The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.    


Datasheet Search Engine   
 
Part # or Description: • 5V RS232 Driver • 2SC5066* • "Real Time Clock" • "USB connector" • "blue led" 5mm • 10 watt zener diode • 2N3055* motorola
 
Search Tip: Try entering the part number only. Include a wildcard (eg. lm317* or 1n4148*)

 

 

RADIATION HARDENED POWER MOSFET THRU-HOLE (T0-254AA) Part Number


Datasheet Thumbnail

  

Download PDF



Top Searches for this datasheet



91564F
RADIATION HARDENED POWER MOSFET THRU-HOLE (T0-254AA)
Part Number IRHM7064 IRHM3064 IRHM4064 IRHM8064 Radiation Level 100K Rads (Si) 300K Rads (Si) 500K Rads (Si) 1000K Rads (Si) RDS(on) 0.021 0.021 0.021 0.030 35A* 35A* 35A* 35A*
IRHM7064 JANSR2N7431 60V, N-CHANNEL REF:MIL-PRF-19500/663
RAD-Hard HEXFET TECHNOLOGY
Part Number
JANSR2N7431 JANSF2N7431 JANSG2N7431 JANSH2N7431
International Rectifier's RAD-Hard HEXFET technology provides high performance power MOSFETs space applications. This technology over decade proven performance reliability satellite applications. These devices have been characterized both Total Dose Single Event Effects (SEE). combination Rdson gate charge reduces power losses switching applications such converters motor control. These devices retain well established advantages MOSFETs such voltage control, fast switching, ease paralleling temperature stability electrical parameters.
TO-254AA
Features:
Single Event Effect (SEE) Hardened RDS(on) Total Gate Charge Simple Drive Requirements Ease Paralleling Hermetically Sealed Ceramic Package Light Weight
Absolute Maximum Ratings
Parameter
12V, 25°C 12V, 100°C 25°C dv/dt Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight *Current limited package footnotes refer last page
Pre-Irradiation
Units
W/°C
V/ns
(0.063 in.(1.6mm) from case 10s) (Typical)
www.irf.com
05/16/06
IRHM7064, JANSR2N7431
Pre-Irradiation
Electrical Characteristics 25°C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage Temperature Coefficient Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage Forward Transconductance IDSS Zero Gate Voltage Drain Current
Units
0.056 0.021 -100 V/°C
Test Conditions
1.0mA Reference 25°C, 1.0mA 12V, VGS, 1.0mA 15V, VDS= ,VGS=0V 48V, 125°C -20V =12V, =30V, =12V, 2.35
IGSS IGSS td(on) td(off)
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
Measured from Drain lead (6mm /0.25in
Total Inductance
from package) Source lead (6mm /0.25in. from package) with Source wires internally bonded from Source Drain
Ciss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
4900 2800
1.0MHz
Source-Drain Diode Ratings Characteristics
Parameter
Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Units
Test Conditions
25°C, 35A, 25°C, 35A, di/dt 100A/µs
Intrinsic turn-on time negligible. Turn-on speed substantially controlled
*Current limited package
Thermal Resistance
Parameter
RthJC RthJA RthCS Junction-to-Case Junction-to-Ambient Case-to-Sink
Units
0.50 0.21
°C/W
Test Conditions
Typical socket mount
Note: Corresponding Spice Saber models available International Rectifier Website. footnotes refer last page
www.irf.com
Radiation Characteristics Pre-Irradiation
IRHM7064, JANSR2N7431
International Rectifier Radiation Hardened MOSFETs tested verify their radiation hardness capability. hardness assurance program International Rectifier comprised radiation environments. Every manufacturing tested total ionizing dose (per notes using TO-3 package. Both pre- post-irradiation performance tested specified using same drive circuitry test conditions order provide direct comparison.
Table Electrical Characteristics 25°C, Post Total Dose Irradiation
Parameter
BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-3) Static Drain-to-Source On-State Resistance (TO-254AA) Diode Forward Voltage
500K Rads(Si)1 1000K Rads (Si)2
Units
Test Conditions
1.0mA 1.0mA VDS=48V, 12V, =35A 12V, =35A
-100 0.021 0.021
1.25
-100 0.030 0.030
Part numbers IRHM7064 IRHM4064 (JANSG2N7431) Part number IRHM8064 (JANSH2N7431U)
International Rectifier radiation hardened MOSFETs have been characterized heavy environment Single Event Effects (SEE). Single Event Effects characterization illustrated Fig. Table
Table Single Event Effect Safe Operating Area
(MeV/(mg/cm2)) 36.8 59.9 Energy (MeV) Range (µm) @VGS=0V @VGS=-5V @VGS=-10V @VGS=-15V 32.8 @VGS=-20V
Single Event Effect, Safe Operating Area
footnotes refer last page
www.irf.com
IRHM7064, JANSR2N7431
Pre-Irradiation
1000
Drain-to-Source Current
Drain-to-Source Current
9.0V 8.0V 7.0V 6.0V BOTTOM 5.0V
1000
9.0V 8.0V 7.0V 6.0V BOTTOM 5.0V
20µs PULSE WIDTH 5.0V
Drain-to-Source Voltage
5.0V 20µs PULSE WIDTH
Drain-to-Source Voltage
Typical Output Characteristics
Typical Output Characteristics
1000
RDS(on) Drain-to-Source Resistance (Normalized)
Drain-to-Source Current
20µs PULSE WIDTH
Gate-to-Source Voltage
Junction Temperature
Typical Transfer Characteristics
Normalized On-Resistance Temperature
www.irf.com
Pre-Irradiation
IRHM7064, JANSR2N7431
10000
8000
Gate-to-Source Voltage
1MHz Ciss SHORTED Crss Coss
Capacitance (pF)
6000
Ciss Coss
4000
2000
Crss
TEST CIRCUIT FIGURE
Drain-to-Source Voltage
Total Gate Charge (nC)
Typical Capacitance Drain-to-Source Voltage
Typical Gate Charge Gate-to-Source Voltage
1000
1000
Reverse Drain Current
OPERATION THIS AREA LIMITED RDS(on)
Drain Current
100us
Single Pulse
10ms 1000
,Source-to-Drain Voltage
Drain-to-Source Voltage
Typical Source-Drain Diode Forward Voltage
Maximum Safe Operating Area
www.irf.com
IRHM7064, JANSR2N7431
Pre-Irradiation
LIMITED PACKAGE
Drain Current
D.U.T.
Pulse Width Duty Factor
10a. Switching Time Test Circuit
Case Temperature
td(on) d(off)
Maximum Drain Current Case Temperature
10b. Switching Time Waveforms
Thermal Response thJC
0.50 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) Notes: Duty factor Peak thJC 0.0001 0.001 0.01
0.01
0.001 0.00001
Rectangular Pulse Duration (sec)
Maximum Effective Transient Thermal Impedance, Junction-to-Case
www.irf.com
Pre-Irradiation
IRHM7064, JANSR2N7431
1400
Single Pulse Avalanche Energy (mJ)
BOTTOM
1200 1000
DRIVER
D.U.T
0.01
12a. Unclamped Inductive Test Circuit
V(BR)DSS
Starting Junction Temperature
12c. Maximum Avalanche Energy Drain Current
12b. Unclamped Inductive Waveforms
Current Regulator Same Type D.U.T.
.2µF .3µF
D.U.T.
Charge
Current Sampling Resistors
13a. Basic Gate Charge Waveform
13b. Gate Charge Test Circuit
www.irf.com
IRHM7064, JANSR2N7431
Pre-Irradiation
Foot Notes:
Repetitive Rating; Pulse width limited
maximum junction temperature. 25V, starting 25°C, L=0.82mH Peak 35A, =12V 35A, di/dt 220A/µs, 60V, 150°C
Pulse width Duty Cycle Total Dose Irradiation with Bias.
volt applied during irradiation MIL-STD-750, method 1019, condition Total Dose Irradiation with Bias. volt applied during irradiation MlL-STD-750, method 1019, condition
Case Outline Dimensions TO-254AA
0.12 [.005] 3.78 [.149] 3.53 [.139] 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040]
17.40 [.685] 16.89 [.665]
20.32 [.800] 20.07 [.790]
13.84 [.545] 13.59 [.535]
3.81 [.150]
1.14 [.045] 0.89 [.035] 0.36 [.014]
ASSIGNMENTS DRAIN SOURCE GATE
3.81 [.150]
127(6
DIMENSIONING TOLERANCING ASME Y14.5M-1994. DIMENSIONS SHOWN MILLIMETERS [INCHES]. CONTROLLING DIMENSION: INCH. CONFORMS JEDEC OUTLINE TO-254AA.
CAUTION BERYLLIA WARNING MIL-PRF-19500 Package containing beryllia shall ground, sandblasted, machined, have other operations performed them which will produce beryllia beryllium dust. Furthermore, beryllium oxide packages shall placed acids that will produce fumes containing beryllium.
WORLD HEADQUARTERS: Kansas St., Segundo, California 90245, Tel: (310) 252-7105 LEOMINSTER Crawford St., Leominster, Massachusetts 01453, Tel: (978) 534-5776 Fax: (310) 252-7903 Visit www.irf.com sales contact information. Data specifications subject change without notice. 05/2006
www.irf.com

Other recent searches


SOJ40 - SOJ40   SOJ40 Datasheet
SA-110 - SA-110   SA-110 Datasheet
MX98704 - MX98704   MX98704 Datasheet
MCP1754 - MCP1754   MCP1754 Datasheet
MCP1754S - MCP1754S   MCP1754S Datasheet
LTC1422 - LTC1422   LTC1422 Datasheet
HD74HC149 - HD74HC149   HD74HC149 Datasheet
HD74HC148 - HD74HC148   HD74HC148 Datasheet
HD74HC138 - HD74HC138   HD74HC138 Datasheet
APT75GT120JU3 - APT75GT120JU3   APT75GT120JU3 Datasheet

 

Privacy Policy | Disclaimer
© 2012 Datasheet Archive