Multilayer Surface Mount Transient Voltage Surge Suppressors /Title Se

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Multilayer Surface Mount Transient Voltage Surge Suppressors /Title Se

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Multilayer Surface Mount Transient Voltage Surge Suppressors /Title Series) /Subject (Multilayer Surface Mount Transient Voltage Surge Suppressors) /Autho /Keywords (TVS, Transient Suppression, Protection, Automotive, Load Dump, Alternator Field Decay,
Series family Transient Voltage Surge Suppression devices based Harris Multilayer fabrication technology. These components designed suppress variety transient events, including those specified other standards used Electromagnetic Compliance (EMC). Series typically applied protect integrated circuits other components circuit board level. wide operating voltage energy range make Series suitable numerous applications power supply, control signal lines. Series manufactured from semiconducting ceramics providing bidirectional voltage clamping supplied leadless, surface mount form, compatible with modern reflow wave soldering procedures. Harris manufactures other Multilayer Series products. Series data sheet (Harris AnswerFAX, 407-724-7800, #2463) applications. AUML Series automotive applications (AnswerFAX #3387) Quad Array (AnswerFAX #4682).
Features
Leadless 0603, 0805, 1206 1210 Chip Sizes Multilayer Ceramic Construction Technology -55oC 125oC Operating Temperature Range Wide Operating Voltage Range VM(DC) 3.5V 120V Rated Surge Current Rated Energy 1000) Inherent Bidirectional Clamping Plastic Epoxy Packaging Assures Better than 94V-0 Flammability Rating Standard Capacitance Types Available
Applications
Suppression Inductive Switching Other Transient Events Such Surge Voltage Circuit Board Level Protection Components Sensitive 1000-42, MIL-STD-883C Method 3015.7, Other Industry Specifications (See Also Series) Provides On-Board Transient Voltage Protection Transistors Used Help Achieve Electromagnetic Compliance Products Replace Larger Surface Mount Zeners Many Applications
Packaging
SERIES (LEADLESS CHIP)
1-800-4-HARRIS 407-727-9207 Copyright
Harris Corporation 1999
Series
Absolute Maximum Ratings
ratings individual members series, device ratings specifications table. SERIES Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)) Voltage Range (VM(AC)RMS) Transient: Non-Repetitive Surge Current, 8/20µs Waveform, (ITM) Non-Repetitive Surge Energy, 10/1000µs Waveform, (WTM). Operating Ambient Temperature Range (TA) Storage Temperature Range (TSTG) Temperature Coefficient Clamping Voltage (VC) Specified Test Current UNITS
<0.01
%/oC
Device Ratings Specifications
MAXIMUM RATINGS (125oC) MAXIMUM NONREPETITIVE SURGE CURRENT (8/20µs) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) MAXIMUM CLAMPING VOLTAGE NOTED) (8/20µs) SPECIFICATIONS (25oC)
MAXIMUM CONTINUOUS WORKING VOLTAGE
NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC) 16.0 18.5 20.3 20.3 20.3 20.3
TYPICAL CAPACITANCE 1MHz
VM(DC) VM(AC) PART NUMBER V3.5MLA0603 V3.5MLA0805 V3.5MLA0805L V3.5MLA1206 V5.5MLA0603 V5.5MLA0805 V5.5MLA0805L V5.5MLA1206 V9MLA0603 V9MLA0805L V12MLA0805L V14MLA0603 V14MLA0805 V14MLA0805L V14MLA1206
I(A)
W(J)
15.5 15.5 15.5 15.5
11.0 15.9 15.9 15.9 15.9
(pF) 1100 2200 1200 6000 1600 4500 1600
Series
Device Ratings Specifications
(Continued) SPECIFICATIONS (25oC) MAXIMUM CLAMPING VOLTAGE NOTED) (8/20µs)
MAXIMUM RATINGS (125oC) MAXIMUM NONREPETITIVE SURGE CURRENT (8/20µs) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs)
MAXIMUM CONTINUOUS WORKING VOLTAGE
NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC) 28.0 28.0 28.0 28.0 28.0 38.5 38.5 38.5 38.5 66.5 66.5
TYPICAL CAPACITANCE 1MHz
VM(DC) VM(AC) PART NUMBER V18MLA0603 V18MLA0805 V18MLA0805L V18MLA1206 V18MLA1210 V26MLA0603 V26MLA0805 V26MLA0805L V26MLA1206 V26MLA1210 V30MLA0603 V30MLA0805L V30MLA1210 V30MLA1210L V33MLA1206 V42MLA1206 V48MLA1210 V48MLA1210L V56MLA1206 V60MLA1210 V68MLA1206 V85MLA1210 V120MLA1210 NOTES:
I(A)
W(J)
29.5 29.5 29.5 29.5 54.5 54.5
(pF) 1100 1250 1000 1575 1530
suffix capacitance energy version. Contact Sales custom capacitance requirements. Typical leakage 25oC 25µA, maximum leakage 50µA VM(DC). Average power dissipation transients 0603, 0805, 1206 1210 sizes exceed 0.05, 0.10W, 0.10W 0.15W, respectively.
Series Power Dissipation Ratings
PERCENT RATED VALUE
When transients occur rapid succession average power dissipation energy (watt-seconds) pulse times number pulses second. power developed must within specifications shown Device Ratings Characteristics table specific device. Certain parameter ratings must derated high temperatures shown Figure
AMBIENT TEMPERATURE (oC)
FIGURE CURRENT, ENERGY POWER DERATING CURVE
PERCENT PEAK VALUE
VIRTUAL ORIGIN WAVE EXAMPLE: TIME FROM PEAK 8/20µs CURRENT VIRTUAL FRONT TIME 1.25 WAVEFORM: VIRTUAL TIME HALF VALUE VIRTUAL FRONT (IMPULSE DURATION) TIME 20µs VIRTUAL TIME HALF VALUE TIME
FIGURE PEAK PULSE CURRENT TEST WAVEFORM
Series Maximum Transient Characteristic Curves
V30MLA0603 V26MLA0603 V18MLA0603 V14MLA0603
MAXIMUM CLAMPING VOLTAGE
V9MLA0603
V5.5MLA0603
V3.5MLA0603 MAXIMUM CLAMP VOLTAGE
MAXIMUM LEAKAGE 25oC V3.5MLA0603 V30MLA0603 VM(AC) RATING 10µA 100µA 10mA 100mA 100A
100nA
CURRENT
FIGURE V3.5MLA0603 V30MLA0603 MAXIMUM CHARACTERISTIC CURVES
V26MLA0805
MAXIMUM CLAMPING VOLTAGE
V18MLA0805 V14MLA0805 V5.5MLA0805
V3.5MLA0805
MAXIMUM CLAMP VOLTAGE
MAXIMUM LEAKAGE 25oC V3.5MLA0805 V30MLA0805 VM(AC) RATING 10µA 100µA 10mA CURRENT 100mA 100A 1000A
100nA
FIGURE V3.5MLA0805 V26MLA0805 MAXIMUM CHARACTERISTIC CURVES
Series Maximum Transient Characteristic Curves
V30MLA0805L V26MLA0805L V18MLA0805L V14MLA0805L V12MLA0805L MAXIMUM CLAMPING VOLTAGE
(Continued)
V9MLA0805L V5.5MLA0805L V3.5MLA0805L
MAXIMUM CLAMP VOLTAGE MAXIMUM LEAKAGE
25oC V3.5MLA0805L V30MLA0805L VM(AC) RATING 10mA CURRENT 100mA 100A 1000A
100nA
10µA
100µA
FIGURE V3.5MLA0805L V30MLA0805L MAXIMUM CHARACTERISTIC CURVES
1000 V68MLA1206 V56MLA1206 V42MLA1206 V33MLA1206 V26MLA1206 V18MLA1206
25oC V3.5MLA1206 V68MLA1206 VM(AC) RATING
MAXIMUM CLAMPING VOLTAGE
V14MLA1206
V5.5MLA1206 V3.5MLA1206
MAXIMUM LEAKAGE 100nA 10µA 100µA 10mA CURRENT
MAXIMUM CLAMP VOLTAGE 100mA 100A 1000A
FIGURE V3.5MLA1206 V68MLA1206 MAXIMUM CHARACTERISTIC CURVES
Series Maximum Transient Characteristic Curves
1000 25oC V18MLA1210 V120MLA1210 VM(AC) RATING
(Continued)
MAXIMUM CLAMPING VOLTAGE
V120MLA1210 V85MLA1210 V60MLA1210 MAXIMUM LEAKAGE
MAXIMUM CLAMP VOLTAGE
V48MLA1210, V48MLA1210L V30MLA1210, V30MLA1210L V26MLA1210 V18MLA1210 100nA 10µA 100µA 10mA CURRENT 100mA 100A 1000A
FIGURE V18MLA1210 V120MLA1210 MAXIMUM CHARACTERISTIC CURVES
Device Characteristics
current levels, curve multilayer transient voltage suppressor approaches linear (ohmic) relationship shows temperature dependent affect (Figure below maximum working voltage, suppressor high resistance mode (approaching maximum rated working voltage). Leakage currents maximum rated voltage below 50µA, typically 25µA. When clamping transients above 10mA range, multilayer suppressor approaches characteristic. Here, multilayer becomes virtually temperature independent (Figure
SUPPRESSOR VOLTAGE PERCENT VNOM VALUE 25oC
Speed Response
Multilayer Suppressor leadless device. response time limited parasitic lead inductances found other surface mount packaging. response time Zinc Oxide dielectric material less than nanosecond clamp very fast dV/dT events such ESD. Additionally, "real world" applications, associated circuit wiring often greatest factor effecting speed response. Therefore, transient suppressor placement within circuit considered important certain instances.
10-9 10-8 125oC 10-3 10-2
10-7 10-6 10-5 10-4 SUPPRESSOR CURRENT (ADC)
FIGURE TYPICAL TEMPERATURE DEPENDENCE CHARACTERISTIC CURVE LEAKAGE REGION
Series
Energy Absorption/Peak Current Capability
Energy dissipated within calculated multiplying clamping voltage, transient current transient duration. important advantage multilayer interdigitated electrode construction within mass dielectric material. This results excellent current distribution peak temperature energy absorbed very low. matrix semiconducting grains combine absorb distribute transient energy (heat) (Figure 10). This dramatically reduces peak temperature, thermal stresses enhances device reliability.
CLAMPING VOLTAGE
V26MLA1206
V5.5MLA1206
TEMPERATURE (oC)
FIGURE CLAMPING VOLTAGE OVER TEMPERATURE 10A)
FIRED CERAMIC DIELECTRIC
measure device capability energy handling peak current, V26MLA1206A part tested with multiple pulses peak current rating (150A, 8/20µs). test, 10,000 pulses later, device voltage characteristics still well within specification (Figure 11).
METAL TERMINATION
METAL ELECTRODES METAL TERMINATION
DEPLETION REGION
DEPLETION REGION GRAINS
FIGURE MULTILAYER INTERNAL CONSTRUCTION
PEAK CURRENT 150A 8/20µs DURATION, BETWEEN PULSES
VOLTAGE
V26MLA1206
2000 4000 6000 NUMBER PULSES 8000 10000 12000
FIGURE REPETITIVE PULSE CAPABILITY
5-10
Series Soldering Recommendations
principal techniques used soldering components surface mount technology Infra (IR) Reflow, Vapor Phase Reflow Wave Soldering. When wave soldering, suppressor attached substrate means adhesive. assembly then placed conveyor through soldering process. With Vapor Phase Reflow device placed solder paste substrate. solder paste heated reflows, solders unit board. With suppressor, recommended solder 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), 63/37 (Sn/Pb). Harris also recommends solder flux. Wave soldering operation most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. When using reflow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solders peak temperature essential minimize thermal shock. Examples soldering conditions series suppressors given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed cool less than 50oC before cleaning.
MAXIMUM WAVE 260oC TEMPERATURE (oC) SECOND PREHEAT FIRST PREHEAT
TIME (MINUTES)
FIGURE WAVE SOLDER PROFILE
MAXIMUM TEMPERATURE 222oC TEMPERATURE (oC) 40-80 SECONDS ABOVE 183oC RAMP RATE >50oC/s PREHEAT ZONE
TIME (MINUTES)
Termination Options
Harris offers types electrode termination finish Multilayer product series: Silver/Platinum (standard) Silver/Palladium (optional)
TEMPERATURE (oC)
FIGURE VAPOR PHASE SOLDER PROFILE
MAXIMUM TEMPERATURE 222oC 40-80 SECONDS ABOVE 183oC RAMP RATE <2oC/s PREHEAT DWELL PREHEAT ZONE
(The ordering information section describes designate them.)
TIME (MINUTES)
FIGURE REFLOW SOLDER PROFILE
5-11
Series Recommended Outline
NOTE
NOTE: Avoid metal runs this area. SIZE 1210 SIZE DEVICE SYMBOL 0.219 0.147 0.073 5.53 3.73 1.85 1206 SIZE DEVICE 0.203 0.103 0.065 5.15 2.62 1.65 0805 SIZE DEVICE 0.144 0.084 0.058 3.65 2.13 1.48 0603 SIZE DEVICE 0.11 0.064 0.044 1.62 1.12
Explanation Terms
Rated Voltage (VM(DC))
This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device.
system. leakage current drawn this level very low, specified Device Ratings table.
Nominal Voltage (VN(DC))
This voltage which device changes from (standby state) (clamping state) enters conduction mode operation. voltage value usually characterized point specified minimum maximum voltage range.
Rated Voltage (VM(AC)RMS)
This maximum continuous sinusoidal voltage which applied. This voltage applied temperature maximum operating temperature device.
Clamping Voltage (VC)
This peak voltage appearing across suppressor when measured conditions specified pulse current specified waveform.
Capacitance
This capacitance device specified frequency (1MHz) bias (1VP-P).
Maximum Non-Repetitive Surge Current (ITM)
This maximum peak current which applied 8/20µs impulse, with rated line voltage also applied, without causing device failure. pulse applied device either polarity with same confidence factor. Figure waveform description.
Maximum Non-Repetitive Surge Energy (WTM)
This maximum rated transient energy which dissipated single current pulse specified impulse duration (10/1000µs), with rated voltage applied, without causing device failure.
Leakage (IL) Rated Voltage
nonconducting mode, device very high impedance (approaching maximum rated voltage) appears essentially open circuit
5-12
Series Mechanical Dimensions
CHIP SIZE 1210 SYMBOL Max. 0.113 0.02 ±0.01 0.125 ±0.012 0.10 ±0.012 2.87 0.50 ±0.25 3.20 ±0.30 2.54 ±0.30 0.071 0.02 ±0.01 0.125 ±0.012 0.06 ±0.011 1206 1.80 0.50 ±0.25 3.20 ±0.03 1.60 ±0.28 0.043 0.01 0.029 0.079 ±0.008 0.049 ±0.008 0805 0.25 0.75 2.01 ±0.2 1.25 ±0.2 0.035 0.015 ±0.008 0.063 ±0.006 0.032 ±0.006 0603 ±0.2 ±0.15 ±0.15
Ordering Information
VXXML TYPES
1206
SERIES
DEVICE FAMILY Harris TVSS Device MAXIMUM WORKING VOLTAGE
PACKING OPTIONS <100 Bulk (178mm) Diameter Reel (Note) 13in (330mm) Diameter Reel (Note) TERMINATION OPTION Letter: Ag/Pt (Standard) Ag/Pd CAPACITANCE OPTION Letter: Standard Capacitance Version (Where available device ratings standard versions)
MULTILAYER DESIGNATOR PERFORMANCE DESIGNATOR Standard (See Data Sheet) Array (See Data Sheet) NOTE: quantity table.
DEVICE SIZE: i.e.,
Standard Shipping Quantities
DEVICE SIZE 1210 1206 0805 0603 "13" INCH REEL ("T" OPTION) 8,000 10,000 10,000 10,000 INCH REEL ("H" OPTION) 2,000 2,500 2,500 2,500 BULK PACK ("A" OPTION)
5-13
Series Tape Reel Specifications
Conforms 481, Revision Supplied Publication
SYMBOL Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Embossed Tape Thickness Tape Thickness DESCRIPTION MILLIMETERS Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. ±0.2 ±0.5 1.75 ±0.1 ±0.1 ±0.1 ±0.1 1.55 ±0.05 1.05 ±0.05
NOTE: Dimensions millimeters.
PRODUCT IDENTIFYING LABEL PLASTIC CARRIER TAPE
EMBOSSMENT TAPE
NOMINAL
178mm 330mm DIA. REEL
Harris semiconductor products manufactured, assembled tested under ISO9000 quality systems certification.
Harris semiconductor products sold description only. Harris Semiconductor Communications Division reserves right make changes circuit design and/or specifications time without notice. Accordingly, reader cautioned verify that data sheets current before placing orders. Information furnished Harris believed accurate reliable. However, responsibility assumed Harris subsidiaries use; infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights Harris subsidiaries.
information regarding Harris Semiconductor Communications Division products, call 1-800-4-HARRIS site http://www.semi.harris.com
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Multilayer Surface Mount Transient Voltage Surge Suppressors /Title Se

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