2846 -2846 -2846 -2846 -2846 -2846 -2846 -2846 -240 -2846 -400 -2846 -560 -2846 -720 -2846 -880 -2846 -1040 -2846 -1200 -2846 -1360 -2846 -1520 -2846 -1680 -2846 -1840 -2846 -2000 -2846 -2160 -2846 -2320
Dummy (Unit:
Name SEG44 SEG45 SEG46 SEG47 SEG48 SEG49 SEG50 SEG51 SEG52 SEG53 SEG54 SEG55 SEG56 SEG57 SEG58 SEG59 SEG60 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM25 COM26 COM27 COM28 COM29 COM30 COM31 COM32 COM33
Name OSC2 OSC1 RESET TEST RS/CS RW/SiD E/SCLK DB0/SOD V5OUT2 V5OUT3
Coordinate -2857 -2697 -2857 -2877 -2650 -3057 -2460 -3057 -2290 -3057 -2130 -3057 -1970 -3057 -1810 -3057 -1650 -3057 -1490 -3057 -1330 -3057 -1170 -3057 -990 -3057 -820 -3057 -650 -3057 -480 -3057 -310 -3057 -140 -3057 -3057 -3057 -3057 -3057 -3057 -3057 1063 -3057 1251 -3035 1426 -3002 1720 -3057 2050 -3057 2250 -3057 2450 -3057 2650 -3057 2877 -2880 2877 -2703
Name COM24 COM23 COM22 COM21 COM20 COM19 COM18 COM17 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 COM0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17
Coordinate 2846 -2320 2846 -2160 2846 -2000 2846 -1840 2846 -1680 2846 -1520 2846 -1360 2846 -1200 2846 -1040 2846 -880 2846 -720 2846 -560 2846 -400 2846 -240 2846 2846 2846 2846 2846 2846 2846 2846 1040 2846 1200 2846 1360 2846 1520 2846 1680 2846 1840 2846 2000 2846 2160 2846 2340 2846 2686 2846 2866 2650 3046 2450 3046
Figure HCD66712***
Chip Shipment Products
HCD66712***
(Unit: Coordinate Name SEG18 2250 3046 SEG19 2070 3046 SEG20 1890 3046 SEG21 1710 3046 SEG22 1530 3046 SEG23 1350 3046 SEG24 1170 3046 SEG25 3046 SEG26 3046 SEG27 3046 Coordinate Name SEG28 3046 SEG29 3046 SEG30 3046 SEG31 3046 SEG32 -270 3046 SEG33 -450 3046 SEG34 -630 3046 SEG35 -810 3046 SEG36 -990 3046 SEG37 -1170 3046 Coordinate Name SEG38 -1350 3046 SEG39 -1530 3046 SEG40 -1710 3046 SEG41 -1890 3046 SEG42 -2070 3046 SEG43 -2250 3046 Dummy -2846 3046 Dummy -2857 -3057 Dummy 2877 -3057 Dummy 2846 3046
Figure HCD66712***
Chip Shipment Products
HCD66720***
Chip size Coordinate: Origin: size
5.60 center Chip center
Type code HD66720
(Unit: Coordinate -1100 -2877 -900 -2877 -700 -2877 -500 -2877 -150 -2853 -2853 -2853 -2853 -2853 1020 -2809 1200 -2809 1400 -2790 1600 -2853 1800 -2809 2000 -2809 2200 -2853 2400 -2853 2653 -2700 2653 -2500 2653 -2300 2653 -2100 2653 -1900 2653 -1700 2653 -1500 2653 -1300 2653 -1100 2653 -900 2653 -700 2653 -500 2653 -300 2653 2653 2653 2653 Name KST0 KST1 KST2 KST3 KST4 KST5 KiN0 KiN1 KiN2 KiN3 KiN4 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 Coordinate 2653 2653 2653 1110 2653 1300 2653 1500 2653 1700 2653 1900 2653 2100 2653 2300 2653 2653 2653 2853 2400 2877 1900 2877 1700 2877 1500 2877 1300 2877 1100 2877 2877 2877 2877 2877 2877 -100 2877 -300 2877 -500 2877 -700 2877 -900 2877 -1100 2877 -1300 2877 -1500 2877 -1700 2877 -1900 2877
Name SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43/COM1 SEG44/COM2 SEG45/COM3 SEG46/COM4 SEG47/COM5 SEG48/COM6 SEG49/COM7 SEG50/COM8 COM1/COM9 COM2/COM10 COM3/COM11 COM4/COM12 COM5/COM13
Coordinate -2400 2877 -2677 2700 -2677 2500 -2677 2300 -2677 2100 -2677 1900 -2677 1700 -2677 1500 -2677 1300 -2677 1100 -2677 -2677 -2677 -2677 -2677 -2677 -100 -2677 -300 -2677 -500 -2677 -700 -2677 -900 -2677 -1100 -2677 -1300 -2677 -1500 -2677 -1700 -2677 -1900 -2677 -2100 -2677 -2300 -2677 -2677 -2677 -2877 -2400 -2877 -1900 -2877 -1700 -2877 -1500 -2877 -1300 -2877
Name COM6/COM14 COM7/COM15 COM8/COM16 COMS V5OUT3 V5OUT2 OSC1 OSC2 SCLK RESET* TEST2 TEST1 LED0 LED1 iRQ*
Figure HCD66720***
Chip Shipment Products
HCD66730***
Chip size Coordinate: Origin: size 7.48 6.46 center Chip center
HD66730
Type code
(Unit: Name SEG68 SEG69 SEG70 SEG71 RESET* OSC2 OSC1 SEGD RW/SID RS/CS* E/SCLK DB0/SOD V5OUT2 V5OUT3 Coordinate -3522 -2984 -3160 -2984 -2860 -2984 -2660 -2984 -2435 -2984 -2233 -2984 -2063 -2984 -1859 -2984 -1689 -2984 -1519 -2984 -1349 -2984 -1179 -2984 -975 -2984 -771 -2984 -567 -2984 -363 -2984 -146 -2984 -2984 -2984 -2984 -2984 -2984 1154 -2984 1371 -2984 1533 -2984 1730 -2959 1896 -2959 2057 -2959 2219 -2959 2478 -2959 2782 -2984 3016 -2984 3253 -2984 3522 -2984 Name COM25/D COM24 COM23 COM22 COM21 COM20 COM19 COM18 COM17 COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 COMS SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 Coordinate 3522 -2806 3522 -2626 3522 -2445 3522 -2265 3522 -2085 3522 -1855 3522 -1625 3522 -1444 3522 -1264 3522 -1084 3522 -854 3522 -624 3522 -443 3522 -263 3522 3522 3522 3522 3522 3522 3522 3522 1178 3522 1409 3522 1639 3522 1819 3522 1999 3522 2179 3522 2410 3522 2590 3522 2819 3522 3012 3222 3012 2942 3012 2662 3012
Name SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43 SEG44 SEG45 SEG46 SEG47 SEG48 SEG49 SEG50 SEG51 SEG52 SEG53 SEG54 SEG55 SEG56 SEG57 SEG58 SEG59 SEG60 SEG61 SEG62 SEG63 SEG64 SEG65 SEG66 SEG67
Coordinate -2602 3012 -2984 3012 -3263 3012 -3522 3012 -3522 2782 -3522 2582 -3522 2341 -3522 2161 -3522 1981 -3522 1801 -3522 1621 -3522 1440 -3522 1260 -3522 1030 -3522 -3522 -3522 -3522 -3522 -3522 -101 -3522 -281 -3522 -462 -3522 -642 -3522 -822 -3522 -1002 -3522 -1182 -3522 -1363 -3522 -1543 -3522 -1723 -3522 -1939 -3522 -2183 -3522 -2364 -3522 -2544 -3522 -2774
Figure HCD66730***
Chip Shipment Products
HCD66730***
(Unit: Coordinate Name SEG8 2332 3012 SEG9 2152 3012 SEG10 1972 3012 SEG11 1791 3012 SEG12 1611 3012 SEG13 1431 3012 SEG14 1251 3012 SEG15 1071 3012 SEG16 3012 Coordinate Name SEG17 3012 SEG18 3012 SEG19 3012 SEG20 3012 SEG21 3012 SEG22 -191 3012 SEG23 -371 3012 SEG24 -551 3012 SEG25 -731 3012 Coordinate Name SEG26 -912 3012 SEG27 -1092 3012 SEG28 -1272 3012 SEG29 -1452 3012 SEG30 -1632 3012 SEG31 -1813 3012 SEG32 -1993 3012 SEG33 -2173 3012
Figure HCD66730***
Chip Shipment Products
HD61203D
Chip size Coordinate: Origin: size 5.18 5.18 center Chip center
Type code
Coordinate Name -1928 2440 -2103 2440 -2278 2440 -2440 2224 -2440 2049 -2440 1874 -2440 1699 -2440 1524 -2440 1349 -2440 1174 -2440 -2440 -2440 -2440 -2440 -2440 -2440 -2440 -234 -2440 -409 -2440 -587 -2440 -762 -2440 -937 VEE1 -2440 -1112 -2440 -1287 -2440 -1462 -2440 -1701 -2440 -1876 -2440 -2052 -2248 -2440 -1944 -2440 -1736 -2440 -1520 -2440 -1192 -2440 Coordinate Name -904 -2440 -572 -2440 -372 -2440 -172 -2440 -2440 -2440 -2440 -2440 1232 -2440 1568 -2440 1868 -2440 2268 -2440 2440 -1980 2440 -1804 2440 -1549 2440 -1374 VEE2 2440 -1199 2440 -1024 2440 -849 2440 -674 2440 -499 2440 -324 2440 -149 2440 2440 2440 2440
(Unit: Coordinate Name 2440 2440 2440 1087 2440 1262 2440 1437 2440 1612 2440 1787 2440 1962 2440 2137 2440 2312 2265 2440 2090 2440 1809 2440 1634 2440 1459 2440 1284 2440 1102 2440 2440 2440 2440 2440 2440 2440 -230 2440 -405 2440 -580 2440 -767 2440 -942 2440 -1117 2440 -1292 2440 -1483 2440 -1658 2440
Figure HD61203D
Chip Shipment Products
HD66100D
Chip size Coordinate: Origin: size 4.50 4.50 center Chip center
Type code
Coordinate Name -880 -2100 -720 -2100 -470 -2100 -270 -2100 -2100 -2100 -2100 -2100 -2100 1725 -2100 1925 -2100 2100 -2060 2100 -1865 2100 -1690 2100 -1520 2100 -1360 2100 -1200 2100 -1040 2100 -880 2100 -720 2100 -560 2100 -400 2100 -240 2100 2100 2100 2100
(Unit: Coordinate Name 2100 2100 2100 2100 1040 2100 1200 2100 1360 2100 1520 2100 1690 2100 1865 2100 2060 1925 2100 1725 2100 1520 2100 1360 2100 1200 2100 1040 2100 2100 2100 2100 2100 2100 2100 2100 -240 2100 -400 2100 -560 2100 -720 2100 -880 2100 -1040 2100 -1200 2100 -1360 2100 -1520 2100
Coordinate Name -1725 2100 -1925 2100 -2100 2060 -2100 1865 -2100 1690 -2100 1520 -2100 1360 -2100 1200 -2100 1040 -2100 -2100 -2100 -2100 -2100 -2100 -2100 -2100 -240 -2100 -400 -2100 -560 -2100 -720 -2100 -880 -2100 -1040 -2100 -1200 -2100 -1360 -2100 -1520 -2100 -1690 -2100 -1865 -2100 -2060 -1925 -2100 -1725 -2100 -1520 -2100 -1360 -2100 -1200 -2100 -1040 -2100
Figure HD66100D
Chip Shipment Products
HD66106D
Type code
Chip size Coordinate: Origin: size 4.84 5.16 center Chip center
(Unit: Name VLCD2 Coordinate -963 -2430 -780 -2430 -604 -2430 -428 -2430 -235 -2430 -2430 -2430 -2430 -2430 -2430 -2430 1109 -2430 1300 -2430 1484 -2430 1668 -2430 2025 2210 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 2270 -2430 -2430 -2188 -2013 -1838 -1663 -1488 -1313 -1138 -963 -788 -613 -438 -263 Name Coordinate 2270 2270 2270 2270 1138 2270 1313 2270 1488 2270 1663 2270 1838 2270 2013 2270 2188 2210 2430 2025 2430 1663 2430 1488 2430 1313 2430 1138 2430 2430 2430 2430 2430 2430 2430 2430 -263 2430 -438 2430 -613 2430 -788 2430 -963 2430 -1138 2430 -1313 2430 -1488 2430 -1663 2430
Name VLCD1
Coordinate -2025 2430 -2210 2430 -2270 2188 -2270 2013 -2270 1838 -2270 1663 -2270 1488 -2270 1313 -2270 1138 -2270 -2270 -2270 -2270 -2270 -2270 -2270 -2270 -263 -2270 -438 -2270 -613 -2270 -788 -2270 -963 -2270 -1138 -2270 -1313 -2270 -1488 -2270 -1663 -2270 -1838 -2270 -2013 -2270 -2188 -2210 -2430 -2025 -2430 -1663 -2430 -1488 -2430 -1313 -2430 -1138 -2430
Figure HD66106D
Chip Shipment Products
HCD66204
Chip size Coordinate: Origin: size 3.80 4.60 center Chip center
Type code
Coordinate Name -1748 2150 -1750 1940 -1750 1770 -1750 1615 -1750 1470 -1750 1325 -1750 1180 -1750 1035 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -125 -1750 -270 -1750 -415 -1750 -560 -1750 -705 -1750 -850 -1750 -995 -1750 -1140 -1750 -1285 -1750 -1430 -1750 -1575 -1750 -1720 -1750 -1865 -1750 -2110 -1610 -2150 -1434 -2150 -1232 -2150 -1092 -2150 (Unit: Coordinate Name -952 -2150 -812 -2150 -652 -2150 -438 -2150 -250 -2150 DISPOFF -2150 -2150 -2150 -2150 -2150 -2150 1002 -2150 1150 -2150 1458 -2150 1750 -2150 1750 -1930 1750 -1760 1750 -1605 1750 -1460 1750 -1315 1750 -1170 1750 -1025 1750 -860 1750 -715 1750 -570 1750 -425 1750 -280 1750 -135 1750 1750 1750 1750 1750 Coordinate Name 1750 1750 1750 1025 1750 1170 1750 1315 1750 1460 1750 1605 1750 1750 1750 1900 1750 2120 1610 2150 1432 2150 1273 2150 1114 2150 2150 2150 2150 2150 2150 2150 2150 -158 2150 -317 2150 -476 2150 -635 2150 -794 2150 -953 2150 -1112 2150 -1271 2150 -1430 2150 -1589 2150
Figure HCD66204
Chip Shipment Products
HCD66205
Chip size Coordinate: Origin: size 3.80 4.60 center Chip center
Type code
Coordinate Name -1748 2150 -1750 1940 -1750 1770 -1750 1615 -1750 1470 -1750 1325 -1750 1180 -1750 1035 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -125 -1750 -270 -1750 -415 -1750 -560 -1750 -705 -1750 -850 -1750 -995 -1750 -1140 -1750 -1285 -1750 -1430 -1750 -1575 -1750 -1720 -1750 -1865 -1750 -2110 -1610 -2150 -1294 -2150 (Unit: Coordinate Name -1042 -2150 -842 -2150 -644 -2150 -444 -2150 DISPOFF -222 -2150 -2150 -2150 -2150 -2150 1010 -2150 1274 -2150 1750 -2150 1750 -1930 1750 -1760 1750 -1605 1750 -1460 1750 -1315 1750 -1170 1750 -1025 1750 -860 1750 -715 1750 -570 1750 -425 1750 -280 1750 -135 1750 1750 1750 1750 1750 1750 Coordinate Name 1750 1750 1025 1750 1170 1750 1315 1750 1460 1750 1605 1750 1750 1750 1900 1750 2120 1610 2150 1432 2150 1273 2150 1114 2150 2150 2150 2150 2150 2150 2150 2150 -158 2150 -317 2150 -476 2150 -635 2150 -794 2150 -953 2150 -1112 2150 -1271 2150 -1430 2150 -1589 2150
Figure HCD66205
Chip Shipment Products
HCD66204L
Chip size Coordinate: Origin: size 3.80 4.60 center Chip center
Type code
Coordinate -1748 2150 -1750 1940 -1750 1770 -1750 1615 -1750 1470 -1750 1325 -1750 1180 -1750 1035 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -125 -1750 -270 -1750 -415 -1750 -560 -1750 -705 -1750 -850 -1750 -995 -1750 -1140 -1750 -1285 -1750 -1430 -1750 -1575 -1750 -1720 -1750 -1865 -1750 -2110 -1610 -2150 -1434 -2150 -1232 -2150 -1092 -2150 (Unit: Name DISPOFF Coordinate -952 -2150 -812 -2150 -652 -2150 -438 -2150 -250 -2150 -2150 -2150 -2150 -2150 -2150 -2150 1002 -2150 1150 -2150 1458 -2150 1750 -2150 1750 -1930 1750 -1760 1750 -1605 1750 -1460 1750 -1315 1750 -1170 1750 -1025 1750 -860 1750 -715 1750 -570 1750 -425 1750 -280 1750 -135 1750 1750 1750 1750 1750 Name Coordinate 1750 1750 1750 1025 1750 1170 1750 1315 1750 1460 1750 1605 1750 1750 1750 1900 1750 2120 1610 2150 1432 2150 1273 2150 1114 2150 2150 2150 2150 2150 2150 2150 2150 -158 2150 -317 2150 -476 2150 -635 2150 -794 2150 -953 2150 -1112 2150 -1271 2150 -1430 2150 -1589 2150
Name
Figure HCD66204L
Chip Shipment Products
HCD66205L
Chip size Coordinate: Origin: size 3.80 4.60 center Chip center
Type code
Coordinate -1748 2150 -1750 1940 -1750 1770 -1750 1615 -1750 1470 -1750 1325 -1750 1180 -1750 1035 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -1750 -125 -1750 -270 -1750 -415 -1750 -560 -1750 -705 -1750 -850 -1750 -995 -1750 -1140 -1750 -1285 -1750 -1430 -1750 -1575 -1750 -1720 -1750 -1865 -1750 -2110 -1610 -2150 -1294 -2150 (Unit: Name Name DISPOFF Coordinate -1042 -2150 -842 -2150 -644 -2150 -444 -2150 -222 -2150 -2150 -2150 -2150 -2150 1010 -2150 1274 -2150 1750 -2150 1750 -1930 1750 -1760 1750 -1605 1750 -1460 1750 -1315 1750 -1170 1750 -1025 1750 -860 1750 -715 1750 -570 1750 -425 1750 -280 1750 -135 1750 1750 1750 1750 1750 1750 Name Coordinate 1750 1750 1025 1750 1170 1750 1315 1750 1460 1750 1605 1750 1750 1750 1900 1750 2120 1610 2150 1432 2150 1273 2150 1114 2150 2150 2150 2150 2150 2150 2150 2150 -158 2150 -317 2150 -476 2150 -635 2150 -794 2150 -953 2150 -1112 2150 -1271 2150 -1430 2150 -1589 2150
Figure HCD66205L
Reliability Quality Assurance
Views Quality Reliability
Hitachi's basic quality aims meet individual user's purchase purpose quality required, satisfactory quality level considering general marketability. Quality required users specifically clear contract specification provided. not, quality required always definite. both cases, Hitachi tries assure reliability that semiconductor devices delivered perform their function actual operating circumstances. realize this quality manufacturing process, points should establish quality control system process enhance quality ethic. addition, quality required users semiconductor devices going toward higher levels performance electronic system market increasing expanding size application fields. cover situation, Hitachi performing following: Building reliability design stage product development. Building quality sources manufacturing process. Executing stricter inspection reliability confirmation final products. Making quality levels higher with field data feedback. Cooperating with research laboratories higher quality reliability. With views methods mentioned above, utmost efforts made meet users' requirements. design, manufacture, inner process quality control, screening test method, etc. into consideration, considering operating circumstances equipment semiconductor device used reliability target system, derating applied design, operating condition, maintenance, etc. Reliability Design achieve reliability required based reliability targets, timely study execution design standardization, device design (including process design, structure design), design review, reliability test essential. 2.2.1 Design Standardization Establishment design rules, standardization parts, material process necessary. establish design rules, critical quality reliability items always studied circuit design, device design, layout design, etc. Therefore, long standardized process, material, etc. used, reliability risk extremely small even newly developed devices, except cases where special functions needed. 2.2.2 Device Design important device design consider total balance process design, structure design, circuit layout design. Especially when processes materials employed, careful technical study executed prior device development. 2.2.3 Reliability Evaluation Test Site Test site sometimes called test pattern. useful method design process reliability evaluation LSIs which have complicated functions. Purposes test site are: Marking fundamental failure mode clear Analysis relation between failure mode manufacturing process condition Search failure mechanism analysis Establishment point manufacturing
Reliability Design Semiconductor Devices
Reliability Targets reliability target important factor manufacture sales well performance price. practical rate reliability targets with failure rates under certain common test conditions. reliability target determined corresponding character equipment taking
Reliability Quality Assurance
Evaluation test site effective because: Common fundamental failure mode failure mechanism devices evaluated. Factors dominating failure mode picked comparison made with processes that have been experienced field. Relation between failure causes manufacturing factors analyzed. Easy tests. Etc. Design Review Design review organized method confirm that design satisfies required performance (including users') that design work follows specified methods, whether improved technical items accumulated test data individual major fields field data effectively built addition, from standpoint enhancement competitive power products, major purpose design review ensure quality reliability products. Hitachi, design reviews preformed from planning stage products even design changed products. Items discussed determined design review follows: Description products based specified design documents. From standpoint specialties individual participants, design documents studied, unclear matter found, calculation, experiments, investigation, etc. will carried out. Determine contents reliability methods, etc. based design documents drawings. Check process ability manufacturing line achieve design goal. Discussion about preparation production. Planning execution subprograms design changes proposed individual specialists, tests, experiments calculation confirm design changes. Reference past failure experiences with similar devices, confirmation methods prevent them, planning execution test programs confirmation them. These studies decisions made using check lists made individually depending objects.
Quality Assurance System Semiconductor Devices
Activity Quality Assurance General views overall quality assurance Hitachi are: Problems individual process should solved process. Therefore, final product stage, potential failure factors have been already removed. Feedback information should used ensure satisfactory level process capability. assure required reliability result items mentioned above purpose quality assurance. following discusses device design, quality approval mass production, inner process quality control, product inspection reliability tests. Quality Approval ensure required quality reliability, quality approval carried trial production stage device design mass production stage based reliability design described section Hitachi's views quality approval are: third party must perform approval objectively from standpoint customers. Fully consider past failure experiences information from field. Approval needed design change work change. Intensive approval executed parts material process. Study process capability variation factor, control points mass production stage. Considering views mentioned above, figure shows quality approval performed. Quality Reliability Control Mass Production quality assurance products mass production, quality control execution divided organically function between manufacturing
Reliability Quality Assurance
department quality assurance department, other related departments. total function flow shown figure main points described below. 3.3.1 Quality Control Parts Material performance reliability semiconductor devices improve, importance quality control material parts (crystal, lead frame, fine wire wire bonding, package) build products, materials needed manufacturing process (mask pattern chemicals) increases. Besides quality approval parts materials stated section 3.2, incoming inspection also quality control other activities quality assurance follows: Outside vendor technical information meeting Approval outside vendors, guidance outside vendors Physical chemical analysis test typical check points parts materials shown table parts materials. incoming inspection performed based incoming inspection specification, following purchase specification drawings, sampling inspection executed based mainly MIL-STD-105D.
Step
Target specification Design trial production
Contents
Design review
Purpose
Materials, parts approval
Characteristics materials parts Appearance Dimension Heat resistance Mechanical Electrical Others Electrical characteristics Function Voltage Current Temperature Others Appearance, dimension Reliability test Life test Thermal stress Moisture resistance Mechanical stress Others Reliabilty test Process check (same quality approval (1))
Confirmation characteristics reliability materials parts
Characteristics approval
Confirmation target spec. (mainly electrical characteristics)
Quality approval
Confirmation quality reliability design
Quality approval Mass production
Confirmation quality reliability mass production
Figure Quality Approval Flowchart
Reliability Quality Assurance
3.3.2 Inner Process Quality Control Inner process quality control performs very important function quality assurance semiconductor devices. following description control semifinal products, final products, manufacturing facilities, measuring equipments, circumstances submaterials. quality control manufacturing process shown figure corresponding manufacturing process. Quality control semifinal products final production products Potential failure factors semiconductor devices should removed manufacturing process. achieve this, check points setup each process, products that have potential failure factors transferred next
Process
Quality control
Method
Material, parts Material, parts
Inspection material parts
Inspection material parts semiconductor devices
sampling confirmation quality level
Manufacturing
Manufacturing equipment, environment, submaterial, worker control
Confirmation quality level
Screening
Inner process quality control
sampling confirmation quality level
100% inspection
100% inspection appearance electrical characteristics
Testing inspection
Products Products inspection
Sampling inspection appearance electrical characteristics
sampling
assurance test
Reliability test
Confirmation quality level, sampling
Receiving Feedback information Shipment Quality information Claim Field experience General quality Information
Customer
Figure Flowchart Quality Control Manufacturing Process
Reliability Quality Assurance
process. high reliability semiconductor devices, especially manufacturing line carefully selected, quality control manufacturing process tightly executed: Strict check each process each lot, 100% inspection remove failure factor caused manufacturing variation, necessary screening, such high temperature aging temperature cycling. Contents inner process quality control are: Condition control individual equipment workers, sampling check semifinal products Proposal carrying-out work improvement Education workers Maintenance improvement yield Detection quality problems, execution countermeasures Transmission information about quality Quality control manufacturing facilities measuring equipment Equipment manufacturing semiconductor devices have been developing extraordinarily, with required high performance devices production improvements. They important factors determine quality reliability. Hitachi, automation manufacturing equipment promoted improve manufacturing variation, controls maintain proper operation function high performance equipment. Maintenance inspection quality control performed daily based related specifications, also periodical inspections. inspection, inspection points listed specification checked avoid omissions. During adjustment maintenance measuring equipment, maintenance number specifications checked maintain improve quality.
Reliability Quality Assurance
Table Quality Control Check Points Material Parts (Example)
Material, Parts Wafer Important Control Items Appearance Dimension Sheet resistance Defect density Crystal axis Appearance Dimension Registration Gradation Appearance Dimension Purity Elongation ratio Appearance Dimension Processing accuracy Plating Mounting characteristics Appearance Dimension Leak resistance Plating Mounting characteristics Electrical characteristics Mechanical strength Composition Electrical characteristics Thermal characteristics Molding performance Mounting characteristics Points Check Damage contamination surface Flatness Resistance Defect numbers Defect numbers, scratch Dimension level Uniformity gradation Contamination, scratch, bend, twist Purity level Mechanical strength Contamination, scratch Dimension level Bondability, solderability Heat resistance Contamination, scratch Dimension level Airtightness Bondability, solderability Heat resistance Mechanical strength Characteristics plastic material
Mask
Fine wire wire bonding
Frame
Ceramic package
Plastic
Molding performance Mounting characteristics
Reliability Quality Assurance
Process
Purchase material Wafer Surface oxidation Inspection surface oxidation Photo resist Inspection photo resist level check Diffusion Inspection diffusion level check Evaporation Inspection evaporation level check Wafer inspection Inspection chip electrical characteristics Chip scribe Inspection chip appearance judgement Frame Assembling Assembling Appearance after chip bonding Appearance after wire bonding Pull strength, compression width, shear strength Appearance after assembling Quality check chip bonding Quality check wire bonding Prevention open short Wafer Chip Thickness, characteristics Electrical characteristics Appearance chip Prevention cracks, quality assurance scribe Evaporation Diffusion Diffusion depth, sheet resistance Gate width Characteristics oxide film, breakdown voltage Thickness vapor film, scratch, contamination Photo resist Dimension, appearance Dimension level Check photo resist Diffusion status Control basic parameters (VTH, etc.) cleanness surface Prior check Breakdown voltage check Assurance standard thickness Wafer Oxidation Appearance, thickness oxide film Characteristics, appearance Scratch, removal crystal defect wafer Assurance resistance Pinhole, scratch
Control Point
Purpose Control
level check Inspection after assembling judgement Package Sealing level check Final electrical inspection Failure analysis Appearance inspection Sampling inspection products Receiving Shipment Sealing Marking
Appearance after sealing Outline, dimension Marking strength
Guarantee appearance dimension
Analysis failures, failure mode, mechanism
Feedback analysis information
Figure Example Inner Process Quality Control
Reliability Quality Assurance
Customer Claim (failures, information) Sales dept. Sales engineering dept.
Failure analysis Quality assurance dept.
Manufacturing dept.
Design dept.
Countermeasures, execution countermeasures
Report
Quality assurance dept.
Follow-up confirmation countermeasure execution
Report
Sales engineering dept. Reply
Customer
Figure Process Flowchart Field Failure
Reliability Test Data Drivers
Introduction
liquid crystal displays with microcomputer application systems been increasing, because their power consumption, freedom display pattern design, thin shape. power consumption high density packaging have been achieved through CMOS process flat plastic packages, respectively. This chapter describes reliability quality assurance data Hitachi driver LSIs based test data failure analysis results.
Chip Package Structure
Hitachi driver family uses power CMOS technology flat plastic package. Si-gate process used high reliability high density. Chip structure basic circuit shown figure package structure shown figure
Gate Chip Bonding wire Plastic
P-Well
Lead
SiO2 Source FET2
Drain
Figure Package Structure
FET1 FET2 N-channel EMOS P-channel EMOS
Figure Chip Structure Basic Circuit
Reliability Test Data Drivers
Reliability Test Results
test results driver family shown tables
Table Test Result High Temperature Operation 125°C,
Device HD44100H HD44102H HD44103H HD44780U HD66100F HD61100A HD61102 HD61103A HD61200 HD61202 HD61203 HD61830 HD61830B HD63645 HD64645 HD61602 HD61603 HD61604 HD61605 HD66840 Sample Size Component Hour 40,000 40,000 40,000 90,000 45,000 80,000 50,000 50,000 40,000 50,000 40,000 40,000 40,000 32,000 32,000 38,000 32,000 32,000 32,000 45,000 Failure
Table Test Result
Test Item High temp, storage temp, storage Steady state humidity Steady state humidity, biased Pressure cooker Note: Aluminum corrosion Test Condition 150°C, 1000 -55°C, 1000 65°C, 1000 85°C, 1000 121°C, atm. Sample Size Component Hour 180,000 140,000 860,000 170,000 20,000 Failure
Reliability Test Data Drivers
Table Test Results
Test Items Thermal shock Temperature cycling Soldering heat Resistance Solderability Test Condition 100°C cycles -55°C 150°C cycles 260°C, seconds 215°C, seconds 230°C, seconds Sample Size Failure
Quality Data from Field
Field failure rate estimated advance through production process evaluation reliability tests. Past field data similar devices provides basis this estimation. Quality information from users indispensable improvement product quality. Therefore, field data products delivered users followed carefully. basis information furnished user, failure analysis conducted results quickly back design production divisions. Failure analysis results LSIs returned Hitachi shown figure
Damaged excessive voltage and/or current (26.7%) Good devices (38.8%) Sample size 3,873
Assembly (3.1%) Marginal 14.5% Poor functional test pattern (3.1%)
Others 13.8%
Figure Failure Analysis Result
Reliability Test Data Drivers
Precautions
Storage preferable store semiconductor devices following ways prevent deterioration their electrical characteristics, solderability, appearance, breakage. Store ambient temperature 30°C, relative humidity 60%. Store clean environment, free from dust reactive gas. Store container that does induce static electricity. Store without physical load. semiconductor devices stored long time, store them unfabricated form. their lead wires formed beforehand, bent parts corrode during storage. chips unsealed, store them cool, dry, dark, dustless place. Assemble them within days after unpacking. Storage nitrogen desirable. They stored days less nitrogen with point -30°C lower. Unpackaged devices must stored over months. Take care allow condensation during storage rapid temperature changes. Transportation with storage methods, general precautions other electronic component parts applicable transportation semiconductors, semiconductor-incorporating units other similar systems. addition, following considerations must taken, too: containers jugs which will induce static electricity result vibration during transportation. desirable electrically conductive container aluminium foil. Prevent device breakage from clothes-induced static electricity. When transporting printed circuit boards which semiconductor devices mounted, suitable preventive measures against static electricity induction must taken; example, voltage built-up prevented shorting terminal circuit. When conveyor belt used, prevent conveyor belt from being electrically charged applying some surface treatment. When transporting semiconductor devices printed circuit boards, minimize mechanical vibration shock. Handling Measurement Avoid static electricity, noise, surge voltage when measuring semiconductor devices measured. possible prevent breakage shorting their terminal circuits equalize electrical potential during transportation. However, when devices measured mounted, their terminals left open providing possibility that they accidentally touched worker, measuring instrument, work bench, soldering iron, conveyor belt, etc. device will fail touches something that leaks current static charge. Take care allow curve tracers, synchroscopes, pulse generators, D.C. stabilizing power supply units, etc. leak current through their terminals housings. Especially, while testing devices, take care apply surge voltage from tester, attach clamping circuit tester, apply abnormal voltage through contact from current source. During measurement, avoid miswiring short-circuiting. When inspecting printed circuit board, make sure that there soldering bridge foreign matter before turning power switch. Since these precautions depend upon types semiconductor devices, contact Hitachi further
Flat Plastic Package (QFP) Mounting Methods
Surface Mounting Package Handling Precautions
Package Temperature Distribution most common method used mounting surface mounting device infrared reflow. Since package made black epoxy resin, portion package directly exposed infrared heat source will absorb heat faster thus rise temperature more quickly than other parts package unless precautions taken. shown example figure surface directly facing infrared heat source 30°C higher than leads being soldered 50°C higher than bottom package. soldering performed under these conditions, package cracks occur. avoid this type problem, recommended that aluminum infrared heat shield placed over resin surface package. using 2-mm thick aluminum heat shield, bottom surfaces resin held 175°C when peak temperature leads 240°C. Package Moisture Absorption epoxy resin used plastic packages will absorb moisture stored high-humidity environment. this moisture absorption becomes excessive, there will sudden vaporization during soldering, causing interface resin lead frame spread apart. extreme cases, package cracks will occur. Therefore, especially thin packages, important that moisture-proof storage used. remove moisture absorbed during transportation, storage, handling, recommended that package baked 125°C hours before soldering. Heating Cooling method soldering electrical parts solder method, compared reflow method, rate heat transmission order magnitude higher. When this method used with plastic items, there thermal shock resulting package cracks deterioration moistureresistant characteristics. Thus, recommended that solder method used. Even with reflow method, excessive rate heating cooling undesirable. rate temperature change less than 4°C/sec recommended. Package Contaminants recommended that resin-based flux used during soldering. Acid-based fluxes have tendency leaving acid residue which adversely affects product reliability. Thus, acidbased fluxes should used. With resin-based fluxes well, residue left behind, leads other package parts will begin corrode. Thus, flux must thoroughly washed away. cleansing solvents used wash away flux left package extended perio
Other recent searches
TDA7300 - TDA7300 TDA7300 Datasheet
TDA7300D - TDA7300D TDA7300D Datasheet
MCP111 - MCP111 MCP111 Datasheet
MCP112 - MCP112 MCP112 Datasheet
LT9831-81 - LT9831-81 LT9831-81 Datasheet
LPC1768 - LPC1768 LPC1768 Datasheet
CRO2150A - CRO2150A CRO2150A Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
