Type: ALIVH layer structure Multilayer Printed Wiring Board
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Series:ALIVH
Type:
ALIVH
layer structure Multilayer Printed Wiring Board adopts base material made woven glass-epoxy resin. have higher hardness excellent bond strength than that made nonwoven aramid.
Features
Higher adhesion strength between land base material higher flexural modulus with glass cloth. Flammability UL94V-0 with Halogen-free flame retardants. High heat resistance lead free soldering. Smaller, higher density wiring with ALIVH technology. Easy design, shorter design lead time.
Properties Characteristics
Items Hole Size Size Line/Space Thickness Board Dielectric Constant(1 GHz) Unit 100/100 (min. 60/90) Layers 0.80 Layers 0.60 0.01 Compared ALIVH) Compared ALIVH)
N/2mm1
Recommended Applications
Mobile phone Digital Still Camera Personal Digital Assistance Notebook type Personal Computer
Dissipation factor(1 GHz) Flexural modulus Land adhesion strength
Recognized Standards
Standard (File E36779) Base Type EBKN7 Flammability 94V-0 ANSI Grade FR-4 min. Width (mm) 0.025 Conductor min. Edge Width (mm) 0.051 max. Width (mm) 19.8 Soldering Limits 270, Rated Temp.
These values designing.
Benefit Layer Structure
layer structure Areas conventional through hole utilized wiring. Surface fully utilized mounting.
Concept
interconnection
Hole Processing
Conductive paste
Uniform specification layers
CO2Laser
Base material
Woven glass-epoxy resin
Design, Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety arises from this product, please inform immediately technical consultation without fail.
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