INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER FEATURES Complies with 89/

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INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER FEATURES Complies with 89/

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EMI/EMC Compliant, Protected, RS-232 Line Drivers/Receivers ADM207E/ADM208E/ADM211E/ADM213E
INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER
FEATURES Complies with 89/336/EEC Directive Protection IEC1000-4-2 (801.2) Contact Discharge Air-Gap Discharge Human Body Model Fast Transient Burst (EFT) Immunity (IEC1000-4-4) Emissions (EN55022) Eliminates Costly TranZorbs* kbits/s Data Rate Guaranteed Single Power Supply Shutdown Mode Plug-In Upgrade MAX2xxE Space Saving TSSOP Package Available APPLICATIONS Laptop Computers Notebook Computers Printers Peripherals Modems GENERAL DESCRIPTION
0.1µF 6.3V 0.1µF
0.1µF
+10V -10V VOLTAGE INVERTER
T1IN CMOS INPUTS* T2IN T3IN T4IN R1OUT R2OUT CMOS OUTPUTS R3OUT R4OUT R5OUT (ADM211E) (ADM213E)
T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SHDN (ADM211E) SHDN (ADM213E) EIA/TIA-232 INPUTS** EIA/TIA-232 OUTPUTS
ADM211E ADM213E
ADM2xxE family robust RS-232 V.28 interface devices which operates from single power supply. These products suitable operation harsh electrical environments compliant with directive (89/336/ EEC). Both level emissions immunity compliance. immunity includes protection excess lines (1000-4-2), Fast Transient Burst protection (1000-4-4) Radiated Immunity (1000-4-3). emissions include radiated conducted emissions required Information Technology Equipment EN55022, CISPR22. devices fully conform EIA-232E CCITT V.28 specifications operate data rates kbps. Shutdown Enable control pins provided some products. Please refer Table shutdown function ADM211E disables charge pump transmitters receivers. ADM213E
*TranZorb registered trademark General Semiconductor Industries, Inc.
NOTES: INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
charge pump, transmitters, three five receivers disabled. remaining receivers remain active thereby allowing monitoring peripheral devices. This feature allows device shut down until peripheral device begins communication. active receivers alert processor which then take ADM213E shutdown mode. Operating from single supply, four external capacitors required. ADM207E ADM208E available 24-pin DIP, SSOP TSSOP packages. ADM211E ADM213E available 28-pin SSOP TSSOP packages. products backward compatible with earlier ADM2xx products facilitating easy upgrading older designs.
Table Selection Table
Model ADM207E ADM208E ADM211E ADM213E
Supply Voltage
Drivers
Receivers
Protection
Shutdown (SD)*
Enable (EN)
Packages RU-24 RU-24 RU-28 RU-28
*Two receivers active.
REV.
Information furnished Analog Devices believed accurate reliable. However, responsibility assumed Analog Devices use, infringements patents other rights third parties which result from use. license granted implication otherwise under patent patent rights Analog Devices. Analog Devices, Inc., 1996 Technology Way, P.O. 9106, Norwood, 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703
(VCC +5.0
Parameter Operating Voltage Range Power Supply Current Shutdown Supply Current Input Pull-Up Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Input Logic Threshold High, VINH CMOS Output Voltage Low, CMOS Output Voltage High, CMOS Output Leakage Current EIA-232 Input Voltage Range EIA-232 Input Threshold EIA-232 Input Threshold High EIA-232 Input Hysteresis EIA-232 Input Resistance Output Voltage Swing Transmitter Output Resistance RS-232 Output Short Circuit Current Maximum Data Rate Receiver Propagation Delay TPHL, TPLH Receiver Output Enable Time, Receiver Output Disable Time, Transmitter Propagation Delay TPHL, TPLH Transition Region Slew Rate
10%, C1-C4 specifications TMIN TMAX unless otherwise noted.)
+4.5 +5.0 0.05 +5.5 Units Volts Volts kbps V/µs TIN, SHDN, SHDN, SHDN, SHDN IOUT IOUT VCC, GND, ROUT Test Conditions/Comments Load
Transmitter Outputs Loaded with Ground VOUT 2500
2500 2500 Measured from Human Body Model IEC1000-4-2 Discharge IEC1000-4-2 Contact Discharge Human Body Model, MIL-STD-883B IEC1000-4-4 IEC1000-4-3
Protection (I-O Pins)
Protection (All Other Pins) Protection (I-O Pins) Immunity
Specifications subject change without notice.
ABSOLUTE MAXIMUM RATINGS*
+25°C unless otherwise noted)
-0.3 (VCC -0.3 +0.3 Input Voltages -0.3 (V+, +0.3 Output Voltages TOUT ROUT -0.3 (VCC +0.3 Short Circuit Duration TOUT Continuous Power Dissipation N-24 (Derate 13.5 mW/°C Above +70°C) 1000 R-24 SOIC (Derate mW/°C Above +70°C) RS-24 SSOP (Derate mW/°C Above +70°C) RU-24 TSSOP (Derate mW/°C Above +70°C)
R-28 SOIC (Derate mW/°C Above +70°C) RS-28 SSOP (Derate mW/°C Above +70°C) RU-24 TSSOP (Derate mW/°C Above +70°C) Operating Temperature Range Industrial Version) -40°C +85°C Storage Temperature Range -65°C +150°C Lead Temperature (Soldering, sec) +300°C Rating (MIL-STD-883B) (I-O Pins) Rating (MIL-STD-883B) (Except I-O) ±2.5 Rating (IEC1000-4-2 Air) (I-O Pins) Rating (IEC1000-4-2 Contact) (I-O Pins) Rating (IEC1000-4-4) (I-O Pins)
*This stress rating only functional operation device these other conditions above those indicated operation sections this specification implied. Exposure absolute maximum rating conditions extended periods time affect reliability.
REV.
ADM207E/ADM208E/ADM211E/ADM213E
INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER
0.1µF 6.3V 0.1µF
0.1µF
+10V -10V VOLTAGE INVERTER
T3OUT T1OUT T2OUT R1IN R1OUT T2IN
T4OUT R2IN R2OUT T5IN
CMOS INPUTS*
T1IN T2IN T3IN T4IN T5IN R1OUT CMOS OUTPUTS R2OUT R3OUT
T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN EIA/TIA-232 INPUTS** EIA/TIA-232 OUTPUTS
ADM207E
T5OUT T4IN
VIEW T1IN (Not Scale) T3IN R3OUT R3IN
ADM207E
Figure ADM207E Configuration
NOTES: INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
Figure ADM207E Typical Operating Circuit
INPUT 0.1µF 0.1µF
T2OUT T1OUT R2IN R2OUT T1IN R1OUT R1IN T3OUT R3IN R3OUT T4IN
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V 0.1µF T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN
0.1µF
T1IN T2IN T3IN T4IN R1OUT R2OUT CMOS OUTPUTS R3OUT R4OUT
CMOS INPUTS*
ADM208E
T4OUT
EIA/TIA-232 OUTPUTS
VIEW T3IN (Not Scale) T2IN R4OUT R4IN
EIA/TIA-232 INPUTS**
ADM208E
Figure ADM208E Configuration
NOTES: INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
Figure ADM208E Typical Operating Circuit
REV.
ADM207E/ADM208E/ADM211E/ADM213E
T3OUT
T3OUT T1OUT T2OUT R2IN R2OUT T4OUT R3IN R3OUT SHDN
T4OUT R3IN R3OUT SHDN
T1OUT T2OUT R2IN R2OUT
ADM213E
ADM211E VIEW T2IN (Not Scale) R4IN
T1IN R4OUT T4IN T3IN R5OUT R5IN
VIEW T2IN (Not Scale) R4IN* T1IN R1OUT R1IN R4OUT* T4IN T3IN OUT*
R1OUT R1IN
*ACTIVE SHUTDOWN
Figure ADM211E Configuration
INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER
Figure ADM213E Configuration
INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER
0.1µF 6.3V 0.1µF T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SHDN
0.1µF
0.1µF 6.3V
0.1µF
+10V -10V VOLTAGE INVERTER
+10V -10V VOLTAGE INVERTER
0.1µF T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN*** R5IN*** SHDN RS-232 INPUTS**
T1IN T2IN T3IN T4IN R1OUT R2OUT CMOS OUTPUTS R3OUT R4OUT R5OUT
T1IN T2IN T3IN T4IN R1OUT R2OUT
CMOS INPUTS*
EIA/TIA-232 OUTPUTS
TTL/CMOS INPUTS*
RS-232 OUTPUTS
EIA/TIA-232 INPUTS**
TTL/CMOS OUTPUTS
R3OUT R4OUT*** R5OUT***
ADM211E
ADM213E
NOTES:
INTERNAL 400k PULL-UP RESISTOR EACH CMOS INPUT INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT
INTERNAL 400k PULL-UP RESISTOR EACH TTL/CMOS INPUT INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT ACTIVE SHUTDOWN
Figure ADM211E Typical Operating Circuit
Figure ADM213E Typical Operating Circuit
REV.
ADM207E/ADM208E/ADM211E/ADM213E
FUNCTION DESCRIPTION
Mnemonic C1+, C2+, TOUT ROUT EN/EN
Function Power Supply Input: 10%. Internally Generated Positive Supply nominal). Internally Generated Negative Supply nominal). Ground Pin. Must Connected External Capacitor connected between these pins. capacitor recommended larger capacitors used. External Capacitor connected between these pins. capacitor recommended larger capacitors used. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. internal pull-up resistor connected each input. Transmitter (Driver) Outputs. These RS-232 signal levels (Typically Receiver Inputs. These inputs accept RS-232 signal levels. internal pull-down resistor connected each input. Receiver Outputs. These CMOS output logic levels. Receiver Enable (Active High ADM213E, Active ADM211E); This input used enable/disable receiver outputs. With ADM211E High ADM213E), receiver outputs enabled. With High ADM213E), receiver outputs placed high impedance state. Shutdown Control (Active ADM213E, Active High ADM211E); Refer Table shutdown charge pump disabled, transmitter outputs turned receiver outputs (ADM211E), receivers (ADM213E) placed high impedance state. Receivers ADM213E continue operate normally during shutdown. Power consumption shutdown parts reduces
SHDN/SHDN
Table ADM211E Truth Table
ORDERING GUIDE
SHDN
Don't Care.
Status Normal Operation Normal Operation Shutdown
TOUT1-4 Enabled Enabled Disabled
ROUT1-5 Enabled Disabled Disabled
Model ADM207EAN ADM207EAR ADM207EARS ADM207EARU ADM208EAN ADM208EAR ADM208EARS ADM208EARU ADM211EAR ADM211EARS ADM211EARU ADM213EAR ADM213EARS ADM213EARU
Temperature Range -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C
Package Option N-24 R-24 RS-24 RU-24 N-24 R-24 RS-24 RU-24 R-28 RS-28 RU-28 R-28 RS-28 RU-28
Table III. ADM213E Truth Table
SHDN
Status Shutdown Shutdown Normal Operation Normal Operation
TOUT1-4 Disabled Disabled Enabled Enabled
ROUT1-3 Disabled Disabled Disabled Enabled
ROUT4-5 Disabled Enabled Disabled Enabled
REV.
ADM207E/ADM208E/ADM211E/ADM213E Typical Performance Curves
LIMIT
dBµV
dBµV
LIMIT
FREQUENCY
START 30.0
STOP 200.0
Figure Conducted Emissions
Figure Radiated Emissions
TOUT VOLTAGE
TOUT (+VE)
TOUT (+VE)
TOUT (-VE)
TOUT (-VE)
1000
2000
2500
Figure Transmitter Output Voltage High/Low Load Capacitance kbps
Figure Transmitter Output Voltage
IOUT
IOUT
TOUT
-9.8
-8.0
-7.0
-6.0 TOUT
-5.0
-4.0
-3.0
Figure Transmitter Output Voltage High Load Current
Figure Transmitter Output Voltage Load Current
REV.
ADM207E/ADM208E/ADM211E/ADM213E
SHDN +10V
IMPEDANCE
-10V 20µs/DIV
Figure Charge Pump Exiting Shutdown
Figure Charge Pump Impedance
CHHARGE PUMP VOLTAGE
ILOAD
Figure Charge Pump Current
REV.
ADM207E/ADM208E/ADM211E/ADM213E
GENERAL DESCRIPTION
ADM207E/ADM208E/ADM211E/ADM213E ruggedized RS-232 line drivers/receivers which operate from single supply. Step-up voltage converters coupled with level shifting transmitters receivers allow RS-232 levels developed while operating from single supply. Features include power consumption, high transmission rates compatibility with directive electromagnetic compatibility. compatibility includes protection against radiated conducted interference including high levels electrostatic discharge. RS-232 inputs outputs contain protection against electrostatic discharges electrical fast transients This ensures compliance IE1000-4-2 IEC1000-4-4 requirements. devices ideally suited operation electrically harsh environments where RS-232 cables frequently being plugged/unplugged. They also immune high field strengths without special shielding precautions. Emissions also controlled within very strict limits. CMOS technology used keep power dissipation absolute minimum allowing maximum battery life portable applications. ADMxxE modification, enhancement improvement AD230-AD241 family derivatives thereof. essentially plug-in compatible does have materially different applications.
CIRCUIT DESCRIPTION
supplies also used power external circuitry current requirements small. Please refer Figure Typical Performance section.
2VCC
INTERNAL OSCILLATOR
Figure Charge Pump Voltage Doubler
FROM VOLTAGE DOUBLER
-(V+)
INTERNAL OSCILLATOR
Figure Charge Pump Voltage Inverter
Transmitter (Driver) Section
drivers convert logic input levels into EIA-232 output levels. With driving EIA-232 load, output voltage swing typically Unused inputs left unconnected, internal pull-up resistor pulls them high forcing outputs into state. input pull-up resistors typically source when grounded, unused inputs should either connected left unconnected order minimize power consumption.
Receiver Section
internal circuitry consists four main sections. These are: charge pump voltage converter. logic EIA-232 transmitters. EIA-232 logic receivers. Transient protection circuit lines.
Charge Pump DC-DC Voltage Converter
charge pump voltage converter consists oscillator switching matrix. converter generates supply from input level. This done stages using switched capacitor technique illustrated below. First, input supply doubled using capacitor charge storage element. level then inverted generate using storage element. Capacitors used reduce output ripple. desired, larger capacitors used capacitors C1-C4. This facilitates direct substitution with older generation charge pump RS-232 transceivers.
receivers inverting level shifters which accept EIA-232 input levels translate them into logic output levels. inputs have internal pull-down resistors ground also protected against overvoltages guaranteed switching thresholds minimum maximum. Unconnected inputs pulled internal pull-down resistor. This, therefore, results Logic output level unconnected inputs inputs connected GND. receivers have Schmitt trigger input with hysteresis level This ensures error-free reception both noisy inputs inputs with slow transition times.
REV.
ADM207E/ADM208E/ADM211E/ADM213E
ENABLE SHUTDOWN
Table Table show truth tables enable shutdown control signals. enable function intended facilitate data connections where desirable three state receiver outputs. disabled mode, receiver outputs placed high impedance state. shutdown function intended shut device down, thereby minimizing quiescent current. shutdown, transmitters disabled receivers ADM211E three-stated. ADM213E, receivers remain enabled shutdown. Note that transmitters disabled three-stated shutdown, permitted connect multiple (RS-232) driver outputs together. shutdown feature very useful battery operated systems since reduces power consumption During shut-
down charge pump also disabled. shutdown control input active high ADM211E, active ADM213E. When exiting shutdown, charge pump restarted takes approximately reach steady state operating conditions.
High Baud Rate
ADM2xxE feature high slew rates permitting data transmission rates well excess EIA-232-E specifications. RS232 levels maintained data rates kb/s even under worst case loading conditions. This allows high speed data links between terminals indeed suitable generation modem standards which requires data rates kb/s. slew rate internally controlled less than V/µs order minimize interference.
INPUT
-0.1V RECEIVER OUTPUT +0.1V
NOTE: COMPLEMENT ADM213E
Figure Receiver-Disable Timing
INPUT
+3.5V RECEIVER OUTPUT +0.8V
NOTE: COMPLEMENT ADM213E
Figure Receiver Enable Timing
REV.
ADM207E/ADM208E/ADM211E/ADM213E
ESD/EFT Transient Protection Scheme.
ADM2xxE uses protective clamping structures inputs outputs which clamps voltage safe level dissipates energy present (Electrostatic) (Electrical Fast Transients) discharges. simplified schematic protection structure shown Figures 22b. Each input output contains back-to-back high speed clamping diodes. During normal operation with maximum RS-232 signal levels, diodes have affect other reverse biased depending polarity signal. however voltage exceeds about reverse breakdown occurs voltage clamped this level. diodes large junctions which designed handle instantaneous current surge which exceed several amperes. transmitter outputs receiver inputs have similar protection structure. receiver inputs also dissipate some energy through internal resistor well through protection diodes. protection structure achieves protection protection RS-232 lines. methods used test protection scheme discussed later.
RECEIVER INPUT
lines particularly vulnerable damage. Simply touching plugging cable result static discharge which damage completely destroy interface product connected port. Traditional test methods such MIL-STD-883B method 3015.7 fully test products susceptibility this type discharge. This test intended test products susceptibility damage during handling. Each tested with respect other pins. There some important differences between traditional test test: test much more stringent terms discharge energy. peak current injected over four times greater. current rise time significantly faster test. test carried while power applied device. possible that discharge could induce latch-up device under test. This test therefore more representative real-world discharge where equipment operating normally with power applied. maximum peace mind however, both tests should performed, therefore, ensuring maximum protection both during handling later during field service.
HIGH VOLTAGE GENERATOR
DEVICE UNDER TEST
TEST METHOD BODY MIL-STD883B IEC1000-4-2
1.5k
100pF 150pF
Figure 22a. Receiver Input Protection Scheme
IPEAK
Figure Test Standards
TOUT
TRANSMITTER OUTPUT
36.8
Figure 22b. Transmitter Output Protection Scheme
TESTING (IEC1000-4-2)
IEC1000-4-2 (previously 801-2) specifies compliance testing using coupling methods, contact discharge air-gap discharge. Contact discharge calls direct connection unit being tested. Air-gap discharge uses higher test voltage does make direct contact with unit under test. With discharge, discharge moved towards unit under test developing across gap, hence term airdischarge. This method influenced humidity, temperature, barometric pressure, distance rate closure discharge gun. contact-discharge method while less realistic more repeatable gaining acceptance preference air-gap method. Although very little energy contained within pulse, extremely fast rise time coupled with high voltages cause failures unprotected semiconductors. Catastrophic destruction occur immediately result arcing heating. Even catastrophic failure does occur immediately, device suffer from parametric degradation which result degraded performance. cumulative effects continuous exposure eventually lead complete failure. -10-
TIME
Figure Human Body Model Current Waveform
IPEAK
30ns 60ns TIME
Figure IEC1000-4-2 Current Waveform
REV.
ADM207E/ADM208E/ADM211E/ADM213E
ADM2xxE family products tested using both above mentioned test methods. pins tested with respect other pins MIL-STD-883B specification. addition pins tested test specification. products were tested under following conditions: Power-On-Normal Operation Power-On-Shutdown Mode Power-Off There four levels compliance defined IEC1000-4-2. ADM2xxE family products meet most stringent compliance level both contact air-gap discharge. This means that products able withstand contact discharges excess air-gap discharges excess
Table IEC1000-4-2 Compliance Levels Table
Level
Peak (kV)
Peak (kV) 0.25
simplified circuit diagram actual generator illustrated Figure transients coupled onto signal lines using coupling clamp. clamp long completely surrounds cable providing maximum coupling capacitance typ) between clamp cable. High energy transients capacitively coupled onto signal lines. Fast rise times specified standard result very effective coupling. This test very severe since high voltages coupled onto signal lines. repetitive transients often cause problems where single pulses don't. Destructive latch-up induced high energy content transients. Note that this stress applied while interface products powered transmitting data. test applies hundreds pulses with higher energy than ESD. Worst case transient current line high 40A. Test results classified according following: Normal performance within specification limits. Temporary degradation loss performance which selfrecoverable. Temporary degradation loss function performance which requires operator intervention system reset. Degradation loss function which recoverable damage. ADM2xxE have been tested under worst case conditions using unshielded cables meet Classification Data transmission during transient condition corrupted resumed immediately following event without user intervention.
Level
Contact Discharge
Discharge
Table ADM2xxE Test Results
Test Method MIL-STD-883B IEC1000-4-2 Contact
Pins
Other Pins ±2.5
FAST TRANSIENT BURST TESTING (IEC1000-4-4)
IEC1000-4-4 (previously 801-4) covers electrical fast-transient/ burst (EFT) immunity. Electrical fast transients occur result arcing contacts switches relays. tests simulate interference generated when example power relay disconnects inductive load. spark generated well known back effect. fact spark consists burst sparks relay contacts separate. voltage appearing line, therefore, consists bust extremely fast transient impulses. similar effect occurs when switching fluorescent lights. fast transient burst test defined IEC1000-4-4 simulates this arcing waveform illustrated Figure consists burst transients repeating intervals. specified both power data lines.
HIGH VOLTAGE SOURCE
OUTPUT
Figure IEC1000-4-4 Fast Transient Generator
300ms 15ms
50ns
0.2/0.4ms
Figure IEC1000-4-4 Fast Transient Waveform
REV.
-11-
ADM207E/ADM208E/ADM211E/ADM213E
IEC1000-4-3 RADIATED IMMUNITY EMISSIONS/INTERFERENCE
IEC1000-4-3 (previously IEC801-3) describes measurement method defines levels immunity radiated electromagnetic fields. originally intended simulate electromagnetic fields generated portable radio transceivers other device which generates continuous wave radiated electromagnetic energy. scope since been broadened include spurious energy which radiated from fluorescent lights, thyristor drives, inductive loads, etc. Testing immunity involves irradiating device with field. There various methods achieving this including anechoic chamber, stripline cell, cell, GTEM cell. stripline cell consists parallel plates with electric field developed between them. device under test placed within cell exposed electric field. There three severity levels having field strengths ranging from V/m. Results classified similar fashion those IEC1000-4-4. Normal operation. Temporary degradation loss function which selfrecoverable when interfering signal removed. Temporary degradation loss function which requires operator intervention system reset when interfering signal removed. Degradation loss function which recoverable damage. ADM2xxE family products easily meets Classification most stringent (Level requirement. fact field strengths showed performance degradation error-free data transmission continued even during irradiation.
Table VII. Test Severity Levels (IEC1000-4-3)
EN55 022, CISPR22 defines permitted limits radiated conducted interference from Information Technology (IT) equipment. objective standard minimize level emissions both conducted radiated. ease measurement analysis, conducted emissions assumed predominate below radiated emissions assumed predominate above MHz.
CONDUCTED EMISSIONS
This measure noise which gets conducted onto line power supply. Switching transients from charge pump which magnitude containing significant energy lead conducted emissions. Other sources conducted emissions overlap switch on-times charge pump voltage converter. voltage doubler shown below, fully turned before turns this results transient current glitch between which results conducted emissions. therefore important that switches charge pump guarantee break-before-make switching under conditions that instantaneous short circuit conditions occur. ADM2xxE been designed minimize switching transients ensure break-before-make switching thereby minimizing conducted emissions. This resulted level emissions being well below limits required specification. additional filtering/decoupling other than recommended capacitor required. Conducted emissions measured monitoring line power supply. equipment used consists LISN (Line Impedance Stabilizing Network) which essentially presents fixed impedance spectrum analyzer. spectrum analyzer scans emissions plot ADM211E shown Figure
Level
Field Strength
INTERNAL OSCILLATOR
Figure Charge Pump Voltage Doubler
SWITCHING GLITCHES
Figure Switching Glitches
-12-
REV.
ADM207E/ADM208E/ADM211E/ADM213E
LIMIT
RADIATED NOISE
ADJUSTABLE ANTENNA RECEIVER
TURNTABLE
dBµV
Figure Radiated Emissions Test Setup
FREQUENCY
Figure Conducted Emissions Plot
RADIATED EMISSIONS
Figure shows plot radiated emissions frequency. This shows that levels emissions well within specifications without need additional shielding filtering components. ADM2xxE operated maximum baud rates configured typical RS-232 interface. Testing radiated emissions carried shielded anechoic chamber.
Radiated emissions measured frequencies excess MHz. RS-232 outputs designed operation high baud rates while driving cables radiate high frequency energy. reasons already discussed which cause conducted emissions also responsible radiated emissions. Fast RS-232 output transitions radiate interference, especially when lightly loaded driving unshielded cables. Charge pump devices also prone radiating noise high frequency oscillator high voltages being switched charge pump. move towards smaller capacitors order conserve board space resulted higher frequency oscillators being employed charge pump design. This resulted higher levels emission, both conducted radiated. RS-232 outputs ADM2xxE products feature controlled slew rate order minimize level radiated emissions, fast enough support data rates kBaud.
dBµV
START 30.0 STOP 200.0
LIMIT
Figure Radiated Emissions Plot
REV.
-13-
ADM207E/ADM208E/ADM211E/ADM213E
OUTLINE DIMENSIONS
Dimensions shown inches (mm).
24-Lead (N-24)
1.275 (32.30) 1.125 (28.60)
0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) 0.070 (1.77) 0.045 (1.15)
0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 0.060 (1.52) 0.015 (0.38) 0.150 (3.81) SEATING PLANE
0.280 (7.11) 0.240 (6.10)
0.015 (0.381) 0.008 (0.204)
24-Lead SOIC (R-24)
0.6141 (15.60) 0.5985 (15.20)
28-Lead (R-28)
0.7125 (18.10) 0.6969 (17.70)
0.4193 (10.65) 0.3937 (10.00)
0.2992 (7.60) 0.2914 (7.40)
0.1043 (2.65) 0.0926 (2.35)
0.0291 (0.74) 0.0098 (0.25)
0.1043 (2.65) 0.0926 (2.35)
0.4193 (10.65) 0.3937 (10.00)
0.0291 (0.74) 0.0098 (0.25)
0.0118 (0.30) 0.0040 (0.10)
0.0500 (1.27)
0.0192 (0.49) SEATING 0.0125 (0.32) 0.0138 (0.35) PLANE 0.0091 (0.23)
0.0500 (1.27) 0.0157 (0.40)
0.0118 (0.30) 0.0040 (0.10) 0.0500 (1.27)
0.2992 (7.60) 0.2914 (7.40)
0.0192 (0.49) SEATING 0.0125 (0.32) 0.0138 (0.35) PLANE 0.0091 (0.23)
0.0500 (1.27) 0.0157 (0.40)
24-Lead SSOP (RS-24)
0.328 (8.33) 0.318 (8.08)
28-Lead SSOP (RS-28)
0.407 (10.34) 0.397 (10.08)
0.212 (5.38) 0.205 (5.207)
0.311 (7.9) 0.301 (7.64)
0.311 (7.9) 0.301 (7.64)
0.078 (1.98) 0.068 (1.73)
0.07 (1.78) 0.066 (1.67)
0.078 (1.98) 0.068 (1.73)
0.07 (1.79) 0.066 (1.67)
0.008 (0.203) 0.0256 (0.65) 0.002 (0.050)
0.015 (0.38) SEATING 0.009 (0.229) 0.010 (0.25) PLANE 0.005 (0.127)
0.037 (0.94) 0.022 (0.559)
0.212 (5.38) 0.205 (5.21)
0.008 (0.203) 0.0256 (0.65) 0.002 (0.050)
0.015 (0.38) 0.010 (0.25)
SEATING 0.009 (0.229) PLANE 0.005 (0.127)
0.03 (0.762) 0.022 (0.558)
-14-
REV.
ADM207E/ADM208E/ADM211E/ADM213E
OUTLINE DIMENSIONS
Dimensions shown inches (mm).
24-Lead TSSOP (RU-24)
0.311 (7.90) 0.303 (7.70)
28-Lead TSSOP (RU-28)
0.386 (9.80) 0.378 (9.60)
0.177 (4.50) 0.169 (4.30)
0.177 (4.50) 0.169 (4.30)
0.256 (6.50) 0.246 (6.25)
0.006 (0.15) 0.002 (0.05)
0.0433 (1.10) 0.0256 (0.65) 0.0118 (0.30) 0.0075 (0.19) 0.0079 (0.20) 0.0035 (0.090)
0.006 (0.15) 0.002 (0.05)
SEATING PLANE
0.028 (0.70) 0.020 (0.50)
SEATING PLANE 0.0256 (0.65) 0.0118 (0.30) 0.0075 (0.19)
0.256 (6.50) 0.246 (6.25)
0.0433 (1.10) 0.0079 (0.20) 0.0035 (0.090)
0.028 (0.70) 0.020 (0.50)
REV.
-15-
-16-
C2137-18-5/96
PRINTED U.S.A.

INPUT 0.1µF 0.1µF +10V VOLTAGE DOUBLER FEATURES Complies with 89/

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