Printed Wiring Board Printed Wiring Board with Through-holes Mult
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Series:Multilayer Type: Multilayer
Printed Wiring Board Printed Wiring Board with Through-holes
Multilayer Both surface Conductive layers internal conductive layers connected plated through-holes Industrial Property; Patent Registered Type:
Multilayer Printed Wiring Board with Through-holes IVHs
Multilayer Printed Wiring Board with IVHs electrically interconnects between layer conductors with non-through holes under chip land Industrial Property; Patent Registered Type:
Build-Up
Build-up Printed Wiring Board Multilayer manufactured build-up process that piled progressively with conductor layers insulating layers using techniques such plating printing.
Features
Suitable high density surface mounting Smaller board size reducing through holes Noise reduction shortening wiring length
Recommended Applications
Recognized Standards
Camcorder, Head phone stereo Mobile phone, PHS, Pager, Electronic notebook Notebook type card Module
Standard (File E36779)
Multilayer Printed Wiring Board with Through-holes
Base Type EMMM1 EMMM2 Flammability 94V-0 94V-0 ANSI Grade FR-4 FR-4 Base Type EMMM3 Flammability 94V-0 ANSI Grade FR-4 min. Width (mm) 0.05 min. Width (mm) 0.05 0.05
Conductor min. Edge Width (mm) 0.15 0.15 Conductor min. Edge Width (mm) 0.15 max. Width (mm) max. Width (mm)
Soldering Limits 260,
Rated Temp.
These values designing. Multilayer Printed Wiring Board Halogen-free
Soldering Limits 260,
Rated Temp.
These values designing. Build-up printed Wiring Board
Base Type EMMM5 Flammability 94V-0 ANSI Grade min. Width (mm) 0.05
Conductor min. Edge Width (mm) 0.05 max. Width (mm)
Soldering Limits 260,
Rated Temp.
These values designing.
Construction
Type:Multilayer Printed Wiring Board with Through-holes Internal layer Plated through-hole (Component hole) Conductive pattern Type:Build-Up hole(Laser Drilling) hole(Drilling) Conductive pattern Base
Plated through-hole (Via hole) Type:Multilayer Printed Wiring Board with Through-holes IVHs
Plated through-hole Interstitial hole(IVH) (Component hole) Internal layer Insulation layer
Internal layer
Conductive pattern
Design, Specifications subject change without notice. factory technical specifications before purchase and/or use. Whenever doubt about safety arises from this product, please inform immediately technical consultation without fail.
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