device type 01-07-26 MONNIN Make changes +IIN tests spe

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

device type 01-07-26 MONNIN Make changes +IIN tests spe

Datasheet Thumbnail

Top Searches for this datasheet

REVISIONS DESCRIPTION Make change VTHUV test specified under table DATE (YR-MO-DA) 00-03-07 APPROVED MONNIN
device type
01-07-26
MONNIN
Make changes +IIN tests specified table
01-12-14
MONNIN
Make change high side floating supply offset voltage limit device type specified under 1.4.
02-04-17
MONNIN
logic diagram device type
03-04-15
MONNIN
SHEET SHEET STATUS SHEETS PMIC SHEET PREPARED RICK OFFICER CHECKED RAJESH PITHADIA
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE AMSC
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil MICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH FREQUENCY HALF BRIDGE DRIVER, MONOLITHIC SILICON
APPROVED RAYMOND MONNIN DRAWING APPROVAL DATE 99-06-29 REVISION LEVEL
SIZE SHEET
CAGE CODE
67268
5962-99536
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E332-03
SCOPE Scope. This drawing documents three product assurance class levels consisting high reliability (device classes space application (device class appropriate satellite similar applications (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. device class user encouraged review manufacturer's Quality Management (QM) plan part their evaluation these parts their acceptability intended application. PIN. shown following example: 5962 99536
Federal stock class designator
designator (see 1.2.1) Drawing number
Device type (see 1.2.2)
Device class designator (see 1.2.3)
Case outline (see 1.2.4)
Lead finish (see 1.2.5)
1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) identify circuit function follows: Device type Generic number HS-2100RH IS-2100ARH Circuit function radiation hardened, dielectric isolated high frequency half bridge driver radiation hardened, dielectric isolated high frequency half bridge driver
1.2.3 Device class designator. device class designator single letter identifying product assurance level follows: Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535 Certification qualification MIL-PRF-38535 with performance specified device manufacturers approved quality management plan.
1.2.4 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator CDFP4-F16 Terminals Package style Flat pack
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Absolute maximum ratings. High side floating supply voltage (VB): Device type -0.3 Device type -0.3 High side floating supply offset voltage (VS) High side floating output voltage (VHO) side fixed supply voltage (VCC) -0.3 side output voltage (VLO) Logic supply voltage (VDD) Logic input voltage (HIN, LIN, pins) +0.3 slew rate (dVS dt): Device type maximum Device type maximum (low driver return) offset Device type Device type Maximum power dissipation (PD) +25°C) Lead temperature (soldering, seconds) +300°C Junction temperature (TJ) +175°C Storage temperature range -55°C +150°C Thermal resistance, junction-to-case (JC) 18°C/W Thermal resistance, junction-to-ambient (JA) 90°C/W Recommended operating conditions. High side floating supply absolute voltage (VB) High side floating supply offset voltage (VS): Device type Device type High side floating output voltage (VHO) side fixed supply (VCC) side output voltage (VLO) Logic supply voltage (VDD)
Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. voltage parameters absolute voltages referenced VSS. Logic operational must remain minimum above (ground). This device recommended they should tied together board level. have different values both must remain within range. side undervoltage monitors differential.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Recommended operating conditions continued. Logic supply return (VSS) (low driver return) offset Logic input voltage (VIN) Ambient operating temperature range (TA) -55°C +125°C Radiation features: Maximum total dose available (dose rate rads (Si) Device classes Rads Device class Rads Latch None Single event upset None
APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings. Standard Microcircuit Drawings. Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.)
must remain range. input buffers designed accept logic level inputs while running range. Latch immune dielectric isolation technology. Error detection correction high side latch guarantees single event latch upset.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix specified herein. 3.1.1 Microcircuit die. requirements microcircuit die, appendix this document. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class 3.2.1 Case outline. case outline shall accordance with 1.2.4 herein. 3.2.2 Terminal connections. terminal connections shall specified figure 3.2.3 Logic diagram. logic diagram shall specified figure 3.2.4 Irradiation test connections. irradiation test connections shall specified figure Electrical performance characteristics post irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post irradiation parameter limits specified table shall apply over full ambient operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table IIA. electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix 3.5.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MILHDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein. Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-PRF-38535, appendix Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.10 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
TABLE Electrical performance characteristics. Test Symbol Test conditions -55°C +125°C unless otherwise specified IOUT VBIAS level output voltage Offset supply leakage current IOUT Quiescent supply current Quiescent supply current Quiescent supply current (inputs low) Logic input bias current +IIN Logic input bias current under-voltage lockout threshold under-voltage lockout threshold Hystersis Output high short circuit pulsed current +IOUT VOUT 1,2,3 -IOUT VOUT VTHUVs 1,2,3 2000 -IIN VTHUV 1,2,3 1,2,3 1,2,3 01,02 01,02 12.0 IQDD inputs 1,2,3 01,02 2900 IQCC 1,2,3 01,02 1,2,3 1,2,3 1,2,3 01,02 01,02 Group subgroup Device type Limits Unit
Logic input voltage Logic input voltage High level output voltage 1,2,3 1,2,3 1,2,3 01,02 01,02 01,02
footnotes table.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
TABLE Electrical performance characteristics Continued. Conditions -55°C +125°C unless otherwise specified
Test
Symbol
Group subgroups 9,10,11
Device type
Limits -200 -100
Unit
side turn-off propagation delay
TLoff
High side turn-off propagation delay
THoff
9,10,11
side turn-on propagation delay
TLon
9,10,11
High side turn-on propagation delay
THon
9,10,11
side shutdown propagation delay
TLsd
9,10,11
High side shutdown propagation delay
THsd
9,10,11
Either output rise/fall time
9,10,11
Dead time turn-off turn-on
DHton
9,10,11
Dead time turn-off turn-on
DLton
9,10,11
Turn-on propagation delay matching
Mton
9,10,11
footnotes table.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
TABLE Electrical performance characteristics Continued. Test Symbol Test conditions -55°C +125°C unless otherwise specified Group subgroup Device type Limits Unit
Turn-off propagation delay matching Mtoff 9,10,11 -150
Devices supplied this drawing meet levels irradiation (classes levels class However, this device only tested level (classes only tested level class (see herein). post irradiation values identical unless otherwise specified table When performing post irradiation electrical measurements level, +25°C. Unless otherwise specified, VBIAS (VCC, VDD) VIN, VTH, parameters referenced applicable three logic inputs. parameters referenced output (LO) high output (HO).
Unless otherwise specified, VBIAS (VCC, VDD) 1000 figure device type DHton THon TLoff DLton TLon THoff device type DHton THon TLoff DLton TLon THoff
Mton TLon THon Mtoff TLoff THoff
QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan, including screening (4.2), qualification (4.3), conformance inspection (4.4). modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535 device manufacturer's plan, including screening, qualification, conformance inspection. performance envelope reliability information shall specified manufacturer's plan. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. device class screening shall accordance with device manufacturer's Quality Management (QM) plan, shall conducted devices prior qualification technology conformance inspection.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Device types Case outline Terminal number connection
01,02 Terminal symbol
FIGURE Terminal connections.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Device type
FIGURE Logic diagram.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Device type
FIGURE Logic diagram continued.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Device types
FIGURE Irradiation circuit.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Device types
FIGURE Switching time test circuit.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
4.2.1 Additional criteria device class Burn-in test, method 1015 MIL-STD-883. Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. +125°C, minimum. Interim final electrical test parameters shall specified table herein.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. device classes interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF-38535, appendix modified device manufacturer's Quality Management (QM) plan.
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Qualification inspection device class shall accordance with device manufacturer's Quality Management (QM) plan. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF-38535, specified plan, including groups inspections specified herein. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4). Technology conformance inspection class shall accordance with device manufacturer's Quality Management (QM) plan. 4.4.1 Group inspection. Tests shall specified table herein. Subgroups table method 5005 MIL-STD-883 shall omitted.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
TABLE IIA. Electrical test requirements. Test requirements Subgroups accordance with MIL-STD-883, method 5005, table Device class Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group test requirements (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) 1,2,3,9,10,11 1,2,3,9,10,11 1,2,3,9,10,11 Device class 1,2,3,9, 10,11 1,2,3,9,10,11 1,2,3,9,10,11 Subgroups accordance with MIL-PRF-38535, table III) Device class 1,2,3,9, 10,11 1,2,3,9,10,11 1,2,3,9, 10,11 specified plan Device class
applies subgroups applies subgroups Delta limits specified table herein shall required where specified, delta values shall completed with reference zero hour electrical parameters (see table
TABLE IIB. Burn-in operating life test, Delta parameters (+25°C). Parameters Device type Device type
Delta limits IQDD ±100 ±150 ±100
These parameters shall recorded before after required burn-in life test determine delta limits. 4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. +125°C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. 4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). levels device classes shall specified MIL-PRF-38535 end-point electrical parameters shall specified table herein. 4.4.4.1 Group inspection device class device class requirements shall accordance with class radiation requirements MIL-PRF-38535. end-point electrical parameters class devices shall specified table Group subgroups, modified plan. 4.4.4.2 Total dose irradiation testing. Total dose irradiation testing shall performed accordance with MIL-STD-883 method 1019, condition specified herein. device class total dose requirements shall accordance with class radiation requirements MIL-PRF-38535 (see herein). 4.4.4.2.1 Accelerated aging testing. Accelerated aging testing shall performed devices requiring level greater than rads (Si). post-anneal end-point electrical parameter limits shall specified table herein shall pre-irradiation end-point electrical parameter limits 25°C ±5°C. Testing shall performed initial qualification after design process changes which affect response device. PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA Columbus, Ohio 43216-5000, telephone (614) 692-0547.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535, MIL-HDBK-1331, herein. Logic supply Logic input high side gate driver output (HO), phase Logic input shutdown Logic input side gate driver output (LO), phase Logic ground High side floating supply High side gate drive output High side floating supply return side supply side gate drive output side return
Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536
SCOPE 10.1 Scope. This appendix establishes minimum requirements microcircuit supplied under Qualified Manufacturers List (QML) Program. microcircuit meeting requirements MIL-PRF-38535 manufacturers approved plan monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, devices using chip wire designs accordance with MIL-PRF-38534 specified herein. product assurance classes consisting military high reliability (device class space application (device Class reflected Part Identification Number (PIN). When available choice Radiation Hardness Assurance (RHA) levels reflected PIN. 10.2 PIN. shown following example: 5962 Federal stock class designator designator (see 10.2.1) Drawing number 10.2.1 designator. Device classes identified shall meet MIL-PRF-38535 specified levels. dash indicates non-RHA die. 10.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type 10.2.3 Device class designator. Device class Device requirements documentation Certification qualification requirements MIL-PRF-38535 Generic number HS-2100RH IS-2100ARH Circuit function radiation hardened, high frequency half bridge driver radiation hardened, high frequency half bridge driver 99536 Device type (see 10.2.2) Device class designator (see 10.2.3) code Details (see 10.2.4)
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536 10.2.4. Details. details designation shall unique letter which designates die's physical dimensions, bonding location(s) related electrical function(s), interface materials, other assembly related information, each product variant supplied this appendix. 10.2.4.1 physical dimensions. type 10.2.4.2. bonding locations electrical functions. type 10.2.4.3. Interface materials. type 10.2.4.4. Assembly related information. type Figure number Figure number Figure number Figure number
10.3. Absolute maximum ratings. paragraph within body this drawing details. 10.4 Recommended operating conditions. paragraph within body this drawing details.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536 APPLICABLE DOCUMENTS. 20.1 Government specifications, standards, handbooks. Unless otherwise specified, following specification, standard, handbook issue listed that issue Department Defense Index Specifications Standards specified solicitation, form part this drawing extent specified herein. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 HANDBOOK DEPARTMENT DEFENSE MIL-HDBK-103 List Standard Microcircuit Drawings. (Copies specification, standard, handbook required manufacturers connection with specific acquisition functions should obtained from contracting activity directed contracting activity). 20.2. Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. REQUIREMENTS 30.1 Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall effect form, function described herein. 30.2 Design, construction physical dimensions. design, construction physical dimensions shall specified MIL-PRF-38535 manufacturer's plan, device classes herein. 30.2.1 physical dimensions. physical dimensions shall specified 10.2.4.1 figure A-1. 30.2.2 bonding locations electrical functions. bonding locations electrical functions shall specified 10.2.4.2 figure A-1. 30.2.3 Interface materials. interface materials shall specified 10.2.4.3 figure A-1. 30.2.4 Assembly related information. assembly related information shall specified 10.2.4.4 figure A-1. 30.2.5 Radiation exposure circuit. radiation exposure circuit shall defined within paragraph 3.2.4 body this document. Test Method Standard Microcircuits.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536 30.3 Electrical performance characteristics post-irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post-irradiation parameter limits specified table body this document. 30.4 Electrical test requirements. wafer probe test requirements shall include functional parametric testing sufficient make packaged capable meeting electrical performance requirements table 30.5 Marking. minimum, each unique die, loaded single multiple stack carriers, shipment customer, shall identified with wafer number, certification mark, manufacturer's identification listed 10.2 herein. certification mark shall "QML" required MIL-PRF-38535. 30.6 Certification compliance. device classes certificate compliance shall required from QML38535 listed manufacturer order supply requirements this drawing (see 60.4 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this appendix shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 requirements herein. 30.7 Certificate conformance. certificate conformance required device classes MIL-PRF-38535 shall provided with each microcircuit delivered this drawing. QUALITY ASSURANCE PROVISIONS 40.1 Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modifications plan shall effect form, function described herein. 40.2 Screening. device classes screening shall accordance with MIL-PRF-38535, defined manufacturer's plan. minimum shall consist Wafer acceptance Class product using criteria defined within MIL-STD-883 test method 5007. 100% wafer probe (see paragraph 30.4). 100% internal visual inspection applicable class criteria defined within MIL-STD-883 test method 2010 alternate procedures allowed within MIL-STD-883 test method 5004.
40.3 Conformance inspection. 40.3.1 Group inspection. Group inspection required only parts intended identified radiation assured (see 30.5 herein). levels device classes shall specified MIL-PRF-38535. point electrical testing packaged shall specified table herein. Group tests conditions specified within paragraphs 4.4.4.2 4.4.4.2.1. CARRIER 50.1 carrier requirements. requirements carrier shall accordance with manufacturer's plan specified purchase order acquiring activity. carrier shall provide adequate physical, mechanical electrostatic protection.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536 NOTES 60.1 Intended use. Microcircuit conforming this drawing intended microcircuits built accordance with MIL-PRF-38535 MIL-PRF-38534 government microcircuit applications (original equipment), design applications logistics purposes. 60.2 Comments. Comments this appendix should directed DSCC-VA, Columbus, Ohio, 43216-5000 telephone (614)-692-0536. 60.3 Abbreviations, symbols definitions. abbreviations, symbols, definitions used herein defined within MIL-PRF-38535 MIL-STD-1331. 60.4 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed within QML-38535 have submitted certificate compliance (see 30.6 herein) DSCC-VA have agreed this drawing.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536 Device type
bonding locations electrical functions physical dimensions. size: 4710 microns 3570 microns thickness: mils mils Interface materials. metallization: 16.0 Backside metallization: None Glassivation. Type: Thickness: ±1.0 Substrate: Dielectric Isolation (DI) Assembly related information. Substrate potential: Insulator Special assembly instructions: None FIGURE A-1. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
APPENDIX APPENDIX FORMS PART 5962-99536 Device type
bonding locations electrical functions physical dimensions. size: 4820 microns 3300 microns thickness: mils mils Interface materials. metallization: 16.0 Backside metallization: None Glassivation. Type: Thickness: ±1.0 Substrate: Dielectric Isolation (DI) Assembly related information. Substrate potential: Insulator Special assembly instructions: None FIGURE A-2. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-99536
SHEET
STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 03-04-15 Approved sources supply 5962-99536 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML-38535.
Standard microcircuit drawing 5962F9953601QXC 5962R9953601TXC 5962F9953601VXC 5962F9953601V9A 5962F9953602QXC 5962F9953602VXC 5962F9953602V9A
Vendor CAGE number 34371 34371 34371
Vendor similar HS9-2100RH-8 HS9-2100RH-T HS9-2100RH-Q HS0-2100RH-Q IS9-2100ARH-8 IS9-2100ARH-Q IS0-2100ARH-Q
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. longer available from approved source supply. Vendor CAGE number 34371 Vendor name address Intersil Corporation P.O. Melbourne, 32902-0883
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin.

device type 01-07-26 MONNIN Make changes +IIN tests spe

Top Searches for this datasheet

Other recent searches