Land Pattern Recommendations following land pattern recommendatio
|
|
|
Top Searches for this datasheet
Land Pattern Recommendations
Land Pattern Recommendations
following land pattern recommendations provided guidelines board layout assembly purposes. These recommendations cover following National Semiconductor packages: PLCC, PQFP, SOP, SSOP TSOP. SOT-23 (5-Lead) TO-263 5-Lead) packages, refer land patterns shown Physical Dimensions MA05A TS3B TS5B packages, respectively.
Plastic Leaded Chip Carriers (PLCC)
01181101
Lead Count
Lead (mm)
Lead (mm) 10.03 12.57 15.11 17.65 20.19 25.27 30.35
Inner Edge (mm) 6.73 9.27 9.27 14.35 16.89 21.97 27.05
Inner Edge (mm) 6.73 9.27 12.00 14.35 16.89 21.97 27.05
Outer Edge (mm) 10.80 13.34 13.34 18.42 20.96 26.04 31.12
Outer Edge (mm) 10.80 13.34 16.00 18.42 20.96 26.04 31.12
Land Width (mm) 0.63 0.63 0.63 0.63 0.63 0.63 0.63
Body Body Size Size
Lead Lead/Pad Width (mm) 0.53 0.53 0.53 0.53 0.53 0.53 0.53 Pitch (mm) 1.27 1.27 1.27 1.27 1.27 1.27 1.27
(mm) (mm) 8.89 8.89 11.43 11.43 11.43 14.05 16.51 16.51 19.05 19.05 24.13 24.13 29.21 29.21
10.03 12.57 12.57 17.65 20.19 25.27 30.35
2004 National Semiconductor Corporation
MS011811
www.national.com
Land Pattern Recommendations
Plastic Quad Flat Packages (PQFP)
01181102
Size
Size
Lead
(mm)
Lead (mm) 9.29 9.40 13.35 14.15 14.00 18.15 23.80 17.45 23.80 18.30 24.21 32.15 31.45 32.15 32.40 30.60
Width (mm) 0.26 0.27 0.45 0.38 0.38 0.38 0.35 0.30 0.30 0.40 0.30 0.45 0.45 0.38 0.38 0.30
Pitch (mm) 0.50 0.50 0.80 0.65 0.65 0.65 0.80 0.50 0.65 0.65 0.64 0.80 0.80 0.65 0.65 0.50
Inner Edge (mm) 7.50 6.88 10.53 9.08 11.48 13.08 13.50 13.08 13.50 21.28 21.67 27.88 28.03 28.03 29.48 28.08
Inner Edge (mm) 7.50 6.90 10.53 9.08 11.48 13.08 19.50 13.08 19.50 15.28 21.67 27.88 28.03 28.03 29.48 28.08
Outer Edge (mm) 9.78 10.42 14.47 15.17 15.02 19.17 18.50 18.47 18.50 25.32 25.23 33.17 32.47 33.17 33.42 31.62
Outer Edge (mm) 9.78 10.40 14.47 15.17 15.02 19.17 24.50 18.47 24.50 19.32 25.23 33.17 32.47 33.17 33.42 31.62
Land Width (mm) 0.30 0.32 0.55 0.43 0.43 0.43 0.40 0.35 0.35 0.45 0.40 0.55 0.55 0.43 0.43 0.35
Body Body Count Lead
Lead Lead/Pad
(mm) (mm)
9.29 9.40 13.35 14.15 14.00 18.15 17.80 17.45 17.80 24.30 24.21 32.15 31.45 32.15 32.40 30.60
www.national.com
Land Pattern Recommendations
JEDEC Small Outline Shrink Small Outline Packages (SOP SSOP)
01181103
Body Size (in) 0.150 0.150 0.150 0.300 0.300 0.300 0.300 0.300 SSOP 0.150 0.150 0.300 0.300
Lead Count
Shoulder Shoulder (in)
Lead (in) 0.244 0.244 0.244 0.4100 0.4100 0.4100 0.4100 0.4100 0.241 0.241 0.420 0.420
Lead Width (in) 0.020 0.020 0.020 0.0190 0.0190 0.0190 0.0190 0.0190 0.010 0.010 0.012 0.012
Lead/Pad Pitch (in) 0.050 0.050 0.050 0.0500 0.0500 0.0500 0.0500 0.0500 0.025 0.025 0.025 0.025
Inner Edge (in) 0.094 0.094 0.094 0.2800 0.2800 0.2800 0.2800 0.2800 0.145 0.145 0.300 0.300
Outer Edge (in) 0.294 0.294 0.294 0.4600 0.4600 0.4600 0.4600 0.4600 0.281 0.281 0.460 0.460
Width (in) 0.028 0.028 0.028 0.0270 0.0270 0.0270 0.0270 0.0270 0.014 0.014 0.016 0.016
0.170 0.170 0.170 0.3300 0.3300 0.3300 0.3300 0.3300 0.185 0.185 0.340 0.340
www.national.com
Land Pattern Recommendations
EIAJ Small Outline, Shrink Small Outline, Thin Small Outline Packages (SOP, SSOP TSOP)
01181104
Body Size (mm) TYPE 5.300 5.300 5.300 SSOP TYPE 5.300 5.300
Lead Count
Shoulder Shoulder (mm)
Lead (mm) 8.000 8.000 8.000 8.100 8.100 10.500 20.200
Lead Width (mm) 0.400 0.400 0.400 0.400 0.400 0.350 0.250
Lead/Pad Pitch (mm) 1.270 1.270 1.270 0.650 0.650 0.650 0.500
Inner Edge (mm) 5.010 5.010 5.010 5.584 5.584 7.884 17.984
Outer Edge (mm) 9.270 9.270 9.270 9.116 9.116 11.516 21.216
Width (mm) 0.600 0.600 0.600 0.451 0.451 0.452 0.301
6.280 6.280 6.280 6.600 6.600 8.900 19.000
SSOP TYPE 7.500 TSOP TYPE 18.500
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT GENERAL COUNSEL NATIONAL SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that products packing materials meet provisions Customer Products Stewardship Specification (CSP-9-111C2) Banned Substances Materials Interest Specification (CSP-9-111S2) contain ``Banned Substances'' defined CSP-9-111S2.
National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: 180-530 Email: europe.support@nsc.com Deutsch Tel: 9508 6208 English Tel: 2171 Tel: 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560
critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness.
National does assume responsibility circuitry described, circuit patent licenses implied National reserves right time without notice change said circuitry specifications.
Other recent searches
TMS320VC5505 - TMS320VC5505 TMS320VC5505 Datasheet
RP185 - RP185 RP185 Datasheet
REG113 - REG113 REG113 Datasheet
M54HC4053 - M54HC4053 M54HC4053 Datasheet
M464S0924BT1 - M464S0924BT1 M464S0924BT1 Datasheet
LT1249 - LT1249 LT1249 Datasheet
FJC1963 - FJC1963 FJC1963 Datasheet
FJC1308 - FJC1308 FJC1308 Datasheet
AS1110 - AS1110 AS1110 Datasheet
40ST1021E - 40ST1021E 40ST1021E Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
