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PARALLEL ACCESS EEPROM FAST ACCESS TIME: 150ns SINGLE SUPPLY VOLT
Top Searches for this datasheetM28C64C M28C64X PARALLEL ACCESS EEPROM FAST ACCESS TIME: 150ns SINGLE SUPPLY VOLTAGE POWER CONSUMPTION FAST WRITE CYCLE Bytes Page Write Operation Byte Page Write Cycle: ENHANCED WRITE DETECTION Ready/Busy Open Drain Output (for M28C64C product only) Data Polling Toggle PAGE LOAD TIMER STATUS HIGH RELIABILITY SINGLE POLYSILICON, CMOS TECHNOLOGY Endurance >100,000 Erase/Write Cycles Data Retention Years JEDEC APPROVED BYTEWIDE DESCRIPTION M28C64C power Parallel EEPROM fabricated with SGS-THOMSON proprietary single polysilicon CMOS technology. device offers fast access time with power dissipation requires power supply. circuit been designed offer flexible microcontroller interface featuring both hardware software handshaking mode with Ready/Busy, Data Polling Toggle Bit. M28C64C supports byte page write operation. Table Signal Names Address Input Data Input Output Write Enable Chip Enable Output Enable Ready Busy Supply Voltage Ground PDIP28 PLCC32 SO28 (MS) mils TSOP28 x13.4mm Figure Logic Diagram A0-A12 DQ0-DQ7 M28C64C AI00746B June 1996 1/15 M28C64C, M28C64X Figure Connections Figure Connections AI00747C AI00748D M28C64C M28C64C AI01016D Warning: Don't Warning: Connected, Don't Figure Connections Figure TSOP Connections M28C64C M28C64C AI00876C Warning: Don't Warning: Don't DESCRITPION Addresses (A0-A12). address inputs select 8-bit memory location during read write operation. Chip Enable (E). chip enable input must enable read/write operations. When Chip Enable high, power consumption reduced. Output Enable (G). Output Enable input controls data output buffers used initiate read operations. 2/15 M28C64C, M28C64X Table Absolute Maximum Ratings Symbol TSTG VESD Parameter Ambient Operating Temperature Storage Temperature Range Supply Voltage Input/Output Voltage Input Voltage Electrostatic Discharge Voltage (Human Body model) Value +0.6 2000 Unit Note: Except rating "Operating Temperature Range", stresses above those listed Table "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only operation device these other conditions above those indicated Operating sections this specification implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability. Refer also SGS-THOMSON SURE Program other relevant quality documents. Table Operating Modes Mode Read Write Standby Write Inhibit Write Inhibit Write Inhibit Output Disable Note: Data Data Hi-Z Data Hi-Z Data Hi-Z Hi-Z Data (DQ0 DQ7). Data written read from M28C64C through pins. Write Enable (W). Write Enable input controls writing data M28C64C. Ready/Busy (RB). Ready/Busy open drain output that used detect internal write cycle. OPERATION order prevent data corruption inadvertent write operations during power-up, Power Reset (POR) circuit resets internal programming cicuitry. Access memory write mode allowed after power-up specified Table Read M28C64C accessed like static RAM. When with high, data addressed presented pins. pins high impedance when either high. Write Write operations initiated when both high.The M28C64C supports both controlled write cycles. Address latched falling edge which ever occurs last Data rising edge which ever occurs first. Once initiated write operation internally timed until completion. Page Write Page write allows bytes consecutively latched into memory prior initiating programming cycle. bytes must located single page address, that must same bytes. page write initiated during byte write operation. Following first byte write instruction host send another address data maximum 100µs after rising edge which ever occurs first (tBLC). transition detected within 100µs, internal programming cycle will start. 3/15 M28C64C, M28C64X Figure Block Diagram RESET CONTROL LOGIC DECODE A5-A12 (Page Address) ADDRESS LATCH ARRAY A0-A4 ADDRESS LATCH DECODE SENSE DATA LATCH BUFFERS PAGE LOAD TIMER STATUS TOGGLE DATA POLLING AI00877C DQ0-DQ7 Microcontroller Control Interface M28C64C provides write operation status bits status that used minimize system write cycle. These signals available port bits memory during programming cycle only, signal separate pin. Figure Status Assignment PLTS Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Data Polling Toggle PLTS Page Load Timer Status Data Polling (DQ7). During internal write cycle, attempt read last byte written will produce complementary value previously latched bit. Once write cycle finished true logic value appears read cycle. Toggle (DQ6). M28C64C offers another determining when internal write cycle completed.During internal Erase/Write cycle, will toggle from (the first read value "0") subsequent attempts read address memory. When internal cycle completed toggling will stop device will accessible Read Write operation. Page Load Timer Status (DQ5). Page Write mode data latched 100µs after previous byte. bytes input. Data output (DQ5) indicates status internal Page Load Timer. read asserting Output Enable (tPLTS). indicates timer running, High indicates time-out after which write cycle will start data input. Ready/Busy pin. provides signal open drain output which during erase/write cycle, which released completion programming cycle. 4/15 M28C64C, M28C64X MEASUREMENT CONDITIONS Input Rise Fall Times Input Pulse Voltages Input Output Timing Ref. Voltages 20ns 0.4V 2.4V 0.8V 2.0V Figure Testing Equivalent Load Circuit 1.3V 1N914 Note that Output Hi-Z defined point where data longer driven. 3.3k Figure Testing Input Output Waveforms 2.4V DEVICE UNDER TEST 30pF 2.0V 0.8V AI00826 0.4V includes capacitance AI01129 Table Capacitance Symbol Parameter Input Capacitance Output Capacitance Test Condition VOUT Unit Note: Sampled only, 100% tested. Table Read Mode Characteristics 70°C 85°C, 4.5V 5.5V) Symbol ICC1 ICC2 Parameter Input Leakage Current Output Leakage Current Supply Current (TTL CMOS inputs) Supply Current (Standby) Supply Current (Standby) CMOS Input Voltage Input High Voltage Output Voltage Output High Voltage Test Condition VIL, -0.3V Unit -400 +0.5 Note: I/O's open circuit. Table Power Timing 70°C 85°C, 4.5V 5.5V) Symbol tPUR tPUW Parameter Time Delay Read Operation Time Delay Write Operation Unit Note: Sampled only, 100% tested. 5/15 M28C64C, M28C64X Table Read Mode Characteristics 70°C 85°C, 4.5V 5.5V) M28C64C Symbol Parameter Test Condition -150 tAVQV tELQV tGLQV tEHQZ tGHQZ -200 -250 Unit tACC Address Valid Output Valid Chip Enable Output Valid Output Enable Output Valid Chip Enable High Output Hi-Z Output Enable High Output Hi-Z Address Transition Output Transition VIL, VIL, tAXQX Note: Output Hi-Z defined point which data longer driven. Figure Read Mode Waveforms A0-A12 tAVQV tGLQV tELQV DQ0-DQ7 VALID tAXQX tEHQZ tGHQZ DATA Hi-Z AI00749B Note: Enable High 6/15 M28C64C, M28C64X Table Write Mode Characteristics 70°C 85°C, 4.5V 5.5V) Symbol tAVWL tAVEL tELWL tGHWL tGHEL tWLEL tWLAX tELAX tWLDV tELDV tWLWH tELEH tWHEH tWHGL tEHGL tEHWH tWHDX tEHDX tWHWL tWHWH tWHRH tWHRL tEHRL tDVWH tDVEH tCES tOES tOES tWES tCEH tOEH tOEH tWEH tWPH tBLC Parameter Address Valid Write Enable Address Valid Chip Enable Chip Enable Write Enable Output Enable High Write Enable Output Enable High Chip Enable Write Enable Chip Enable Write Enable Address Transition Chip Enable Address Transition Write Enable Input Valid Chip Enable Input Valid Write Enable Write Enable High Chip Enable Chip Enable High Write Enable High Chip Enable High Write Enable High Output Enable Chip Enable High Output Enable Chip Enable High Write Enable High Write Enable High Input Transition Chip Enable High Input Transition Write Enable High Write Enable Byte Load Repeat Cycle Time Write Cycle Time Write Enable High Ready/Busy Chip Enable High Ready/Busy Data Valid before Write Enable High Data Valid before Chip Enable High Note Note VIL, 0.35 Test Condition VIL, Unit Note: With external pull-up resistor. 7/15 M28C64C, M28C64X Figure Write Mode Waveforms Write Enable Controlled A0-A12 tAVWL tELWL tGHWL VALID tWLAX tWHEH tWLWH tWHGL tWLDV DQ0-DQ7 DATA tDVWH tWHWL tWHDX tWHRL AI00750 Figure Write Mode Waveforms Chip Enable Controlled A0-A12 tAVEL tGHEL tWLEL VALID tELAX tELEH tEHGL tELDV DQ0-DQ7 DATA tDVEH tEHDX tEHWH tEHRL AI00751 8/15 M28C64C, M28C64X Figure Page Write Mode Waveforms Write Enable Controlled A0-A12 Addr Addr Addr Addr tPLTS tWHWL tWLWH DQ0-DQ7 Byte Byte tWHWH Byte tWHWH Byte tWHRH tWHRL Byte AI00752C Figure Data Polling Waveform Sequence A0-A12 Address last byte Page Write instruction LAST WRITE INTERNAL WRITE SEQUENCE READY AI00753C 9/15 M28C64C, M28C64X Figure Toggle Waveform Sequence A0-A12 LAST WRITE TOGGLE INTERNAL WRITE SEQUENCE READY AI00754D Note: First Toggle forced ORDERING INFORMATION SCHEME Example: M28C64C -150 Version available bonded (pin -150 -200 -250 Speed Package PDIP28 PLCC32 Temperature Range SO28 mils TSOP28 13.4mm list available options (Speed, Package, Temperature Range, etc. refer current Memory Shortform catalogue. further information aspect this device, please contact SGS-THOMSON Sales Office nearest you. 10/15 M28C64C, M28C64X PDIP28 Plastic DIP, mils width Symb PDIP28 3.94 0.38 3.56 0.38 1.14 0.20 34.70 14.80 12.50 2.54 15.20 3.05 1.02 5.08 1.78 4.06 0.56 1.78 0.30 37.34 16.26 13.97 17.78 3.82 2.29 0.100 inches 0.155 0.015 0.140 0.015 0.045 0.008 1.366 0.583 0.492 0.598 0.120 0.040 0.200 0.070 0.160 0.021 0.070 0.012 1.470 0.640 0.550 0.700 0.150 0.090 PDIP Drawing scale 11/15 M28C64C, M28C64X PLCC32 lead Plastic Leaded Chip Carrier, rectangular Symb PLCC32 2.54 1.52 0.33 0.66 12.32 11.35 9.91 14.86 13.89 12.45 1.27 0.10 3.56 2.41 0.53 0.81 12.57 11.56 10.92 15.11 14.10 13.46 0.050 inches 0.100 0.060 0.013 0.026 0.485 0.447 0.390 0.585 0.547 0.490 0.004 0.140 0.095 0.021 0.032 0.495 0.455 0.430 0.595 0.555 0.530 D2/E2 PLCC Drawing scale 12/15 M28C64C, M28C64X SO28 lead Plastic Small Outline, mils body width Symb SO28 2.46 0.13 2.29 0.35 0.23 17.81 7.42 1.27 10.16 0.61 0.10 2.64 0.29 2.39 0.48 0.32 18.06 7.59 10.41 1.02 0.050 inches 0.097 0.005 0.090 0.014 0.009 0.701 0.292 0.400 0.024 0.004 0.104 0.011 0.094 0.019 0.013 0.711 0.299 0.410 0.040 SO-b Drawing scale 13/15 M28C64C, M28C64X TSOP28 lead Plastic Thin Small Outline, 13.4mm Symb TSOP28 1.25 0.20 0.95 0.17 0.10 13.20 11.70 7.90 0.55 0.50 0.10 1.15 0.27 0.21 13.60 11.90 8.10 0.70 0.022 inches 0.049 0.008 0.037 0.007 0.004 0.520 0.461 0.311 0.020 0.004 0.045 0.011 0.008 0.535 0.469 0.319 0.028 TSOP-c Drawing scale 14/15 M28C64C, M28C64X Information furnished believed accurate reliable. However, SGS-THOMSON Microelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights SGS-THOMSON Microelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. SGS-THOMSON Microelectronics products authorized critical components life support devices systems without express written approval SGS-THOMSON Microelectronics. 1996 SGS-THOMSON Microelectronics Rights Reserved SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Hong Kong Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A. 15/15 Other recent searchesSSD1339 - SSD1339 SSD1339 Datasheet PSA05-12EWA - PSA05-12EWA PSA05-12EWA Datasheet PCM1725 - PCM1725 PCM1725 Datasheet MT8889C - MT8889C MT8889C Datasheet MT8889CE - MT8889CE MT8889CE Datasheet MT8889CS - MT8889CS MT8889CS Datasheet MT8889CN - MT8889CN MT8889CN Datasheet MT8889CE1 - MT8889CE1 MT8889CE1 Datasheet MT8889CS1 - MT8889CS1 MT8889CS1 Datasheet MT8889CN1 - MT8889CN1 MT8889CN1 Datasheet MT8889CSR - MT8889CSR MT8889CSR Datasheet MT8889CSR1 - MT8889CSR1 MT8889CSR1 Datasheet MBR30L45CT - MBR30L45CT MBR30L45CT Datasheet MBR30L60CT - MBR30L60CT MBR30L60CT Datasheet HUR2960 - HUR2960 HUR2960 Datasheet 1776262001 - 1776262001 1776262001 Datasheet
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