Wideband Pre-amplifier Description CXA3199TN wideband Pre-amplifi
|
|
|
Top Searches for this datasheet
CXA3199TN
Wideband Pre-amplifier
Description CXA3199TN wideband Pre-amplifier head. Features Operate single +3.3 power supply power consumption Read Ultra small package Wideband (typ) Read amplifier emitter follower output featuring times gain (typ). input capacitance input noise 0.65 Read data outputs high impedance Power Saving Mode Structure Bipolar silicon monolithic TSSOP (Plastic)
Absolute Maximum Ratings (Ta=25 Supply voltage Operating temperature Topr Storage temperature Tstg +150 Allowable power dissipation board) 1000 Operating Conditions Supply voltage
Block Diagram Configuration
Sony reserves right change products specifications without prior notice. This information does convey license implication otherwise under patents other right. Application circuits shown, any, typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits.
E98221A2Z-TE
CXA3199TN
Description Symbol
Equivalent circuit
Description
Head.
100k
Read amplifier output.
100k
100k 1.6V
Power Save signal input.
100k 100k
1.6V
Power Save signal input.
CXA3199TN
Electrical Characteristics Item Current consumption read Current consumption chip disenable Digital input "Low" input voltage Digital input "High" input voltage Digital input "Low" input current Digital input "High" input current Read amplifier differential voltage gain Frequency band width Input referred noise voltage Common mode rejection ratio Supply voltage rejection ratio Read data output offset voltage Read Chip disenable read Differential input capacitance Differential input resistance Output resistance Read data output sink current Symbol ICCR ICCXCE CMRR PSRR VOFFR Isink
(Unless otherwise specified, VCC=3.3 Ta=25 Test condition Min. Typ. 13.5 Max. 19.5 -100 0.65 -300 10.0 20.0 35.0 Unit.
applied voltage: applied voltage: Input voltage mVp-p, Frequency which lower Head impedance Common input voltage mVp-p, Ripple voltage mVp-p, VOFFR=VRDX-VRDY, version
Guaranteed until Ta=70°C
CXA3199TN
Test Circuit
50MHz
3.3V
0.1µ
3.3V 3.3V
0.1µ
0.1µ
Test Circuit
3.3V
CXA3199TN
Timing Chart
Description Functions Pre-amplifier This noise amplifier amplifying signals from heads with emitter follower output. outputs differential amplifier whose polarity between side head input same. Mode control mode shown Table XCE. Mode Read Power saving
Table Mode selection
CXA3199TN
Application Circuit
3.3V
Application circuits shown typical examples illustrating operation devices. Sony cannot assume responsibility problems arising these circuits infringement third party patent other right same.
CXA3199TN
Normalized current consumption read Supply voltage (Ta=25°C) 1.12
Normalized current consumption read Ambient temperature (VCC=3.3V)
1.06 1.04 1.02 0.98 0.96
ICCR/ICCR (Ta=25.0°C)
ICCR/ICCR (VCC=3.3V)
1.08
1.05
0.95
-25.0
25.0
50.0
75.0
Supply voltage Normalized current consumption power save Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized current consumption power save Ambient temperature (VCC=3.3V)
Iccps/Iccps (Ta=25.0°C)
Iccps/Iccps (VCC=3.3V)
1.05
0.95
-25.0
25.0
50.0
75.0
Supply voltage Normalized read data output sink current Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized read data output sink current Ambient temperature (VCC=3.3V)
1.08
Isink/Isink (VCC=3.3V)
1.06 1.04 1.02 0.98 0.96
Isink/Isink (Ta=25.0°C)
1.05
0.95
-25.0
25.0
50.0
75.0
Supply voltage
Ambient temperature [°C]
CXA3199TN
Normalized read amplifier differential voltage gain Supply voltage (Ta=25°C) 1.08 1.06 1.04 1.02 0.98 0.96 1.02 1.04
Normalized read amplifier differential voltage gain Ambient temperature (VCC=3.3V)
AV/AV (Ta=25.0°C)
AV/AV (VCC=3.3V)
0.98
0.96 -25.0
25.0
50.0
75.0
Supply voltage Normalized frequency band width (-3dB) Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized frequency band width (-3dB) Ambient temperature (VCC=3.3V)
1.06 1.04 1.02 0.98 0.96 0.94 0.92
1.05
BW/BW (Ta=25.0°C)
BW/BW (VCC=3.3V)
0.95
-25.0
25.0
50.0
75.0
Supply voltage Normalized input referred noise voltage Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized input referred noise voltage Ambient temperature (VCC=3.3V)
1.06
1.04 1.05 1.02
EN/EN (Ta=25.0°C)
EN/EN (VCC=3.3V)
0.98
0.95 0.96
0.94
-25.0
25.0
50.0
75.0
Supply voltage
Ambient temperature [°C]
CXA3199TN
Normalized common mode rejection ratio Supply voltage (Ta=25°C)
1.04
Normalized common mode rejection ratio Ambient temperature (VCC=3.3V)
CMRR/CMRR (Ta=25.0°C)
CMRR/CMRR (VCC=3.3V)
1.15
1.02
1.05
0.98
0.95
0.96 -25.0
25.0
50.0
75.0
Supply voltage Normalized power supply rejection ratio Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized power supply rejection ratio Ambient temperature (VCC=3.3V)
1.15
1.04
PSRR/PSRR (Ta=25.0°C)
PSRR/PSRR (VCC=3.3V)
1.02
1.05
0.98
0.95
0.96 -25.0
25.0
50.0
75.0
Supply voltage Normalized differential input capacitance Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized differential input capacitance Ambient temperature (VCC=3.3V)
1.15
1.04
1.02 1.05
CIN/CIN (Ta=25.0°C)
CIN/CIN (VCC=3.3V)
0.95
0.98
0.85
0.96 -25.0
25.0
50.0
75.0
Supply voltage
Ambient temperature [°C]
CXA3199TN
Normalized differential input resistance Supply voltage (Ta=25°C) 1.04 1.15
Normalized differential input resistance Ambient temperature (VCC=3.3V)
1.03
RIN/RIN (Ta=25.0°C)
RIN/RIN (VCC=3.3V)
1.02
1.05
1.01
0.95
0.99
0.98
0.85 -25.0
25.0
50.0
75.0
Supply voltage Normalized output resistance Supply voltage (Ta=25°C)
Ambient temperature [°C] Normalized output resistance Ambient temperature (VCC=3.3V)
1.03
1.02
1.01
RRD/RRD (Ta=25.0°C)
1.05
RRD/RRD (VCC=3.3V)
0.99
0.95 0.98
0.97
-25.0
25.0
50.0
75.0
Supply voltage
Ambient temperature [°C]
-10-
CXA3199TN
Package Outline
Unit
10PIN TSSOP(PLASTIC)
1.2MAX
0.15 0.05
0.25
0.08 0.22 0.07
(0.2) 0.08 0.22 0.07
DETAIL
NOTE: Dimension does include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g
10PIN TSSOP(PLASTIC)
1.2MAX
(0.1) 0.025 0.12 0.015
0.15 0.05 0.25 DETAIL
EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g
0.08 0.22 0.07
(0.2) 0.08 0.22 0.07
NOTE: Dimension does include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS
LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm
-11-
(0.1) 0.025 0.12 0.015
0.45 0.15
0.45 0.15
Sony Corporation
Other recent searches
PL-2515PRO - PL-2515PRO PL-2515PRO Datasheet
MS5535B - MS5535B MS5535B Datasheet
HY62V8100A- - HY62V8100A- HY62V8100A- Datasheet
HY62U8100A- - HY62U8100A- HY62U8100A- Datasheet
CDC1631F-E - CDC1631F-E CDC1631F-E Datasheet
74LV107 - 74LV107 74LV107 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
