ALIVH Layer structure Multilayer Printed Wiring Board adopts base

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ALIVH Layer structure Multilayer Printed Wiring Board adopts base

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Series:ALIVH Type:
ALIVH
Layer structure Multilayer Printed Wiring Board adopts base material made nonwoven aramid interconnects between arbitrary layers filling small hole formed laser with copper paste. Industrial Property Patent
Properties
Base Material
Non-woven aramid fabric-epoxy resin
Features
Smaller, lighter, higher density wiring. Easier design shorter total design time.
Thickness Board (standard) Hole Size Size Line/Space Dielectric Constant (1GHz) Density
g/mL
Layer:0.95 Layer:0.70 min.150 min.300 min.60/70
Recommended Applications
Mobile phone Note book type card Digital still camera
Recognized Standards
Standard (File E36779) Base Type EBKN2 EBKN1 Flammability 94V-0 94V-0 ANSI Grade min. Width (mm) 0.025 0.025 Conductor min. Edge Width (mm) 0.051 0.051 max. Width (mm) 19.8 19.8 Soldering Limits 270, 260, Rated Temp.
These values designing.
nBenefit Layer Structure Conventional
Through-hole Structure
Solder
ALIVH
Layer Structure
Device
Through-hole Interstitial hole
Unable package through-hole
Enable package almost surface
Design, Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety arises from this product, please inform immediately technical consultation without fail.

ALIVH Layer structure Multilayer Printed Wiring Board adopts base

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